Abstract: According to one embodiment, in a semiconductor storage device, a conductive cover is provided on a side of the principal surface, and covers at least a part of the memory and the controller. A substrate has a first notched portion and a second notched portion in an outer edge. The conductive cover has a top plate portion, a first side plate portion, a second side plate portion, a first claw portion, and a second claw portion. The first claw portion is extended from a lower end of the first side plate in a direction intersecting with the principal surface. The first claw portion is fitted into the first notched portion. The second claw portion is extended from a lower end of the second side plate in the direction intersecting with the principal surface. The second claw portion is fitted into the second notched portion.

Abstract: The present disclosure is intended to reduce connection resistance between a shield film and a ground electrode, and to improve characteristics of the shield film. A high frequency component 1a includes a ceramic substrate 2, a ground electrode 3a disposed inside the ceramic substrate 2, a shield film 4 covering an upper surface 2a and lateral surfaces 2c of the ceramic substrate 2, and connecting portions 6a connecting the ground electrode 3a and the shield film 4, wherein the ground electrode 3a is formed using a conductive paste that contains a metal ingredient, powder, and a material constituting the ceramic substrate 2, and a weight rate of a metal ingredient in the connecting portions 6a is higher than that of the metal ingredient in the ground electrode 3a.

Abstract: The edge shields disclosed herein utilize a plated edge surface of a PCB to form one or more sides of an electronic shield to reduce the amount of top surface area of the PCB occupied by the electronic shield. More specifically, an edge shield lid is mechanically attached to the plated edge surface to remove a need for solder overprint at the edge of the PCB. The edge shield lid is soldered, welded, adhered, or mechanically attached to edge walls where there is no available edge surface for attachment.

Abstract: A semiconductor circuit includes an oscillation circuit; an output circuit that receives a first oscillation signal from the oscillation circuit and outputs a second oscillation signal; a DC circuit that receives a voltage based on a power supply voltage and outputs at least one of a DC voltage and a DC current; and a semiconductor substrate on which the oscillation circuit, the output circuit, and the DC circuit are formed. In a plan view of the semiconductor substrate, the DC circuit is disposed between the oscillation circuit and the output circuit.

Abstract: Embodiments relate to integrated circuits with protection. In one embodiment the protection is coupled between a first circuit provided to control a low power mode of the integrated circuit and a supply voltage. The protection comprises in an embodiment a transistor being one of a depletion transistor or a junction field effect transistor.

Abstract: Embodiments relate to an ultra-low-power, high-voltage integrated circuit (IC) that also has high electromagnetic compatibility (EMC). Embodiments address the desire for an ultra-low-power, high-voltage IC that also has high EMC and comprise a high-voltage EMC protection circuit with normal current consumption coupled to an ultra-low-power, low-voltage oscillator that controls a sleep/wake, or duty, cycle of a high-voltage circuit.

Abstract: An LC tack structure. The structure, including a set of wiring levels on top of a semiconductor substrate, the wiring levels stacked on top of each other from a lowest wiring level nearest the substrate to a highest wiring level furthest from the substrate; an inductor in the highest wiring level, the inductor confined within a perimeter of a region of the highest wiring level; and a varactor formed in the substrate, the varactor aligned completely under the perimeter of the region of the highest wiring level. The structure may additionally include an electric shield in a wiring level of the set of wiring levels between the lowest wiring level and the highest wiring level. Alternatively, the inductor includes a magnetic core and alternating electrically non-magnetic conductive metal coils and magnetic coils around the core.

Abstract: A surface mount crystal oscillator comprises a package body having a first recess, a cover having a second recess, a crystal blank secured to an inner bottom surface of the second recess, and an IC chip secured to a bottom surface of the first recess. The IC chip has an oscillation circuit using the crystal oscillator integrated therein, and has IC terminals on one main surface for connection to the outside. A first and a second annular metal film are disposed to surround open end surfaces of the first recess and second recess, respectively. By bonding the first and second annular metal films with an eutectic alloy, the crystal blank and IC chip are hermetically sealed in a space defined by the integrated first and second recesses.

Abstract: An assembly includes a support element and a chip having contact elements. The chip is mounted onto the support element with the contact elements facing the support element. A shield layer is on the support element for electrically or magnetically shielding a circuit element of the chip.

Abstract: An LC tank structure. The structure, including a set of wiring levels on top of a semiconductor substrate, the wiring levels stacked on top of each other from a lowest wiring level nearest the substrate to a highest wiring level furthest from the substrate; an inductor in the highest wiring level, the inductor confined within a perimeter of a region of the highest wiring level; and a varactor formed in the substrate, the varactor aligned completely under the perimeter of the region of the highest wiring level. The structure may additionally include an electric shield in a wiring level of the set of wiring levels between the lowest wiring level and the highest wiring level. Alternatively, the inductor includes a magnetic core and alternating electrically non-magnetic conductive metal coils and magnetic coils around the core.

Abstract: A crystal oscillator comprises a rectangular circuit substrate for mounting circuit devices and its metal cover, said circuit substrate has grooves on each long side and on each short side and said metal cover has projections at each aperture end corresponding to the grooves, and which has a swelling from external to internal in each of the projections, wherein both the grooves provided on each short side and the projection of said metal cover are provided at one end of each long side or each short side.

Abstract: A weighing apparatus includes a SAW oscillator and a “push oscillator” to force the SAW oscillator into a desired mode of operation. A SAW temperature oscillator and a thermistor are also provided. The frequency of the “push oscillator” is made immune to temperature changes by generating it via a mixer mixing the SAW temperature oscillator with an adjustable fixed frequency oscillator. Long term stability of the SAW temperature oscillator is achieved by periodic calibration with the thermistor.

Abstract: In an oscillator used in a high frequency band such as the microwave band, the millimeter wave band, etc., an oscillation element and circuit components such as a resonator coupled to the oscillation element, etc., are provided inside a casing, the oscillation element is disposed inside a cavity having at least one opening portion, and a part or the whole of the resonator is disposed outside the cavity.

Abstract: A charged species source and a charged species drain are provided. A moveable component is positioned proximate to the charged species source and the charged species drain. A first protrusion and a second protrusion are provided in contact with the moveable component, wherein at least one of the moveable component, the first protrusion and the second protrusion have a size of a micrometer scale or smaller. The moveable component is moved relative to the charged species source and the charged species drain to transfer electrical charge between the source and the drain.

Abstract: A multifunctional crystal unit in which in the same container constituted by a container body having a recess therein and a cover, a plurality of crystal blanks are hermetically encapsulated. In the container, the crystal blanks are respectively held in different spaces, which are isolated from one another by a shielding member. Hereby, respective crystal blanks are electrically shielded from one another. As the plurality of crystal blanks, a crystal blank of AT cut for generating a communication frequency signal, and a tuning fork type crystal blank for generating a clock signal are preferably used.

Abstract: In a high-frequency module according to the present invention in which a conductive cap for an electromagnetic purpose is placed on a substrate on which a plurality of electrical components are mounted by soldering, an insulating adhesive is applied between the plurality of electrical components. Since the insulating adhesive is applied between the electrical components on the substrate, it is possible to prevent such deficiencies as “solder touch” between components due to self-alignment which is caused by a solder which melts in the reflow process. As a result, a highly reliable high-frequency module can be obtained, and the number of application points of the insulating adhesive can be reduced.

Abstract: In a high-frequency module according to the present invention in which a conductive cap for an electromagnetic purpose is placed on a substrate on which a plurality of electrical components are mounted by soldering, an insulating adhesive is applied between the plurality of electrical components. Since the insulating adhesive is applied between the electrical components on the substrate, it is possible to prevent such deficiencies as “solder touch” between components due to self-alignment which is caused by a solder which melts in the reflow process. As a result, a highly reliable high-frequency module can be obtained, and the number of application points of the insulating adhesive can be reduced.

Abstract: An electronic apparatus is comprised of a main board 1 having a main-circuit mounting region 6 and an oscillating-circuit mounting region 2; a shielding case 5 for covering the oscillating-circuit mounting region by being attached to the main board; a sub-board 10 on which circuit components 3 and 4 constituting an oscillating circuit portion 11 are mounted and which is supported at a position spaced part from the main board inside the shielding case; and a connector 12 for electrically connecting the sub-board and the main board.

Abstract: This invention relates to the field of electrical technology, and relates particularly to a method for the continuous transformation of electrical energy with its subsequent transmission from an initial source (transformer) to a consuming device, and also to an apparatus for the implementation of this method of transformation and the supplying of power to electrical devices through a transmission line which does not form a closed circuit, ie consists of a single conducting wire.

Abstract: An oscillator includes a multi-layered base. Circuit patterns are formed on a first main surface and the inside of the multi-layered base. Holes through which wiring patterns of the individual layers of the base are connected are formed within the multi-layered base. Electronic components are mounted on the first main surface of the multi-layered base. First and second reverse electrodes, which serve as external terminals to be connected to an external source, are formed on a second main surface of the multi-layered base. The first reverse electrode serves as a ground electrode, and the second reverse electrodes serve as terminal electrodes. The reverse electrodes are electrically connected to the circuit patterns via the holes. The reverse electrodes are located farther inward than the lateral surfaces of the multi-layered base. A shield cover is placed to tightly cover the first main surface of the multi-layered base.

Abstract: A contoured panel section for a radome for use with a center frequency corresponding to a wavelength equal to .lambda., the panel section comprising a solid body portion of a thickness which is an integral multiple of .lambda./2 and which has opposing first and second ends for interconnecting with corresponding second and first ends, respectively, of a mating panel section, wherein a combined thickness of the first and second ends is equal to the thickness of the body portion. The panel section is preferably formed of thermoplastic material having a high dielectric constant and is thermoformed using a double mold.

Abstract: Downward projections made on two side walls of a cap are fitted into recesses in two opposed side faces of a substrate. Lower margins of two end walls of the cap are soldered to ground electrodes provided on a part mounting face of the substrate. Lower margins in the proximity of projections of the side walls of the cap are soldered to ground electrodes provided on the part mounting face above recesses of the substrate. Therefore, it is provided a high-frequency module that can produce a good electromagnetic shielding effect even in a high-frequency band.

Abstract: A microwave oscillator includes a substrate having a circuit pattern on the top surface, a thin copper foil covering the bottom surface, and a hole. An electronic component is mounted to the top surface of the substrate. A metal plate is attached to the bottom surface of the substrate thereby closing the bottom of the hole. A dielectric resonator is attached to the metal plate through the hole. Since the dielectric resonator is attached to the metal plate by soldering, the bond between the dielectric resonator and the metal plate is stronger and more stable than that achieved by using a conventional adhesive. This enhances the reliability against temperature changes; mechanical impact or humidity.

Abstract: A voltage controlled oscillator module (100) (400) provides tuning capability for the VCO in a shielded environment. The module includes a trimmable capacitor (110) (410) having metal plates (112, 114), (412, 414, 416) capacitively coupled through the substrate. One of the metal plates (114) (416) is a trimmable plate which can be trimmed to tune the VCO frequency. The trimmable metal plate (114) (416) remains exposed on the bottom surface (108) (408) of the substrate (104) (404) so that the frequency of the VCO can be tuned while the reminder of the oscillator circuitry (102) (402) on the top surface (106) (406) is encapsulated by a ground shield (116) (418).

Abstract: An oscillator is isolated from external mechanical and thermal effects by rrounding the oscillator on all sides with an aerogel insulation structure that provides both thermal insulation and vibrational isolation above some predetermined low frequency limit which is a function of the mass of the oscillator and the nature of the aerogel insulation structure.

Abstract: A voltage controlled oscillator module assembly (300) minimizes microphonics in a low profile package. Included within the module (300) are a substrate (302), VCO circuitry (308), and a ground shield (314) encapsulating the VCO circuitry. Included within the VCO circuitry (308) is at least one resonator (310) which is solderable on at least two of its surfaces. One surface of the resonator (310) is soldered to the substrate (302) while another surface of the resonator is soldered to the shield (314). An improved ground is thus provided to the resonator (310) which reduces the occurrences of microphonics while providing a low profile package for the module (300).

Abstract: For sufficiently shielding an undesired electro-magnetic wave from penetrating into a communication apparatus, for instance, a car telephone through stray coupling, or leaks therefrom, an electronic circuit substrate and a case of the communication apparatus are formed of flat plates which consist of insulating material comprising magnetic material. One side surface of the flat plates are covered with conductive films. The communication apparatus itself is accommodated in the case and an electric power source connecting cable is wrapped by a similar arrangement, so as to remarkably reduce obstructions caused by undesired waves and other communications in comparison with the conventional arrangement.

Abstract: In a voltage controlled oscillator, a dielectric resonator is mounted on a circuit board and a metal case is mounted on the circuit board to shield the dielectric resonator. The dielectric resonator comprises a C-shaped first electrode which is provided in a dielectric body, second and third electrodes which are arranged on upper and lower sides of the first electrode, a signal connecting pattern which is extended from the first electrode toward a side surface of the dielectric body, and earth connecting patterns which are extended from the first, second and third electrodes toward the side surface of the dielectric body, to provide predetermined impedance between the earth connecting pattern and the signal connecting pattern. The dielectric resonator is arranged with the second and third electrodes in parallel with a major surface of the circuit board, and the second electrode is upwardly exposed.

Abstract: A shielded microstrip assembly (100)includes a substrate 102 having a first ground plane surface (106) and a second surface (206) which includes a transmission line (216). A plurality of solder balls (104) provide electrical interconnection for the ground plane and for the terminals (210) and (212) of transmission line (216). The microstrip assembly (100) is then inverted and attached using solder balls (104) to a carrier (302). The inverted microstrip assembly (100) of the present invention provides for improved shielding, while maintaining the high Q and other advantages associated with a microstrip.

Abstract: An RF power-generator system for the frequency range of 2 to 30 MHz and a programmable sinusoidal power output of 0 to 1000 W. The system is constructed of modules (10, 30, 50, 70 and 90) accommodated in a shallow parallelepipedal housing (1) with a capacity of 4.6 l. The housing essentially comprises two lateral lengths (4) of structural section, a sheet-metal front (6), a sheet-metal bottom (5), and a lid. A crystal-controlled power-oscillator module (10) communicates by way of an RF line (121) with an intermediate module (30). The intermediate-amplifier module communicates by way of still another RF line (122) with a terminal power-amplifier module (50). The terminal power-amplifier module communicates by way of still another RF line (123) with a high-power filter (70). The filter communicates by way of still another RF line (124) with a high-power directional coupler (90). The RF power output can be intercepted at an RF plug (2).

Abstract: A piezoelectric oscillator in which radiation of higher harmonic components is reduced. A piezoelectric vibrator and a semiconductor device are provided in an oscillation circuit for making the piezoelectric vibrator oscillate, as is a filter for cutting components in a predetermined frequency band or higher harmonic components of an oscillation signal outputted from the semiconductor device. The piezoelectric vibrator, the semiconductor device and the filter are packed in one package. Radiation of the higher harmonic components is reduced by placing the filter close to the oscillator, by providing a shielding or by operating portions of the oscillator output circuit with a reduced supply voltage.

Abstract: An inductive type proximity switch (S) includes an open-ended loop (L3) adjacent to the inductor (L1, L2) of the parallel resonant circuit of its main (LC) oscillator. A high speed bistate switch (S1) is connected between the ends of the loop (L3). A pulsed input to the switch (S1) causes sequential making and breaking of a connection between the ends of the loop (L3) whereby the loop (L3) functions as a Faraday shield to inhibit mutual inductive linking of the inductor (L1, L2) with an inductor (L4) of a passive (LC) resonant circuit (L4, C4) of a target (T) when the target (T) is in proximity with the proximity switch (S) and the connection between the ends of the loop (L3) is made by the bistate switch (S1).

Abstract: In an oscillator employing a triplate type stripline, earth (ground) electrodes are formed only on an opposite pair of side surfaces of a substrate in which the stripline is embedded. An oscillation circuit mounted on the substrate is covered with a shielding case and the remaining side surfaces of the substrate, which are provided with no earth electrodes, are covered with shielding plates which are provided on the shielding case. Connecting portions of the shielding case are electrically connected with the earth electrodes by soldering. Thus, the stripline is electromagnetically shielded in a simple manner so that it is possible to easily manufacture an oscillator employing a stripline at a low cost.

Abstract: An arrangement for stabilizing the oscillation frequency and phase of a high frequency oscillator comprising a shielding case of aluminum formed by die casting and having side walls and a base, a plurality of partition walls integrally formed with the shielding case, a printed circuit board securely mounted on the partition walls, and a high frequency oscillator securely mounted on the printed circuit board. The high frequency osilllator is encompassed with and shielded by the side walls and base of the shielding case, the partition walls, and the printed circuit board.

Abstract: A conductive and mechanical energy absorbing gasket is used between an electronics package and a cover of an enclosure to provide microphonics isolation. The electronics package is secured to the cover via a gasket using isolation damping grommets and screws, so that the only substantial transmission of mechanical energy from the case to the electronic package is through the screws themselves. The conductivity of the gasket places the entire enclosure at the same potential as the metal in the electronic package and as the mounting screws, and thus helps prevent the screws from acting as RF antennas.

Abstract: A meter for sheet conductance measurements does not touch the conductive surface of a sample. A probe having a resonant tank coil is positioned against a parallel supporting surface of the sample, which may be flat or curved and of unrestricted area. An oscillator incorporating the tank coil is controlled to stabilize oscillator amplitude in response to eddy current loading by the sample. An electrostatic shield in a finger configuration prevents capacitive coupling between the tank coil and the sample without hindering magnetic coupling. A readout of sheet conductance is driven by the oscillator control. Direct current can be coupled to the tank coil for temperature control preventing undesired resistance changes in the tank coil. The oscillator can be controlled by an optically coupled variable gain element. Measurements can be made with the tank coil up to at least 0.75 inch from the conductive surface of the sample.

Abstract: A microwave solid-state oscillator includes a casing hermetically enclosing a microwave oscillation device and a dielectric resonator electromagnetically coupled with the microwave oscillation device, an output terminal leading out an oscillation output from said casing, and a microwave terminal electromagnetically coupled to the dielectric resonator, one end of which is connected to a microwave line having a terminating admittance at the outside of the casing.

Abstract: In an apparatus having an insulative substrate, a power circuit is mounted on one surface of the substrate and connected to receive power from a mains supply for rectifying the AC energy of the supply and supplying the rectified energy to a pair of power lines. A high frequency source is mounted on the same surface as the power circuit and electrically connected to the power lines for converting the rectified energy into oscillation energy. A shield casing, which is electrically connected to one of the power lines which is lower in impedance than the other, encases the high frequency source. A conductor, printed on the other surface of the substrate, is substantially aligned with a portion of the shield casing which is positioned between the power circuit and the high frequency source, the conductor being electrically connected to the power line having the lower impedance to suppress radiation which would otherwise leak through a gap between the shield casing and the substrate.

Abstract: Noise potentials and radiation in an ultrasonic nebulizer are reduced by separating the oscillator and power supply and shielding the former, with one of the DC power lines to the oscillator passing through an aperture in the metal casing that shields the oscillator, while the other power supply line is connected to that casing. Oscillator control may be achieved by an unshielded variable resistor coupled by conductors of extended length to the oscillator by a filter circuit.

Abstract: An N-channel MOS monolythic R.F. Modulator for use in television games or the like is provided which internally generates an R.F. carrier signal and modulates same in accordance with the composite video output signal from the T.V. interface chip. The modulator utilizes two depletion mode MOSFETs connected in a cascode configuration, the output circuits of which are connected in series with an inductor, between a voltage source and ground. The input terminal of one of the transistors receives the composite video signal. The input terminal of the second transistor is connected to a resonant frequency circuit. The resonant frequency circuit is electromagnetically coupled to the inductor such that the current flowing through the inductor impresses a current in the resonant frequency circuit to cause same to generate the R.F. carrier signal.