Abstract: A picking apparatus is configured to pick up a plurality of micro elements. The picking apparatus includes a main body and a plurality of picking portions. The picking portions connect with and protrude from the main body. Each of the picking portions has a first surface. The first surfaces are away from the main body and configured to pick up the micro elements. The main body has a second surface at least partially located between the picking portions. Each of the first surfaces has a first viscosity. The second surface has a second viscosity. The second viscosity is less than the first viscosity.

Abstract: A double ended hand tool created to pick up place and position flatback crystals, gems or other tiny items is disclosed. The tool contains a hollow, conical end which securely encases each crystal allowing the operator to easily position the crystal with no slip. The tool has a first end and a second end coupled by a shaft. The first end has a wax tip which allows the user to pick up crystals or other small items. The second end has a hollow narrow extended portion which allows the users to manipulate the crystal or other small items.

Abstract: A device for preparing, fitting, and placing periodontal prosthodontics having a finger covering and an attached bilayered adhesive patch, wherein the bilayered adhesive patch comprises two separable layers joined by a weak adhesive and one external side of the bilayered adhesive patch is attached by a strong adhesive to the finger covering while the other external side of the bilayered adhesive patch has a layer of pressure sensitive adhesive.

Abstract: An item with fibers may be picked up and placed using a tool head with hooks that engage the fibers. The tool head may comprise at least one hook portion and at least one contact surface adjacent to the hook portion. The hooks that engage the fibers may extend from the hook portion. The tool head may be actuatable between at least a first configuration that permits the hooks to engage the fibers and a second configuration that does not permit the hooks to engage the fibers. An item may be picked up at a starting location with a tool head in the first configuration and placed at a placement location by moving the tool head and then actuating the tool head to the second configuration.

Abstract: According to one embodiment, a chuck cleaner includes a support, an adhesive layer, and a support substrate. The support includes a first portion, a second portion, and a third portion provided between the first portion and the second portion. The support substrate is provided between the support and the adhesive layer. The support substrate includes a first region fixed to the first portion, a second region fixed to the second portion, a third region provided between the first region and the second region and having variable distance from the third portion, a fourth region provided between the first region and the third region and separated from the support, and a fifth region provided between the second region and the third region and separated from the support.

Abstract: A tool for retrieval of dropped and other items includes an elongated rod member having a first end and an opposite second end, with a handle mounted at the first end of the rod and defining a user gripping surface, and a retrieval member mounted at the second end of the rod and defining a lower planar retrieval surface. The retrieval member includes a magnet and the lower planar retrieval member surface defines a sticky surface region, both for attachment and retrieval of dropped and other items.

Abstract: A removable and positionable gripping element for attaching to cards has: f) two opposed surfaces having pressure-sensitive adhesive on the opposed surfaces; g) at least one of the opposed surfaces, and preferably both of the opposed surfaces being translucent or transparent and having a length; h) the two opposed surfaces being joined at a top end; i) attached to the top end of the two opposed surfaces at a point of attachment is a gripping element having a length; and j) the point of attachment being flexible. A method of manufacturing the gripping element is accomplished by lamination then conversion of layers. The element is simply positioned over an edge of the card to provide a semi-permanent handle for easing the removal of the card from a pocket, slot or window.

Abstract: A magnetic medical pick up device having a top piece and a bottom piece which removeably engage one another with a cavity positioned between the top and bottom piece. At least one magnetic piece is positioned within the cavity and a handle is connected to the top exterior portion of top piece for handling the magnetic medical pick up device. In use, the top piece and bottom piece are separated from one another, and the top piece is positioned over a contaminated medical device. In this position the magnetic attraction of the magnet pulls the contaminated medical device within the cavity and the bottom piece is engaged with the top piece thereby quarantining the contaminated medical device. As at least a portion of the top piece and/or bottom piece are transparent, the contaminated medical device can be inventoried at the end of the procedure while remaining quarantined within the cavity.

Abstract: An evidence collection device preferably includes a handle member and a container member. The handle member preferably includes an evidence retention device and a handle portion. The evidence retention device preferably includes at least one loop, a first arm and a second arm. First and second clearance slots are formed in the handle portion to provide clearance for the first and second arms. A retention dowel is inserted through the at least one loop and into the handle portion to retain the evidence retention device. The container member is sized to receive the handle portion. A tapered surface is preferably formed on one end of the handle portion. In use, the first and second arms are squeezed together with two fingers for insertion into a cartridge casing. The one end of the handle portion is inserted into the container member and retained by friction.

Abstract: An electronic device holding system having a panel with a first end and a second end opposite the first end, a third end and a fourth end opposite the third end, a handle surface, and an attachment surface, a handle is pivotally attached to the handle surface and can pivot either in a first direction toward the third end of the panel and a second direction toward the fourth end of the panel, or in a third direction toward the first end of the panel and a fourth direction toward the second end of the panel, and a first half attachment means on the attachment surface and a second half attachment means for attaching to a smart phone, tablet, or electronic reader, the first half attachment means is adapted to temporarily engage the second half attachment means.

Abstract: Handling device for handling of a wafer in the processing of the wafer with the following features: a carrier with a flat receiving side for holding the wafer, an especially lattice-like grid structure which is raised on the receiving side relative to the receiving side, a flexible cover which covers the grid structure relative to the carrier, sealing it, for fixing of the wafer on the carrier, and a grid space which is bordered by the cover and the carrier can be exposed to negative pressure, characterized in that the grid structure and the cover with the receiving side form an especially trough-shaped receiving space for holding of receiving structures which are provided on the wafer and which are raised relative to the wafer receiving side.

Abstract: A seed handling tool includes a handle connected to a working body. The working body includes a working surface, which further includes a plurality of seed retention points. A seed retention source is provided to allow the seed handling tool to pick up and retain seeds at the seed retention points. In some embodiments, the seeds may also be released from the seed retention points. A method for retaining a plurality of seeds by the seed handling tool includes moving the seed handling tool to a position where the working surface is adjacent to a plurality of seeds, and picking up and retaining seeds at a plurality of seed retention points fixed at the working surface. In some embodiments, the method may also include releasing the plurality of seeds from the seed retention points.

Abstract: An apparatus and method for locating and removing a card such as an identification, membership, or banking card from a wallet, purse, or other card holding device. The apparatus includes a flat thin member with a gripping terminus at a first distal end and a coupling implement at a second distal end. The coupling implement is capable of coupling with a card. When coupled to a card that is inserted into the pocket or sleeve of a card holding device the gripping terminus is visible beyond the edge of the card and serves as both a visible indicant of the location of the particular card and an ergonomic and convenient point to grasp and pull to extract the card from the pocket or sleeve.

Abstract: Handling device for handling of a wafer in the processing of the wafer with the following features: a carrier with a flat receiving side for holding the wafer, an especially lattice-like grid structure which is raised on the receiving side relative to the receiving side, a flexible cover which covers the grid structure relative to the carrier, sealing it, for fixing of the wafer on the carrier, and a grid space which is bordered by the cover and the carrier can be exposed to negative pressure, characterized in that the grid structure and the cover with the receiving side form an especially trough-shaped receiving space for holding of receiving structures which are provided on the wafer and which are raised relative to the wafer receiving side.

Abstract: A tool is attachable to a card and is useable to pull the card out of a card slot of a wallet. The tool includes a sticky end having two portions between which at least a portion of the card is insertable and which are stickable to the card, and a pulling end that extends away from the card when the sticky end is stuck to the card. A tool is attachable to an object, and the tool includes a first part, a second part, and a tab part. The first part has adhesive for adhering to a first side of the object. The second part has adhesive for adhering to a second side of the object opposite the first side of the object. The tab part is connected to the first part and the second part. A method allows for using an adhesive tool to pull a card.

Abstract: A method for picking up small objects using a pliable, tacky composition whereby after the composition is touched to a small object so that the object temporarily adheres to it, the object can be manually removed or transferred from the composition. The tacky composition may be used with an apparatus.

Abstract: A holding apparatus, a conveying apparatus, and a rotation-transmitting apparatus are provided that are capable of stably holding an object while suppressing an influence of a change in shape of the object and a fluctuation of a holding form. A conveying apparatus according to one form of the present invention includes a hand and a holding body provided on the hand. The holding body includes a holding member that includes a holding surface that comes into close contact with a holding object, the holding member being capable of holding a conveying object on the holding surface, and a viscoelastic member that is formed of a viscoelastic material and bonds the hand to the holding member. By the viscoelastic member being elastically deformed and the entire surface of the holding member being brought into close contact with the holding object, the conveying apparatus is capable of holding the conveying object on the hand.

Abstract: The invention relates to a handling device and to a handling method for wafers, in particular for wafers with a thickness of less than 100 ?m. According to the invention it is provided that an adhesive membrane is arranged so as to delimit at least one workspace, the volume of which can be changed by supplying or removing pressurising medium, and in that the size of the contact surface between the adhesive membrane and the wafer can be adjusted by changing the workspace volume.

Abstract: The invention relates to a handling device and to a handling method for wafers, in particular for wafers with a thickness of less than 100 ?m. According to the invention it is provided that an adhesive membrane is arranged so as to delimit at least one workspace, the volume of which can be changed by supplying or removing pressurising medium, and in that the size of the contact surface between the adhesive membrane and the wafer can be adjusted by changing the workspace volume.