Abstract: An oscillator includes: a resonator; an oscillation circuit configured to generate an oscillation signal by the resonator; a clock output terminal; an output circuit configured to output a clock signal to an external processing device via the clock output terminal; a first terminal; and an interface circuit configured to execute communication with the processing device by a data signal. In the communication, the output circuit outputs the clock signal to the processing device that is a master for the communication, and the interface circuit that is a slave for the communication receives, via the first terminal, the data signal that is transmitted from the processing device and synchronized with the clock signal, or transmits, via the first terminal, the data signal to the processing apparatus in synchronization with the clock signal.

Abstract: A vibrator device includes a semiconductor substrate, a vibrator element, a circuit element, a wiring, a processing circuit, and a through electrode. The semiconductor substrate has a first surface and an opposite-side second surface of the semiconductor substrate from the first surface. The vibrator element is provided at the first surface. The circuit element is provided at the first surface and includes an oscillation circuit. The wiring is provided at the first surface and electrically couples the vibrator element and the oscillation circuit. The processing circuit is provided at the second surface and processes an output signal of the oscillation circuit. The through electrode penetrates the semiconductor substrate and electrically couples the oscillation circuit and the processing circuit.

Abstract: The present disclosure provides a semiconductor package structure. The semiconductor package structure includes a substrate, a first electronic component and a support component. The first electronic component is disposed on the substrate. The first electronic component has a backside surface facing a first surface of the substrate. The support component is disposed between the backside surface of the first electronic component and the first surface of the substrate. The backside surface of the first electronic component has a first portion connected to the support component and a second portion exposed from the support component.

Abstract: A temperature sensing circuit of a data storage system includes a temperature sensor, a digital-to-analog circuit, and a reference generation and trimming circuit configured to generate a common mode voltage (VCM), a positive reference voltage (VREFP), and a negative reference voltage (VREFN) using a single band gap reference signal. The trimming circuit is configured to trim the VCM, VREFP, and VREFN by adjusting a VC trim signal to increase the VCM until a VCM error is below a threshold; adjusting a high temperature trim signal to increase the VREFP and decrease the VREFN until a digital temperature signal associated with the digital-to-analog circuit attains a predetermined accuracy level for a first temperature; and adjusting a low temperature trim signal to increase the VREFP, VCM, and VREFN until the digital temperature signal attains a predetermined accuracy level for a second temperature.

Abstract: A vibration actuator includes a vibrator including an elastic body and an electro-mechanical energy conversion element; a contact body provided so as to be brought into contact with the vibrator; a flexible printed board configured to feed power to the electro-mechanical energy conversion element; and a temperature detection unit provided on a region of the flexible printed board, in which the flexible printed board and the electro-mechanical conversion element overlap each other.

Abstract: An oscillator includes: a resonator; a heat generation circuit configured to heat the resonator; a temperature sensor positioned closer to the heat generation circuit than the resonator is and configured to output a temperature detection signal; a temperature control circuit configured to output a temperature control signal for controlling a temperature of the heat generation circuit based on the temperature detection signal; an oscillation clock signal output circuit configured to oscillate the resonator and output an oscillation clock signal; and a correction circuit configured to correct a frequency variation of the oscillation clock signal, in which the correction circuit is configured to compensate for a transient frequency variation of the oscillation clock signal based on a time change amount of the temperature detection signal or a time change amount of the temperature control signal.

Abstract: An oscillator circuit includes a bias circuit, a signal generation circuit, and a control circuit. The bias circuit is configured to generate a reference voltage based on a reference current and a bias resistor. The signal generation circuit is configured to generate a bias current based on the reference current, perform charging and discharging of a capacitor using the bias current, and generate an oscillation signal based on the charging and the discharging of the capacitor. The control circuit is configured to generate a control signal having a constant discharging time, based on the reference voltage and the oscillation signal, controlling the charging and the discharging of the capacitor.

Abstract: A frequency reference oscillator device and method of providing a frequency reference signal. The oscillator device includes a first oscillator including a first resonator having first long-term stability and a first frequency-vs-temperature turnover temperature, the first oscillator being capable of providing a first frequency signal. Further, the device includes and a second oscillator including a second resonator having second long-term stability, which is inferior to the first long-term stability, and a second frequency-vs-temperature turnover temperature, the second oscillator being capable of providing a second frequency signal.

Abstract: A piezoelectric oscillation device includes a piezoelectric vibration element, a heating element that heats the piezoelectric vibration element, an electronic component that is electrically connected to the piezoelectric vibration element, a substrate on which the piezoelectric vibrator, the heating element, and the electronic component are mounted, and a base member to which the substrate is attached with a prescribed spacing therebetween via a substrate holding member. The substrate holding member includes a conductive part. The conductive part has a lower thermal conductivity than metal.

Abstract: An epoxy composition may comprise a resin composition comprising a diglycidyl ether of bisphenol AF and at least one of a filler, a fire resistant component, a chain extender, a conductivity modifier, and a dye. The resin composition may further comprise at least one diglycidyl ether of bisphenol A and bisphenol F.

Abstract: It is desired to even further attempt to stabilize temperature in oscillator such as OCXOs (Oven Controlled Crystal Oscillators). A temperature controlling apparatus is provided. The temperature controlling apparatus includes: a temperature sensor; a power supply circuit that supplies, to a first heater, power corresponding to a difference between a target value and a detected value obtained from the temperature sensor; and a second heater that is provided at a position such that thermal conduction therefrom to the temperature sensor is faster than that from the power supply circuit, and changes power consumption of the second heater according to power consumption of the power supply circuit.

Abstract: A circuit device includes an A/D conversion section adapted to perform an A/D conversion of a temperature detection voltage from a temperature sensor to output temperature detection data, a processing section adapted to perform a temperature compensation process of an oscillation frequency based on the temperature detection data to output frequency control data of the oscillation frequency, and an oscillation signal generation circuit adapted to generate an oscillation signal using the frequency control data and a resonator. The processing section may change the frequency control data in increments of k×LSB (k?1) based on a change in temperature.

Abstract: The systems and methods of oscillator frequency tuning using a bulk acoustic wave resonator include a relaxation oscillator, a BAW oscillator, a frequency counter, and an adjustment module. The BAW oscillator provides an accurate time reference even over temperature changes. The BAW oscillator is turned on periodically and the relaxation oscillator is calibrated with the BAW oscillator. A temporary and periodic enablement of the BAW oscillator maintains a low current consumption. The frequency counter counts a number of full periods of the BAW oscillator that occur in one period of the relaxation oscillator. Since each frequency is known, the number of pulses of the BAW oscillator that should occur during one period of the relaxation oscillator is known. If the count is different from what should be counted, a correction may be made by adjusting an input parameter of the relaxation oscillator.

Abstract: An oscillator includes an oscillation element, an oscillation circuit, a heat generation element, a temperature control circuit, and a temperature correction signal generation circuit adapted to generate a temperature correction signal used to correct a frequency-temperature characteristic. The temperature correction signal generation circuit includes a temperature sensor, a first-order correction signal generation circuit adapted to generate a first-order correction signal, and a high-order correction signal generation circuit adapted to generate a high-order correction signal.

Abstract: An electronic device includes a resonator provided with a heating element, and a circuit component opposed to the heating element, and provided with at least an oscillating amplifier element, and a distance between the heating element and the circuit component is in a range not smaller than 0 mm and no larger than 1.5 mm.

Abstract: An electronic device includes a heat generator having a terminal, a resonator which has an outer connection terminal and on which the heat generator is disposed, a first substrate having a first surface and a second surface with the resonator connected to the first surface, and a circuit part and other electronic parts disposed on the first surface or the second surface. The outer connection terminal of the resonator is connected to the first surface, and the terminal of the heat generator is connected to the second surface.

Abstract: A quartz crystal oscillator as a resonation device includes a substrate, a quartz crystal resonator as a resonator attached with a heating element, terminals adapted to fix the resonator and the substrate to each other, and intermediate members having an electrical insulation property and lower in thermal conductivity than the terminals. The intermediate members intervene between the resonator and the substrate via the terminals, and a gap is disposed between the quartz crystal resonator and the substrate.

Abstract: A method of providing an oscillating signal, comprising providing a first constant current flowing from a positive power supply node, the first constant current independent of a variation in a positive power supply node voltage, providing a second constant current flowing from a positive power supply node to a second electrode of a capacitor, a first electrode of the capacitor connected directly to the positive power supply node, the second constant current mirroring the first constant current and charging the capacitor by reducing a voltage across the capacitor. A third constant current is provided flowing from the positive power supply node through a first NMOS transistor and mirroring the first constant current, the first NMOS transistor having a gate connected directly to the second electrode of the capacitor and an oscillating signal generated by turning on the first NMOS transistor when the capacitor reaches a predetermined voltage level.

Abstract: A crystal oscillator includes: an oscillation circuit; first and second oscillation circuits connected to first and second temperature detection crystal units, respectively; a heating portion configured to constantly maintain an ambient temperature; a frequency difference detection portion that obtains, as a temperature detection value, “{(f2?f1)/f1}?{(f2r?f1r)/f1r}”, where “f1” and “f2” denote oscillation frequencies of the first and second oscillation circuits, respectively, and “f1r” and “f2r” denote oscillation frequencies of the first and second oscillation circuits, respectively, at a reference temperature; an accumulator that accumulates the temperature detection value; a rounding processing portion that performs rounding for the temperature detection value accumulated in the accumulator depending on a rounding factor designated independently from the accumulation number; and a heating control portion that controls power supplied to the heating portion based on the temperature detection value subjected

Abstract: Apparatus, systems, and methods are provided for sensing devices. An exemplary sensing device includes a sensing arrangement on a substrate to sense a first property, a heating arrangement, and a control system coupled to the first sensing arrangement and the heating arrangement to activate the heating arrangement to heat the first sensing arrangement and deactivate the heating arrangement while obtaining one or more measurement values for the first property from the first sensing arrangement.

Abstract: An oscillator outputs a control signal to suppress an influence caused by temperature characteristic of f1 based on a differential signal corresponding to difference between an oscillation output f1 of a first oscillator circuit and an oscillation output f2 of a second oscillator circuit treated as a temperature detection value. A switching unit switches between a first state and a second state. The first state is a state where a first connecting end and a second connecting end are connected to a storage unit for access from an external computer to the storage unit. The second state is a state where the first connecting end and the second connecting end are connected to a first signal path and a second signal path such that the respective f1 and f2 are retrieved from the first connecting end and the second connecting end to an external frequency measuring unit.

Abstract: The present invention discloses an Oven Controlled Crystal Oscillator and a manufacturing method thereof. The Oven Controlled Crystal Oscillator comprises a thermostatic bath, a heating device, a PCB and a signal generating element, where the signal generating element is used for generating a signal of a certain frequency, the heating device, the PCB and the signal generating element are mounted in the thermostatic bath, the signal generating element is mounted in a groove formed on one side of the PCB, while the heating device is mounted against the other side of the PCB that is opposite to the groove. The signal generating element may be a passive crystal resonator or an active crystal oscillator. The Oven Controlled Crystal Oscillator according to the invention is advantageous for a small volume and a high temperature control precision.

Abstract: A method of operating a system including a MEMS device of an integrated circuit die includes generating an indicator of a device parameter of the MEMS device in a first mode of operating the system using a monitor structure formed using a MEMS structural layer of the integrated circuit die. The method includes generating, using a CMOS device of the integrated circuit die, a signal indicative of the device parameter and based on the indicator. The device parameter may be a geometric dimension of the MEMS device. The method may include, in a second mode of operating the system, compensating for a difference between a value of the signal and a target value of the signal. The method may include re-generating the indicator after exposing the MEMS device to stress and generating a second signal indicating a change in the device parameter.

Abstract: A method and device for calibrating an oscillator and a temperature sensor in an electronic device are provided. A same temperature cycle, which includes at least two distinct temperatures, may be used to obtain data to calibrate both the oscillator and the temperature sensor. One of the distinct temperatures may comprise an ambient temperature, and a second distinct temperature may comprise a heated temperature greater than the ambient temperature. The electronic device (or a calibration device separate from the electronic device) may receive the readings from the oscillator and the temperature sensor at the two distinct temperatures in the same temperature cycle, and may determine an oscillator correction factor and a temperature sensor correction factor.

Abstract: A period signal generation circuit including a control voltage generator and a period controller. The control voltage generator selecting one of temperature-dependent voltages to output the selected temperature-dependent voltage as a control voltage. The first and second temperature-dependent voltages varying according to a temperature and the third temperature-dependent voltage is constant regardless of variation of the temperature. The period controller configured to determine an amount of a current discharging from an internal node in response to the control voltage and outputs a periodic signal whose cycle time is determined according to a level of an internal signal induced at the internal node.

Abstract: An oscillator according to the disclosure includes a crystal unit, an IC chip, an adhesive agent flow prevention film, and a lead frame. The lead frame is disposed in a peripheral area of the pair of crystal terminals and the IC chip in an approximately same surface as the one surface of the flat container of the crystal unit. The lead frame includes a wiring part that is connected to an IC terminal of the IC chip by a bonding wire and is buried in the resin mold, and a mounting terminal forming portion that extends from the wiring part and is folded along an outside of the resin mold in a back surface that is another surface side opposite to the one surface of the crystal unit so as to form a mounting terminal.

Abstract: A temperature control circuit of an oven controlled crystal oscillator is a circuit in which a supply voltage is applied to a first terminal of a resistance R10, a first terminal of a resistance R11, and a first terminal of a heater resistance RH1, a second terminal of a thermistor TH1, a second terminal of a temperature sensing element, and a collector side of a transistor Q2 are connected to a common ground, a first terminal of a temperature sensing element ZZ is connected to an input terminal of an operational amplifier IC2, and a setting temperature in a thermostatic oven is controlled to gradually rise as an ambient operative temperature rises.

Abstract: There is provided an oscillator capable of lowering the power supply voltage without degrading the phase noise, while employing the conventional circuit configuration. According to one aspect of the present invention, there is provided an oscillator comprising: an oscillation circuit; a bias generation circuit for generating a bias signal to drive the oscillation circuit; and a booster circuit for boosting a power supply voltage to generate a boosted voltage for driving the bias generation circuit. In addition, the oscillation circuit, the bias generation circuit, and the booster circuit are provided in a single IC chip, and the booster circuit may receive the power supply voltage VDD from the power supply arranged at the exterior of the IC chip.

Abstract: A crystal controlled oscillator includes a crystal unit, an oscillator circuit, a temperature detector for crystal unit, a heating unit for crystal unit, a temperature detector for oscillator circuit, and a heating unit for oscillator circuit. The heating unit for crystal unit is configured to control an output of the crystal unit based on a temperature detected by the temperature detector for crystal unit to compensate the temperature of the atmosphere where the crystal unit is placed to be constant. An output of the heating unit for oscillator circuit is controlled independently from the heating unit for crystal unit based on a temperature detected by the temperature detector for oscillator circuit to compensate the temperature of the atmosphere where the oscillator circuit is placed to be constant.

Abstract: An oven controlled crystal oscillator (OCXO) is provided for improving temperature characteristics of a frequency. In the OCXO, a thermostatic oven 5 (20a) is provided in a thermostatic oven 9 (20b), a temperature control circuit 13 controls a temperature in the thermostatic oven 9 based on a temperature detected by a temperature sensing element 10, a first resonator 1 and a second resonator 2 are provided in the thermostatic oven 5, a temperature control circuit 8 controls the temperature based on an oscillation frequency difference between the two resonators, and especially, the temperature control circuit 13 controls the temperature to be within the temperature region where the oscillation frequency difference between the first resonator 1 and the second resonator 2 corresponds with the resonator temperature in a one-to-one manner, and the temperature gradient is either in a positive direction or in a negative direction.

Abstract: An electronic device includes a heat generator having a terminal, a resonator which has an outer connection terminal and on which the heat generator is disposed, a first substrate having a first surface and a second surface with the resonator connected to the first surface, and a circuit part and other electronic parts disposed on the first surface or the second surface. The outer connection terminal of the resonator is connected to the first surface, and the terminal of the heat generator is connected to the second surface.

Abstract: A technique decouples a MEMS device from sources of strain by forming a MEMS structure with suspended electrodes that are mechanically anchored in a manner that reduces or eliminates transfer of strain from the substrate into the structure, or transfers strain to electrodes and body so that a transducer is strain-tolerant. The technique includes using an electrically insulating material embedded in a conductive structural material for mechanical coupling and electrical isolation.

Abstract: A technique decouples a MEMS device from sources of strain by forming a MEMS structure with suspended electrodes that are mechanically anchored in a manner that reduces or eliminates transfer of strain from the substrate into the structure, or transfers strain to electrodes and body so that a transducer is strain-tolerant. The technique includes using an electrically insulating material embedded in a conductive structural material for mechanical coupling and electrical isolation. An apparatus includes a MEMS device including a first electrode and a second electrode, and a body suspended from a substrate of the MEMS device. The body and the first electrode form a first electrostatic transducer. The body and the second electrode form a second electrostatic transducer. The apparatus includes a suspended passive element mechanically coupled to the body and electrically isolated from the body.

Abstract: A device for compensating temperature drift of a voltage controlled oscillator (VCO) is provided. The VCO has at least one varactor arranged for controlling an output frequency fOut of said VCO by applying a tuning voltage VTune and simultaneously applying a bias voltage VBias on a cathode and an anode of said at least one varactor, respectively. Said device comprises a monitoring circuit and a tuning circuit. Said monitoring circuit has an input arranged to receive said VTune and is arranged to monitor said VTune and further is arranged to activate said tuning circuit based on a value of said VTune, and said tuning circuit has an output connected to said anode and is arranged to output said VBias, wherein said tuning circuit further is arranged to tune said VCO by changing said VBias so as to compensate for a temperature drift of said VCO.

Abstract: The invention relates to a frequency generator assembly, including at least one oscillator and an electronic signal processing device, which is designed in such a way that the electronic signal processing device provides an electric clock signal (f) having a defined frequency as an output signal of the frequency generator assembly, wherein the defined frequency depends on the vibration frequency of the oscillator, wherein the oscillator includes at least one micromechanical seismic mass which is vibrationally excited by at least one driving device, whereupon the electronic signal processing device generates and provides the electric clock signal (f) according to the vibration frequency of the at least one seismic mass.

Abstract: A low phase noise dual mode resonator and a method of making and using said resonator is disclosed. The dual mode resonator is capable of sustaining two frequency vibration modes simultaneously. The two frequency vibration modes are capable of exhibit non-linear coupling when one is driven at a higher voltage than the other. The dual mode resonator is configured such that the ratio of the two vibration frequency modes is a value that maximizes the non-linear coupling effect. As a result of the non-linear effect, the phase noise on the mode that is not overdriven is reduced.

Abstract: The present invention discloses an Oven Controlled Crystal Oscillator and a manufacturing method thereof. The Oven Controlled Crystal Oscillator comprises a thermostatic bath, a heating device, a PCB and a signal generating element, where the signal generating element is used for generating a signal of a certain frequency, the heating device, the PCB and the signal generating element are mounted in the thermostatic bath, the signal generating element is mounted in a groove formed on one side of the PCB, while the heating device is mounted against the other side of the PCB that is opposite to the groove. The signal generating element may be a passive crystal resonator or an active crystal oscillator. The Oven Controlled Crystal Oscillator according to the invention is advantageous for a small volume and a high temperature control precision.

Abstract: An electronic device includes a resonator provided with a heating element, and a circuit component opposed to the heating element, and provided with at least an oscillating amplifier element, and a distance between the heating element and the circuit component is in a range not smaller than 0 mm and no larger than 1.5 mm.

Abstract: An electronic device includes: a substrate; a resonation device; a heating element; a first support which is mounted on the substrate and supports the resonation device; and a second support which supports the substrate, in which the relationship between thermal conductivity ?1 of the first support and thermal conductivity ?2 of the second support satisfies an expression, ?1>?2.

Abstract: An oscillator includes an oscillation element; an oscillation circuit which causes the oscillation element to oscillate; a heat generation element which heats the oscillation element; a temperature control circuit which controls the heat generation element; and a temperature correction circuit which corrects frequency-temperature characteristics of an output signal of the oscillation circuit.

Abstract: A crystal oscillator includes: an oscillation circuit; first and second oscillation circuits connected to first and second temperature detection crystal units, respectively; a heating portion configured to constantly maintain an ambient temperature; a frequency difference detection portion that obtains, as a temperature detection value, “{(f2?f1)/f1}?{(f2r?f1r)/f1r}”, where “f1” and “f2” denote oscillation frequencies of the first and second oscillation circuits, respectively, and “f1r” and “f2r” denote oscillation frequencies of the first and second oscillation circuits, respectively, at a reference temperature; an accumulator that accumulates the temperature detection value; a rounding processing portion that performs rounding for the temperature detection value accumulated in the accumulator depending on a rounding factor designated independently from the accumulation number; and a heating control portion that controls power supplied to the heating portion based on the temperature detection value subjected

Abstract: A quartz crystal oscillator as a resonation device includes a substrate, a quartz crystal resonator as a resonator attached with a heating element, terminals adapted to fix the resonator and the substrate to each other, and intermediate members having an electrical insulation property and lower in thermal conductivity than the terminals. The intermediate members intervene between the resonator and the substrate via the terminals, and a gap is disposed between the quartz crystal resonator and the substrate.

Abstract: An electronic device includes: a support member including a first terminal, a second terminal, and a support portion extending from the first terminal and coupling the first terminal with the second terminal; an electronic component; and a bonding member connecting the first terminal with the electronic component. In a plan view along a direction in which the first terminal and the electronic component overlap each other, a portion of the first terminal is adjacent to the support portion with a notch portion therebetween and protrudes toward the extending direction side of the support portion. The support portion is bent at a portion adjacent to the protruding portion of the first terminal along the overlapping direction.

Abstract: Systems, methods, and assemblies to provide clock signals to electrical components of downhole tools are provided. In one example, an oscillator assembly may include a silicon-based oscillator having a variable capacitor circuit. The silicon-based oscillator may provide an output signal at a frequency within a range of frequencies. The oscillator assembly may also include control circuitry electrically coupled to the silicon-based oscillator. Moreover, the control circuitry may include a temperature input that receives a temperature corresponding to the silicon-based oscillator. The control circuitry may also include a control signal output electrically coupled to the silicon-based oscillator. The control signal output may be used to change a capacitance of the variable capacitor circuit based on the temperature received by the temperature input to maintain the output signal of the silicon-based oscillator within the range of frequencies.

Abstract: A crystal unit and a thermistor with negative resistance-temperature characteristics are housed in a thermostatic oven heated by a heater. A transistor driving the heater is controlled by an output of a differential amplifier, the thermistor is placed between a power supply voltage and an inverting input of the amplifier, and a first resistor used to adjust the temperature of a zero temperature coefficient point of the crystal unit is installed between the inverting input and a ground point. A second resistor is installed between the power supply voltage and a non-inverting input of the amplifier and a third resistor is installed between the non-inverting input and ground point. One of the second and third resistors is a resistor assembly made up of a plurality of resistance elements and one of these resistance elements is provided with positive resistance-temperature characteristics and adapted to detect ambient temperature.

Abstract: A MEMS resonator comprises a resonator body (34), and an anchor (32) which provides a fixed connection between the resonator body (34) and a support body. A resistive heating element (R1,R2) and a feedback control system are used to maintain the resonator body (34) at a constant temperature. A location for thermally coupling the anchor (32) to the resistive heating element (R1,R2) is selected which has a lowest dependency of its temperature on the ambient temperature during the operation of the feedback control.

Abstract: A temperature invariant digitally controlled oscillator is disclosed. The digitally controlled oscillator is configured to generate an output clock with stable frequency. The temperature invariant digitally controlled oscillator comprises a digitally controlled oscillator, a temperature sensor, a temperature decision logic circuit, and a temperature conditioner. The digitally controlled signal is provided to adjust the oscillation frequency of the digitally controlled oscillator by changing its capacitances. The stabilization of the silicon temperature is achieved with the temperature sensor, the temperature decision logic circuit, and the temperature conditioner.

Abstract: An electronic device may include a voltage controlled oscillator (VCO) and a temperature sensor. The electronic device may also include a controller configured to cooperate with the VCO and the temperature sensor to determine both a temperature and a frequency error of the VCO for each of a plurality of most recent samples. Each of the most recent samples may have a given age associated therewith. The controller may also be configured to align the temperature, the frequency error, and the given age for each of most recent samples in a three-dimensional (3D) coordinate system having respective temperature, frequency error and age axes. The controller may also be configured to estimate a predicted frequency error of the VCO based upon the aligned temperature, frequency error, and given age of the most recent samples.

Abstract: An oscillator IC includes a VDD terminal (first terminal), an OUT terminal (second terminal), an oscillation circuit for oscillating a resonator element, a mode switching circuit that switches between a normal mode (the first mode in which an oscillation signal output by the oscillation circuit is output from the OUT terminal) and a serial I/F mode (the second mode in which a signal than the oscillation signal is output or input from the OUT terminal) based on a voltage of the VDD terminal, and a control circuit that controls stop of the oscillation circuit in the serial I/F mode based on setting information that can be changed from outside.

Abstract: An oscillation device is provided. The oscillation device includes: a main circuit portion, a heating unit, first and second crystal units, first and second oscillator circuits, a frequency difference detector, a first addition unit, an integration circuit unit, a circuit unit configured to control an electric power to be supplied to the heating unit, a compensation value obtaining unit, and a second addition unit. The compensation value obtaining unit is configured to obtain a frequency compensation value for compensating an output frequency of the main circuit portion based on an integrated value output from the integration circuit unit, and based on a change in the clock signal due to a difference between the temperature of the atmosphere and the temperature setting value of the heating unit. The second addition unit is configured to add the frequency compensation value to a frequency setting value.