Abstract: An electronic component transferring apparatus for transferring electronic components, including at least one movable member, a movable-member moving device which moves the movable member, a rotary head which is supported by the movable member such that the rotary head is rotatable about an axis line thereof, a plurality of component holders which are supported by the rotary head such that the component holders are provided along a circle whose center is positioned on the axis line of the rotary head, a drive source which is supported by the movable member and which provides a motion, and a motion transmitting device which is selectively operable in a component-holder selecting state in which the motion transmitting device transmits the motion of the drive source to the rotary head, to rotate the rotary head about the axis line thereof and thereby position one of the component holders at an operating position in which the one component holder holds one of the electronic components, and in a component-holder r

Abstract: A method for mounting an integrated circuit includes a plurality of solder balls arrayed on the bottom surface of a package of the integrated circuit onto to a circuit board. These solder balls provide for surface mounting of the integrated circuit to a circuit board by solder reflow. The array of solder balls can be planarized so that each of the plural solder balls participate in defining a truly planar solder ball contact array for the integrated circuit package. Methods of manufacturing the integrated circuit with a package having planarized solder balls in an array dependent from a bottom surface thereof are set forth. The truly planarized solder ball contact array of the integrated circuit package affords nearly absolute reliability in forming of surface-mount electrical connections between the integrated circuit package and the circuit board on which the package is to mount.

Abstract: An object of the present invention is to offer a component suction head for electronic component mounting machines which is capable of securely holding electronic components by suction and smoothly mounting them on printed wiring boards without dislocation. To achieve the objective, the component suction head of the present invention comprises the following. A suction nozzle unit 24 has a suction face 33 at the center of its tip, for holding electronic component 10, and a through hole 27 formed at its center which leads to the suction face 33. The back end of the through hole 27 is connected to a vacuum generator. An elastic ring 32 is fitted and fixed around the through hole 27 to the tip of the suction nozzle unit 24, slightly protruding from the suction face 33. An ejector pin 28, which can protrude from the suction face 33 for a specified length, forms an intake passage 38 from the tip to the through hole 27, and is fitted to the through hole 27 in sliding fashion.

Abstract: An opening which leads inside a surface-moutable switch is sealed by a tape seal, a good seal being maintained even when heat is applied to the switch. A switch body has a top surface and an inner space in which an electrical contact is provided. A switch knob operating the electrical contact provided inside the switch is accessed through the opening. The tape seal seals the opening with an adhesive applied between the tape seal and a top surface of a switch body. A portion of the tape seal directly above the opening is drawn into the opening by a negative pressure in the opening. The surface-mountable switch is manufactured by placing the switch body applied with the tape seal in a vacuum chamber so as to evacuate air surrounding the switch body. The seal for the opening is temporarily broken by an air pressure inside the opening, and the pressure inside the opening becomes a negative pressure with respect to the atmospheric pressure.

Abstract: A suction head has a plurality of suction units. The respective suction units have spaces each connected with a vacuum pump through a first valve. A sensor observes works on a substrate to inspect whether or not a bad mark is marked on the works. The spaces are separated from one another so that only the spaces corresponding to works of good quality with no bad mark are vacuum-evacuated so as to vacuum-suck conductive balls, while preventing the space corresponding to defective work or works with the bad mark from being vacuum-evacuated by closing a first valve so as to cancel the mounting of the conductive balls.

Abstract: An electronic-part surface mounting apparatus includes an S-Z shaft vertically movable with respect to the mounted surface of a printed circuit board on which mounted parts such as electronic parts are mounted, and rotatable in a plane parallel to the mounted surface; an arm member revolving around the S-Z shaft; a plural number of Z-shafts, supported by the arm member, being vertically movable with respect to the mounted surface; cam unit revolving around the Z-shafts to cause the Z-shafts to individually move in a reciprocating manner; attraction/mounting unit operating such that at a position where the Z-shafts come nearest to the mounted surface, the attraction/mounting unit releases the mounted part from its seizure by the absorption nozzle attached to the lower end of the Z-shaft and mounts the mounted part on the mounted surface.

Abstract: An electronic component transferring device for transferring electronic components, including a plurality of rotary members rotatable about a common axis independently of each other, a rotary motion generating device for generating rotary motions of the rotary members about the common axis over a full 360.degree. angular range such that each rotary member is stopped at each predetermined stop position during one full rotation thereof and such that the rotary members are stopped at each stop position at different times, and a plurality of component holder heads which are carried by the rotary members, respectively, and which hold the respective electronic components. The apparatus may be suitably used in an electronic component mounting system. Also disclosed are a method of transferring the electronic components and a method of mounting the electronic components.

Abstract: A jig for dual-side mounting PC boards is composed of a board table which has a board supporting surface, a component receiving hole and a board sucking holes, spacers for placement in the component receiving holes, and a platform having a pressure-reducing space communicating with the board sucking holes. The spacers each have a protrusion for engagement with a spacer positioning hole made in the bottom of the component receiving hole.

Abstract: A method for mounting an integrated circuit includes a plurality of solder balls arrayed on the bottom surface of a package of the integrated circuit onto to a circuit board. These solder balls provide for surface mounting of the integrated circuit to a circuit board by solder reflow. The array of solder balls can be planarized so that each of the plural solder balls participate in defining a truly planar solder ball contact array for the integrated circuit package. Methods of manufacturing the integrated circuit with a package having planarized solder balls in an array dependent from a bottom surface thereof are set forth. The truly planarized solder ball contact array of the integrated circuit package affords nearly absolute reliability in forming of surface-mount electrical connections between the integrated circuit package and the circuit board on which the package is to mount.

Abstract: A long service life abutment member for use in an electronic component placement apparatus, such as a suction bit and an abutment body of a clamping finger. A diamond film or sintered diamond body is formed on top of the suction surface of the body of the suction bit for placing an electronic component at an intended place on a printed circuit board and on top of abutment bodies of clamping fingers for clamping the electronic component therebetween.

Abstract: An IC mounting/demounting system comprising a centering unit including first and second centering tools where socket pushers are constructed integrally with centering recess portions respectively. The centering unit is detachably fitted to a head body and replaceable with a centering unit corresponding to an IC having a different size. Accordingly, the replacement of the whole mounting/demounting head that normally accompanies the change in the kind of IC becomes unnecessary, thus enhancing work efficiency.

Abstract: A method for producing interconnect structures and circuit boards including placing an area array component having connection bumps on the corresponding metal contacts on a substrate disposed on a backing plate, providing heat curable joining material in communication with the bumps and contacts, contacting a gas nozzle directly to a portion of the substrate surrounding the component to press the substrate between the nozzle and the backing plate to restrain the substrate from wrapping, heating the component, the joining material and the substrate proximate the metal contacts while maintaining the nozzle on the substrate to cure the joining material, and cooling the component, the joining material and the substrate. Selected components can also be replaced utilizing the gas nozzle for restraining the substrate from wrapping.

Abstract: A component mounting apparatus includes an eccentric cam installed to rotate counterclockwise or clockwise with respect to a holder of a mounting head, and a follower connected to a suction bit and contacting a surface of the eccentric cam. Rotating the eccentric cam by a predetermined degree moves the follower which, in turn, moves the suction bit up and down. The shape of the surface of the eccentric cam is designed such that the upward-movement speed of the suction bit is different from the downward-movement speed of the suction bit due to the rotation of the eccentric cam. The shape of the surface of the eccentric cam is such that the suction bit moves slowly downward and then rapidly upward when the eccentric cam rotates in one direction, and moves rapidly downward and then slowly upward when the eccentric cam rotates in the other direction.

Abstract: In an ink jet head manufacturing method wherein a plurality of substrates provided with ejection energy generating elements for generating energy for ejecting ink, are arranged on a supporting member, and a top plate is mounted on the substrate to cover all of the substrates to form ink flow paths, the improvement residing in that the supporting member is provided with recesses at a supporting portion for supporting the substrates, and an adhesive material is supplied into the recesses, and thereafter, the substrate is placed on the supporting member.

Abstract: A component mounting apparatus includes a first pair of clamping members installed to face each other and to move toward and away from a hollow rod, and a second pair of clamping members installed to face each other at a predetermined angle with respect to the first clamping members and to move toward and away from the hollow rod. The first clamping members are driven by a first actuator and the second clamping members are driven by a second actuator. Thus, components of various configurations including any rectangle can be easily clamped. Another component mounting apparatus includes a lightweight component positioning unit. A component is picked up by a component pick-up unit protruding from the component positioning unit whose width becomes larger, positioned, and held by the component positioning unit. Thus, damage of the component can be prevented and component pick-up and mounting operations can be rapidly performed.

Abstract: A die bonding apparatus for separating a chip from a tested wafer including a plurality of chips and attaching the chip to a lead frame comprising a chip-transferring part for separating the chip from the wafer and transferring the chip to a place where a lead frame is prepared for die bonding; a stage where the transferred chip is placed; a bond head for compressing the chip and the lead frame to bond them together; and a lead frame-transferring part for transferring the lead frame to a predetermined place, the chip-transferring part being comprised of a first rectilinearly moving picking tool and a second revolving picking tool.

Abstract: A mounting head, a mounting apparatus, and a mounting method which are capable of contacting an electronic component with a substrate with a small contact load and mounting the component on the substrate, are provided. A suction device 120 is fit on a splined axis portion 118 of a support shaft 84 via a ball spline 126, is biased downward by a first spring 130, and is biased upward by a second spring 134. A suction nozzle 124 is attached to a nozzle holder 122 by engaging engagement ridges 172 of sheet springs 166 fixed to the suction nozzle 124 with engagement grooves 144 of the nozzle holder 122, respectively. Prior to the mounting of electronic components 178, a relationship between contact load and position of lift 28 is obtained, and a position to which the lift 28 is moved downward for mounting each electronic component 178 is pre-determined. Thus, each component 178 is contacted with a printed circuit board with an appropriate load.

Abstract: An apparatus for placing electrically-conductive balls on electrodes of workpieces so as to form projected electrodes includes a ball-placing head which picks up the conductive balls from a reservoir. Suction holes for respectively suction-holding the conductive balls are formed in a lower surface of a box member of the ball-placing head. Recesses are formed respectively in portions of this lower surface where the suction holes are not formed. The box member of the ball-placing head is caused to rest on an upper surface of layers of conductive balls stored in a container of the reservoir. In this condition gas is blown or injected into the container so as to fluidize the conductive balls. At this time the gas flows upward into the recesses in the lower surface of the box member, thereby sufficiently fluidizing the whole of the upper layer of conductive balls, so that all of the suction holes can effectively and securely pick up and hold the conductive balls.

Abstract: A mechanism and method for mounting components on a substrate in an accurate location. The components are presented in the sensing station at successive positions to determine the optimum position for their determination and this optimum position is preset into the apparatus and all like components are subsequently measured only in that optimum position.

Abstract: There is disclosed an automatic electronic part-mounting apparatus in which acceleration, acting on electronic parts, suction-held respectively by mounting heads, is reduced, thereby enabling stable mounting of the electronic parts. Cam levers 10 are pivotally mounted through respective pivot shafts 9 on a rotary member 8 which is rotated at a constant speed by a roller gear cam 19. One end of the cam lever is engaged with a fixed cam 7 whereas the other end thereof is slidably mounted through cam followers on a follower lever 12 slidably mounted on annular rails 11 in a housing 6. One end of the follower lever 12 is slidably engaged with a cam follower, and the other end of the follower lever 12 is mounted on each mounting head 13. With this construction, the acceleration of the mounting head 13 can be reduced.

Abstract: A liquid crystal display element utilizing flexible gas barrier films decreases poor display performance caused by bubble formation. This decrease is achieved by reducing the permeation of gas and water vapor from the gas barrier films into substrates by devising the structure of the element and the configuration in which the element is mounted. Specifically, edges of the substrates forming the liquid crystal display elements are sealed. Additionally, the gas and water vapor saturation solubilities of the liquid crystal material is controlled to improve resistance to bubble formation. The liquid crystal display elements can also be subjected to and/or stored in a reduced pressure. Electronic equipment incorporating liquid crystal display elements can include a guard plate having a minimum thickness and/or spacing from the display elements.

Abstract: A method for direct insertion of a headed rivet into a countersunk hole in a workpiece includes placement of a rivet guide in axial alignment over the countersunk hole in the workpiece and blowing a rivet, nose first, through a rivet guide tube in the rivet guide toward the countersunk end of the hole. Air is blown through an annular passage at the exit end of the rivet guide tube into a rivet cavity at the exit end of the rivet guide, to align the rivet axis with the axis of the hole. A vacuum is established on the other end of the hole in the workpiece to draw the rivet into the hole.

Abstract: Although the conventional continuous riveting machine was able to use exclusively a special blind rivet having a longer core-stem than that of the standard type, the continuous riveting machine according to the present invention is able to use the standard blind rivet and also able to recover separately torn core rivet stems and a blind rivet-holding belt made of plastic material enabling the supply of blind rivets in series. When a lower piston 600 descends in a jaw cylinder 400, a nose piece 620 integrated in one piece with the lower piston 600 also descends while bending downwardly plastic upper and lower tabs of the blind rivet-holding belt, and holding the blind rivet. Torn-core-stems are absorbed and stored in a torn core rivet stems storing case installed on the upper portion of the jaw cylinder by applying vacuum air absorbing force generated in a vacuum ejector.

Abstract: An apparatus and method is provided that superimposes an image of an optoelectric component on a substrate with the use of a single camera. Specifically, the camera looks through a transparent alignment tool that is holding the component, to the substrate below it, thus allowing both the component and the substrate to be seen together by the camera. The alignment tool and substrate are adjusted to precisely align the two and then are brought together while being seen by the camera. On laser chips, the chip is energized while on the glass alignment tool to produce a laser spot that is superimposed on the visible light image via a series of lenses and mirrors.

Abstract: A nozzle for a vacuum mounting head of a component placement machine. The nozzle includes a positioning block defining a plurality of spaced apart pads on top of the block with each of the pads having a pad hole in the top of the pad. The positioning block also defines an opening in the bottom of the block for mounting the nozzle on the vacuum mounting head. The positioning block further defines an interior air passage connecting each of the pad holes with the opening in the bottom of the block for the application of a vacuum force by the nozzle.

Abstract: A mounting apparatus mounts electronic parts on a substrate. The mounting apparatus includes an electronic part feeder having a moving table which moves along a moving path. The moving table moves a part cassette accommodating electronic parts to a pick up station. A transferring and mounting unit having a transferring and mounting head is also provided to move between the pick up station and the mounting station to retrieve the electronic part from a part pick up port of the part cassette at the pick up station. The transferring and mounting head has a nozzle for picking up an electronic part. The transferring and mounting head rotates the nozzle along a circular path. The moving path and the circular path intersect at two points at the pick up station. The pick up port of the part cassette is positioned at one of the intersecting points.

Abstract: A method for fabricating an electronic assembly comprises attaching an insulative film to a frame and positioning at least one electronic component having a face with connections pads face down on the insulative film. The insulative film is positioned on a porous sheet supported by a vacuum fixture. The porous sheet and vacuum fixture are adapted so as to be capable of creating vacuum conditions for holding the insulative film with a substantially flat surface on the porous sheet. A vacuum is created within the vacuum chamber for flatly holding the insulative film on the porous sheet. A substrate is applied to the insulative film and the at least one electronic component. In one embodiment the substrate is applied by securing the insulative film in position with a mold form having at least one opening around the electronic component and adding substrate molding material at least partially around the component through the opening.

Abstract: Although the conventional continuous riveting machine was able to use exclusively a special blind rivet having a longer core-stem than that of the standard type, the continuous riveting machine according to the present invention is able to use the standard blind rivet and also able to recover separately torn core rivet stems and a blind rivet-holding belt made of plastic material enabling the supply of blind rivets in series. When a lower piston 600 descends in a jaw cylinder 400, a nose piece 620 integrated in one piece with the lower piston 600 also descends while bending downwardly plastic upper and lower tabs of the blind rivet-holding belt, and holding the blind rivet. Torn-core-stems are absorbed and stored in a torn core rivet stems storing case installed on the upper portion of the jaw cylinder by applying vacuum air absorbing force generated in a vacuum ejector.

Abstract: An automatic electronic parts-mounting apparatus mounts chip-like electronic parts supplied from a parts feeder at predetermined positions on a printed substrate. The parts-mounting apparatus accurately and quickly determines angular positions of the electronic parts by rotating adsorptive nozzles. The adsorptive nozzles are capable of adsorbing the electronic parts one by one, and each nozzle is connected to a rotor of a nozzle-rotating motor for rotating the adsorptive nozzle within a plane that is perpendicular to an axis of the adsorptive nozzle. The rotor is rotated in accordance with the adsorbed state of the electronic parts to make fine adjustment for determining the angular position.

Abstract: The optical module manufacturing apparatus according to the present invention includes a pallet 205 on which the optically operating members and the lead frame are set to be kept in a positional relationship; a wire connection means 202 and 213 for connecting the wires to the members, the frame and the electronic circuits on the frame as the members and the frame remain kept in the positional relationship; conveyors 207, 208 and 209 for conveying the members and the frame to dies 204 after the connection as the members and the frame remain kept in the relationship; and a die-setting means 203 for setting the members and the frame in the dies through the suction of the members and the frame away from the pallet onto the setting means after the conveyance as the members and the frame remain kept in the relationship.

Abstract: A method of recovering rivets from a rivet hole prior to the deformation of the rivets by the rivet dies includes the steps of positioning a suction cavity over the rivet in the rivet hole, pushing the rivet out of the hole with a rivet tail die and blocking the hole with the rivet tail die to prevent suction from the tail-side pressure nose from holding the rivet in the rivet hole. The swirling air in the suction cavity induced by the suction hose connected to the suction cavity pulls the rivet out of the hole and sucks it out of the suction cavity through the suction hose.

Abstract: A vacuum insulated panel having high thermal insulating value and long vacuum life, and a method of making such a panel are disclosed. The panel is formed of peripherally welded metal wall members which define a cavity within which, in one embodiment, a compressed block of particulate material is disposed. The particulate material, in this embodiment, serves as a barrier to radiant thermal transmission through the panel, acts as a getter to maintain the vacuum in the panel, and supports the walls of the panel against collapse when the cavity is evacuated. The vacuum insulated panel can be covered with a polyurethane foam insulating material. According to a further embodiment of the invention, the filler within the cavity is a sandwich comprising a compressed layer of particulate material suspended between two layers of fiberglass.

Abstract: A pick and place machine (30) having morphing vacuum tip (10) comprises a chamber (24) having a sealed first port (25), a filter (22) on a second port (27), and a vacuum (12) on a third port (23), a needle (28) pierced through the sealed first port and through the filter on the second port, wherein a vacuum (14) is placed on the portion of the needle piercing through the sealed first port. Finally, the morphing vacuum tip additionally comprises a non-porous bag (18) having a plurality of fine particles (16) within the bag and an external portion of the bag surrounding a periphery of a portion of the needle pierced through the filter on the second port, the non-porous bag having an open portion being exposed to an external side of the filter on the second port of the chamber, wherein the vacuum on the third port sucks air out of the non-porous bag and the filter prevents the plurality of fine particles from entering the chamber.

Abstract: A mounting apparatus for mounting electronic components, includes a component feeding section wherein plural component feeding units accommodating plural components and sequentially supplying components to a predetermined component take-out position are arranged on a moving table along a moving direction, a positioning mechanism of a mounting member to which one component is to be mounted, and a mounting device for holding one component at a predetermined position in the feeding section and mounting the component onto the mounting member. The mounting device includes a movable member which is vertically movable and has a gas groove which is formed at an inside part of the movable member, and a rotary member which is rotatable around a vertical axis of the movable member and has at its inside part a gas groove which is formed at an inside part of the rotary member and is communicated with the groove of the movable member so as to transmit gas between the grooves during operation.

Abstract: A neck booklet machine is described which places an elastic band having a booklet connected to the band around a neck of a container. The booklets are vertically stacked in a curved magazine and pulled by a vacuum cup from the curved magazine, which matches the natural curvature of a stack of booklets having an elastic band on one side. The bottom of the curved magazine is open to allow the elastic bands to hang free. The neck booklet is picked up by a carrier pad and held against and transported along a slide plate. A low vacuum nozzle pulls the loose elastic band downwardly to enable a loop of the elastic band to be picked up by a needle point and held precisely below the booklet on the slide plate. The elastic band is pulled down and around an opening horn extending from the needle point as the neck booklet moves along the slide plate by the carrier pad. The opening horn is carried on supports on the bottom and side with a top opening to allow the elastic band to pass over the opening horn.

Abstract: A method of riveting includes drilling a hole in a workpiece with a drill bit held in a spindle mounted on an axial centerline of a drill/rivet machine. The drill descends through a drill/suction cavity of a movable shuttle and drill chips cut by the drill bit are suctioned away from the workpiece as they are made. The drill bit is withdrawn to a level just above the drill/suction cavity, which is then moved to position a rivet insert station over the newly drilled hole in the workpiece. A rivet is blown into the rivet insert station, is guided into alignment with the hole and injected directly into the hole by air pressure. The shuttle moves a rivet die over the newly installed rivet in the hole and a driver of an electromagnetic riveter is lowered into contact with the die, which in turn is pressed against the rivet head. Another rivet die is pressed against the rivet tail on the other side of the panel by a driver of another electromagnetic riveter.

Abstract: A method for removing a fuel cell from an aircraft fuselage cavity includes the steps of sealing the fuel cell by securing complementary covers and gaskets or O-rings in combination with the ports of the fuel cell, installing an evacuation system in combination with the fuel cell, operating the evacuation system to evacuate the sealed fuel cell wherein the ambient air pressure of the aircraft fuselage cavity collapses the fuel cell to a predetermined height, and removing the collapsed fuel cell from the aircraft fuselage cavity.

Abstract: The optical module manufacturing apparatus according to the present invention includes a pallet 205 on which the optically operating members and the lead frame are set to be kept in a positional relationship; a wire connection means 202 and 213 for connecting the wires to the members, the frame and the electronic circuits on the frame as the members and the frame remain kept in the positional relationship; conveyors 207, 208 and 209 for conveying the members and the frame to dies 204 after the connection as the members and the frame remain kept in the relationship; and a die-setting means 203 for setting the members and the frame in tile dies through the suction of the members and the frame away from the pallet onto the setting means after the conveyance as the members and the frame remain kept in the relationship.

Abstract: A work mounting apparatus according to the present invention comprises a rotating drum divided into upper and lower drums, a head unit arranged on the outer periphery of the rotating drum or the lower drum, a circular work head attached to the head unit, and a suction nozzle protruding from the outer peripheral surface of the work head toward a workbench. While the lower drum is rotating, the suction nozzle of the work head repeats cycloid motion along the workbench with its posture or orientation kept fixed with respect to the workbench. While repeating the cycloid motion, the nozzle receives a work from a work feeder of the workbench by suction, and mounts the work on a printed board on the workbench. The work mounting apparatus further includes a balance weight for the work head, and a friction brake for applying a frictional force to the turning shaft of the work head, to thereby stabilize the turning motion of the work head.

Abstract: A method is provided for automatically opening and removing a web from a clamshell film cassette. During opening of the cassette a first actuatable means releases a cassette latch. A second means is provided to open one clamshell half upon release of the latch, and a third means is provided to open the other clamshell half. The second and third means each include a pivotal arm having a plurality of suction cups for gripping a wall of a calm shell half. The pivotal arms are positioned by automatic actuators. Vacuum means are provided for picking up the leading end of a web roll within the cassette and transporting it to a web path.

Abstract: In a parts mounting apparatus, suction nozzles are mounted on a rotating carrier driven by a motor. With rotation of the rotating carrier, parts are sucked by the nozzles at a feed station and carried to a mounting station where the parts such as electronic parts are mounted on substrates, for example. A counter counts output pulses from an encoder mounted in the motor driving the rotating carrier. A microcomputer determines the rotational speed and rotational position of the rotating carrier from the count value of the counter. Based on the result of the determination, the microcomputer calculates a timing for delivering a signal for switching the nozzles between two different pneumatic states.

Abstract: A machine for automatically joining front and back parts of buttons employs a turntable with nests that are rotated through a series of stations at which the parts are placed in the nests in a desired orientation, joined, and checked for defects. Orientation of the parts is achieved by video imaging of a first part as it is randomly placed in a nest, and computer-controlled placement of the second part based on the ascertained position of the first part.

Abstract: A thermoforming manufacturing process is provided for creating modular three dimensional objects, particularly golf bags (10). The process includes preparatory steps of preparing a corresponding female mold member (42) for each of the golf bag segments (74) to be included, and preparing a laminate sheet material (44) having a fabric surface (46) to give the bag (10) the look and feel of a fabric of bag. Thermoforming steps including edge securing the sheet (44), softening with heat, drawing into the female mold member (42), cooling and removing the formed segment (74) are then performed. Finally, the segments (74) are assembled together to form the golf bag (10). Closed cell foam is the preferred thermoformable and shape retentive material with a woven stretchable fabric providing a preferred surface.

Abstract: A mounting apparatus for attaining a tolerance-insensitive connection of a conductor track foil with contact pins of an electrical component. The conductor track foil includes two insulating layers with an intervening conducting layer with lands in the upper layer for soldering the conductive layer to the contact pins of the electrical component. The conductor track foil is lowered, positionally correctly, onto the electrical component by use of a mounting device. The bottom insulating layer and the conducting layer of the soldering lands, which are free of an insulating layer on the top, are pierced by the contact pins extending at right angles to the conductor track foil. The conductor track foil is released by the mounting apparatus. A soldered connection is made between the lands and the contact pins. As a result, an electrically reliably gap free conducting connection is attainable even if the contact pins are eccentrically associated with the soldering lands.

Abstract: Apparatus is provided for automatically opening and removing a web from a clamshell film cassette. During opening of the cassette a first actuatable means releases a cassette latch. A second means is provided to open one clamshell half upon release of the latch, and a third means is provided to open the other clamshell half. The second and third means each include a pivotal arm having a plurality of suction cups for gripping a wall of a clamshell half. The pivotal arms are positioned by automatic actuaters. Vacuum means are provided for picking up the leading end of a web roll within the cassette and transporting it to a web path.

Abstract: There is disclosed a high density electronic connector system in which a plastic insulating body supports on one or more levels a plurality of conductive circuit traces. Output contacts to these traces are provided by small metal balls. The metal balls are driven into tight contact with respective ones of the conductive traces and captivated by the plastic body. The balls are covered with gold and provide miniature, wear resistant closely spaced output contacts in the connector system. A ball may contact conductive traces on two levels of the insulating body and thereby provide an electrical connection between conductive traces. A method of manufacture of the connector system includes the steps of heating the plastic body to an elevated temperature, and driving the small metal balls through or against a respective conductive trace and into the plastic body which thereby captivates it. The conductive traces may be solder plated.

Abstract: A method of recovering rivets from a rivet hole prior to the deformation of the rivets by the rivet dies includes the steps of positioning a suction cavity over the rivet in the rivet hole, pushing the rivet out of the hole with a rivet tail die and blocking the hole with the rivet tail die to prevent suction from the tail-side pressure nose from holding the rivet in the rivet hole. The swirling air in the suction cavity induced by the suction hose connected to the suction cavity pulls the rivet out of the hole and sucks it out of the suction cavity through the suction hose.

Abstract: A vacuum insulated panel having high thermal insulating value is described together with a method of making such a panel. The panel is formed of peripherally welded metallic wall members which define a cavity within which a solid compressed block of particulate material is disposed. The particulate material, preferably an activated carbon black, a silica gel or a combination thereof, serves as a barrier to radiant thermal transmission through the panel, acts as a getter to maintain the vacuum in the cavity, and, with proper density, supports the walls of the panel against collapse when the cavity is evacuated. In one embodiment of the invention, the vacuum insulated panel is covered on one side with a polyurethane foam insulating material.

Abstract: Printed circuit assembly machine, consisting of a flat lower base, capable of moving up and down, and of a curved upper base capable of tilting, both being drilled with a multitude of holes, through which a vacuum is created, characterized in that both lower and upper bases have their holes distributed in independent zones, each zone being provided with a vacuum tube, which regulates the vacuum in each of them, and a microprocessor with program for controlling operation of the vacuum tubes.

Abstract: Glass plates (1) are inserted in frames (2) wherein the glass plate (1) is held between seals (3 and 4), one seal (3) of which is attached to the frame (2) and the other seal (4) of which is attached to a strip (6) lockable onto the frame (2). The glass plate (1), with compression of the seal (3) inserted in the frame (2), is displaced in the frame (2) transversely to its surface by a pressure difference between one side and the other side of the glass plate (1). Once the glass plate (1) is thus displaced with respect to the frame (2), the strips (6) carrying the seal (4) are inserted in the frame (2). An apparatus for performing this process includes a support for the frame (2) which is a flat element (10) wherein at least one opening (11) is provided for placement under a vacuum.