Abstract: A surge arrester comprising stacked arrester units is provided that is that is easy to assemble. For that, a surge arrester comprises stacked arrester units, a capacitor, and a resilient element, where the resilient element electrically and mechanically connects the capacitor with a node of the arrester stack.

Abstract: Provided is a non-linear resistive element which improves the degree of freedom of design of its mounting space. A ceramic sheet 10 which constitutes the non-linear resistive element is configured by a plurality of ceramic pieces 11 being consolidated in a plate like form by an insulating resin 12. One or a plurality of ceramic pieces 11 configure each of a plurality of conductive paths which penetrate the ceramic sheet 10 in a thickness direction thereof, and the ceramic pieces 11 which configure both ends of the conductive paths partially projects from the insulating resin 12.

Abstract: There is provided an array type chip resistor including: a chip body, four pairs of lower electrodes disposed on both sides of a lower surface of the chip body and formed so as to be extended to edges of the chip body, side electrodes formed so that the lower electrodes are extended to sides of the chip body, and a resistor interposed between the lower electrodes on the lower surface of the chip body and electrically connected to the lower electrode through a contact portion, wherein when a width of the side electrode is defined as d1, a distance between adjacent side electrodes is defined as d2, and a height of the side electrode is defined as h, in the case in which d1/d2 is 0.5 to 1.5, a value of h is 4,300/d1 ?m or above and is 0.24d2+87.26 ?m or less.

Abstract: A method of manufacturing a chip resistor includes forming a resistor assembly in which a conductive member including portions separated from each other in a first direction is provided in a resistance body member; and dividing the resistor assembly into chip resistors, each including a chip-shaped resistance body formed by a part of the resistance body member, a pair of main electrodes formed by a part of the conductive member and separated from each other in the first direction, and a pair of sub-electrodes formed by a part of the conductive member, separated from each other in the first direction, and adjacent to the main electrodes in a second direction perpendicular to the first direction with concave portions recessed in the first direction interposed therebetween, by punching.

Abstract: The invention relates to a current-sensing resistor (1) for measuring an electric current, in particular also for measuring a battery current in a vehicle power supply, having a plate-shaped first connecting part (3) for introducing the electrical current to be measured, wherein the plate-shaped first connecting part (3) consists of an electrically conductive conductor material; a plate-shaped second connecting part (2) for conducting away the electrical current to be measured, wherein the plate-shaped second connecting part (2) consists of an electrically conductive conductor material; and a plate-shaped resistance element (4), which is connected in the current path between the two connecting parts and through which the electrical current to be measured flows, wherein the resistance element (4) consists of a comparatively high-impedance resistance material.

Abstract: An integrated assembly includes a resistor and a heat spreader. The resistor includes a resistive element and terminals. The heat spreader is integrated with the resistor and includes a heat sink of thermally conducting and electrically insulating material and terminations of a thermally conducting material and situated at an edge of the heat sink. At least a portion of a top surface of the resistive element is in thermally conductive contact with the heat sink. Each resistor terminal is in thermally conductive contact with a corresponding termination of the heat sink. A method of fabricating an integrated assembly of a resistor and a heat spreader includes forming the heat spreader, forming the resistor, and joining the heat spreader to the resistor by bonding at least a portion of a top surface of the resistive element to the heat sink and bonding each electrically conducting terminal to a corresponding termination.

Abstract: An embodiment of an apparatus for providing a variable resistance may be configured to provide a resistance value according to a binary-coded decimal scheme. The apparatus may be referred to herein as a BCD variable resistance apparatus. The BCD variable resistance apparatus may include a plurality of resistive elements and a plurality of switches. In an embodiment, the resistive elements may be coupled with respective switches in a binary-coded decimal scheme.

Abstract: Provided is a non-linear resistive element which improves the degree of freedom of design of its mounting space. A ceramic sheet 10 which constitutes the non-linear resistive element is configured by a plurality of ceramic pieces 11 being consolidated in a plate like form by an insulating resin 12. One or a plurality of ceramic pieces 11 configure each of a plurality of conductive paths which penetrate the ceramic sheet 10 in a thickness direction thereof, and the ceramic pieces 11 which configure both ends of the conductive paths partially projects from the insulating resin 12.

Abstract: A variable speed toggle switch that allows a user to reverse a rotational direction of a motor and supply variable amounts of power to a motor, such as in a power tool, for example, a power drill. A trigger can include a gear segment that meshingly engages a gear on a potentiometer to electrically communicate the actuation direction and actuation amount of the trigger to a microprocessor. The microprocessor can then signal to an H-bridge, or to a series of transistors, the actuation direction and actuation amount of the trigger. A motor or other device can be powered by a power source in an amount corresponding to the actuation amount, and in a direction corresponding to the actuation direction of the trigger.

Abstract: The present invention relates to a current sensing resistor made by an electrically conductive metal plate, and the current sensing resistor comprising: a middle portion; a first portion with a first slot located at one side of the middle portion; and a second portion with a second slot located at the other side of the middle portion opposite to the first portion; wherein each of the first and second portions is divided into a current terminal and a sensing terminal by the first and second slots respectively, and the current terminals of the first and second portions have a length greater than that of the sensing terminals of the first and second portions; characterized in that the middle portion has a middle slot and the length of the middle slot can be used for controlling the stability of resistance for the current sensing resistor.

Abstract: A variable speed toggle switch that allows a user to reverse a rotational direction of a motor and supply variable amounts of power to a motor, such as in a power tool, for example, a power drill. A trigger can include a gear segment that meshingly engages a gear on a potentiometer to electrically communicate the actuation direction and actuation amount of the trigger to a microprocessor. The microprocessor can then signal to an H-bridge, or to a series of transistors, the actuation direction and actuation amount of the trigger. A motor or other device can be powered by a power source in an amount corresponding to the actuation amount, and in a direction corresponding to the actuation direction of the trigger.

Abstract: A system for measuring electrical properties of a power line comprising a first wire and a second wire. The system comprises a sensor unit configured for connection to the first wire; and an elongated resistive element comprising a first end configured for connection to the sensor unit and a second end configured for connection to the second wire, the elongated resistive element having a distributed resistance. The first wire may be a hot wire and the second wire may be a hot wire or a neutral wire.

Abstract: The present invention relates to a current sensing resistor made by an electrically conductive metal plate, and the current sensing resistor comprising: a middle portion; a first portion with a first slot located at one side of the middle portion; and a second portion with a second slot located at the other side of the middle portion opposite to the first portion; wherein each of the first and second portions is divided into a current terminal and a sensing terminal by the first and second slots respectively, and the current terminals of the first and second portions have a length greater than that of the sensing terminals of the first and second portions; characterized in that the middle portion has a middle slot and the length of the middle slot can be used for controlling the stability of resistance for the current sensing resistor.

Abstract: A method for manufacturing terminals for electric resistors consists in preparing a piece of substantially pure copper; reducing the thickness, by cold pressing, of the piece so as to obtain from it at least one thick part and one thin part designed to form the tip of an electrical terminal to be obtained; obtaining, by rolling, a groove which is central to the thick part; and tapering, by rolling, the thin portion.

Abstract: There are provided a resistor and a method of fabricating the same. The resistor includes: a substrate; a lower resistant material layer formed on the upper portion of the substrate; an insulating layer to be stacked on the upper portion of the lower resistant material layer; an upper resistant material layer to be stacked on the upper portion of the insulating layer; and two penetration parts vertically penetrating through the insulating layer, wherein the penetration part is filled with a resistant material having the same component as that of the lower resistant material layer and the upper resistant material layer to electrically connect the upper resistant material layer to the lower resistant material layer.

Abstract: An overcurrent protective wire wound resistor has a core, a second contact cap and a resistance wire. A first contact cap and a resistor connection seat are respectively mounted on two ends of a rod of the core. A low melting-point conductive layer is mounted around the rod and connected with the first contact cap and the resistor connection seat. A high-temperature contractive insulation layer is mounted around the low melting-point conductive layer and the first contact cap. The second contact cap is mounted around the contractive insulation layer. The resistance wire is connected to the resistor connection seat and the second contact cap. When current through the resistance wire abnormally increases, high temperature of the resistance wire melts the low melting point conductive layer to shrink the contractive insulation layer and open the low melting-point conductive layer and the resistor, thereby protecting the circuit connected to the resistor.

Abstract: The present invention relates in general to the field of integrated circuits, and more specifically to a meander resistor. Basically, a meander resistor can be considered as a bar resistor with the exception of the corner squares (right-angle bends). The Electrostatic Discharge (ESD) sensitivities of on-chip resistors can be a problem for both electronic manufactures and electronic component users. As others components, passive devices are known to be susceptible to ESD events. The context of this invention is to improve the reliability of the resistors during an ESD event. An ESD stress means that high current and high voltage levels are applied to the device. The device has to be able to dissipate this energy without failure.

Abstract: A laminated body and fabrication method thereof, which allow space saving and control of variation in internal layer resistance, are provided. When forming an internal-layer resistive element 7 in a multilayer ceramic substrate 10, the internal-layer resistive element 7 is connected to exterior electrodes (an upper surface electrode 32 and an undersurface electrode 34) via multiple via-electrodes 3a and 3b arranged in parallel, without a pad electrode adopted in the conventional laminated body. Moreover, in a multilayer ceramic substrate having multiple internal-layer resistive elements arranged in a multilayer structure, multiple internal-layer resistive elements are directly connected via multiple via-electrodes arranged in parallel.

Abstract: The invention relates to a measuring instrument for time-variable magnetix fluxes, or flux gradients, to electrical resistance elements, and to a measuring system comprising a measuring instrument or electrical resistance element according to the invention. The core component of the measuring instrument is a flux transformer composed of a base material which has a phase transition to the superconducting state. According to the invention, even when the base material is in the superconducting state, this flux transformer comprises at least one load region having electrical resistance that is other than zero for dissipating the electric energy in the conductor loop thereof. For this purpose, according to the invention the conductor loop and the magnetic field source are disposed in one plane and are typically photolithographically structured. The resistance elements according to the invention, having resistance values of ?10?4?, are used as core components in the measuring instrument.

Abstract: A resistor and design structure including a pair of substantially parallel resistor material lengths separated by a first dielectric are disclosed. The resistor material lengths have a sub-lithographic dimension and may be spacer shaped.

Abstract: This electrical resistor structure which includes a frame (2) for receiving elements which form an electrical resistor (3) in the form of a serpentine resistive element, the folded ends of the branches of which are associated with elements (8, 9) for fixing to opposing cross-members (5, 6) of the frame, is characterised in that the fixing elements include elements which form spacing members (12) which are fixed to the cross-members of the frame and which are provided with projecting portions which are spaced-apart from each other and which together define zones for receiving, by clamping and with axial clearance, at least a part of the corresponding ends of the resistive element (3).

Abstract: This document discloses low variation resistor devices, methods, systems, and methods of manufacturing the same. In some implementations, a low-variation resistor can be implemented with a metal-oxide-semiconductor field-effect-transistor (“MOSFET”) operating in the triode (e.g., ohmic) region. The MOSFET can have a source that is connected to a reference voltage (e.g., ground) and a gate connected to a gate voltage source. The gate voltage source can generate a gate voltage that varies in proportion to changes in the temperature of an operating environment. The gate voltage variation can, for example, be controlled so that it offsets the changes in MOSFET resistance that are caused by changes in temperature. In some implementations, the gate voltage variation offsets the resistance variance by offsetting changes in transistor mobility that are caused by changes in temperature.

Abstract: A resistor and design structure including at least one resistor material length in a dielectric, each of the least one resistor material length having a sub-lithographic width are disclosed.

Abstract: A thin film resistor structure is disclosed. The resistor structure comprises a resistor film comprising a copper oxide layer and a plurality of metal islands thereon. The copper oxide layer has a top surface comprising a plurality of adjacent nodule-shaped recess regions, in which vacancies are formed between the nodule-shaped recess regions and are arranged in reticulate distribution. The plurality of metal islands is respectively distributed in the vacancies between the nodule-shaped recess regions. A method for fabricating the thin film resistor structure is also disclosed.

Abstract: An electronic component and a method for producing the electronic component achieve efficient production of resistive elements with various resistances. The electronic component includes a pair of terminals opposite each other and a resistive element disposed between the pair of terminals. The resistive element includes a plurality of dots arranged so as to overlap each other in a reference arrangement pattern excluding a portion of the arrangement pattern. To produce the electronic component, an electronic component is prototyped in advance and includes a resistive element in which the dots are arranged in the entire reference arrangement pattern between the pair of terminals. The prototyped resistive element is then partially removed so as to attain a desired resistance. An electronic component is then produced in which the dots are arranged in the reference arrangement pattern with a portion of the arrangement pattern excluded on the basis of the shape of the partially removed resistive element.

Abstract: This electrical resistor structure which includes a frame (2) for receiving elements which form an electrical resistor (3) in the form of a serpentine resistive element, the folded ends of the branches of which are associated with elements (8, 9) for fixing to opposing cross-members (5, 6) of the frame, is characterised in that the fixing elements include elements which form spacing members (12) which are fixed to the cross-members of the frame and which are provided with projecting portions which are spaced-apart from each other and which together define zones for receiving, by clamping and with axial clearance, at least a part of the corresponding ends of the resistive element (3).

Abstract: The present invention relates to a method for manufacturing a SrTiO3 series varistor using grain boundary segregation, and more particularly, to a method for manufacturing a SrTiO3 series varistor by sintering a powdered composition in which acceptors such as Al and Fe are added in powdered form and then sintered under a reducing atmosphere and heat-treated them in the air to selectively form electrical conduction barriers at grain boundaries in a process for manufacturing SrTiO3 series varistor having an excellent non-linear coefficient and a breakdown voltage suitable for use.

Abstract: To provide an electronic component including a resistor element that can be efficiently produced with a range of resistances, and a method for manufacturing the electronic component, the electronic component includes a pair of terminals, and a resistor element disposed between the terminals. The resistor element includes at least two resistive portions (hereinafter referred to as a first resistive portion and a second resistive portion) that are continuously disposed. The first resistive portion includes a plurality of first dots overlapping one another. The second resistive portion includes a plurality of second dots having a different electric resistance from that of the first dots overlapping one another.

Abstract: The present invention relates to an electrical resistance element of the molybdenum silicide type that includes two terminals (1, 2) for the supply of electric current and at least one leg (3) which extends between the terminals and which includes a glow zone. The invention is characterized in that the glow zone has different diameters along different sections (6-11, 14-17) of the leg (3; 4, 5).

Abstract: A system and method is disclosed for using plasma to adjust the resistance of a thin film resistor. In one advantageous embodiment of the invention, the resistance of a thin film resistor is increased to cause the thin film resistor to have a desired higher value of resistance. The thin film resistor is formed having an initial value of resistance that is less than the desired value of resistance. Then the thin film resistor is placed in an oxidizing atmosphere. A surface of the thin film resistor is then oxidized to increase the initial value of resistance to the desired value of resistance. The amount of the increase in resistance may be selected by selecting the temperature of the oxidizing atmosphere.

Abstract: A resistance hybrid is disclosed including m+1 unit resistors connected in series, to further be connected in series between two resistance elements, one Rbottom and the other Rtop. Each unit resistor SBn includes an error correction resistance element R1dn and a set resistance element RTn connected in series, and further connected in parallel to a fuse RLn. In addition, the error correction resistance element R1dn is formed such that the combined resistance of the fuse RLn, set resistance element RTn, and error correction resistance element R1dn, is equal to the resistance value of the error correction resistance element R1dn. The value of resistance of the unit resistor SBn after the disconnection increases by the resistance value of set resistance element RTn, to thereby obviating the error possibly caused by the disconnection, which is originated from the resistance value of the fuse RLn.

Abstract: A metal plate resistor includes a resistive body comprising a metal plate, and at least a pair of electrodes joined respectively to opposite ends of the resistive body, the electrodes being made of a highly conductive metal conductor. The resistive body has a main section positioned between the electrodes and a pair of electrode sections progressively wider than the main section in directions away from the main section. The electrodes are disposed respectively beneath the electrode sections and identical in shape to the electrode sections.

Abstract: A semiconductor resistor comprises a resistor body formed on a semiconductor substrate and first and second conductive terminals electrically connected to the resistor body at opposite ends thereof. The semiconductor resistor further includes at least first and second conductive paths between at least one of the first and second conductive terminals and the resistor body. The at least one conductive terminal is configured such that a resistance of the at least one conductive terminal between the at least first and second conductive paths is substantially matched to a resistance of the resistor body between the at least first and second conductive paths. In this manner, a current distribution between the at least first and second conductive paths is substantially matched.

Abstract: The method for the fabrication of nano scale temperature sensors and nano scale heaters using focused ion beam (FIB) techniques. The process used to deposit metal nano strips to form a sensor is ion beam assisted chemical vapor deposition (CVD). The FIB Ga+ ion beam can be used to decompose W(CO)6 molecules to deposit a tungsten nano-strip on a suitable substrate. The same substrate can also be used for Pt nano-strip deposition. The precursors for the Pt can be trimethyl platinum (CH3)3Pt in the present case. Because of the Ga+ beam used in the deposition, both Pt and W nano-strips can contain a certain percentage of Ga impurities, which we denoted as Pt(Ga) and W(Ga) respectively. Our characterization of the response of this Pt(Ga)/W(Ga) nano scale junction indicates it has a temperature coefficient of approximately 5.4 mV/° C. This is a factor of approximately 130 larger than the conventional K-type thermocouples.

Abstract: A substrate for a recording head includes a heat generating resistor for generating thermal energy to eject liquid, and a pair of opposed electrodes which are electrically connected to the heat generating resistor to supply electric signal to that heat generating resistor. A portion of the heat generating resistor interposed between the electrodes constitutes a heat generating portion, and the electrodes have respective ends adjacent to the heat generating resistor, each of which ends has a smooth convex shape. The width of a pattern constituting the heat generating resistor is greater than a width of a pattern constituting the electrodes.

Abstract: The surface-mount device package comprises a pad located on a face of the surface-mount device, a solder bump bonded to the pad, and a terminal spaced radially apart from the pad. A terminal surrounds the pad in at least one common plane that bisects the pad and the terminal. An electrically resistive volume intervenes between the pad and the terminal. The pad is electrically coupled to the terminal through the resistive volume. The terminal, the pad, and the electrically resistive volume cooperate to form a passive component associated with at least one device interconnection. The passive component preferable comprises an integral resistor. The integral resistor serves to eliminate or at least substantially reduce electrical resonances and reflections that may otherwise degrade the signal integrity.

Abstract: Infrared wire element configurations allow for expansion during use in a thermoplastic welding environment. A mounting apparatus for the infrared wire expansion configuration provides support.

Abstract: A frequency dependent resistor in which the length of the current path across the resistor varies as a function of the frequency of the electrical signals being passed therethrough. The resistor uses the principal known as skin effect to direct relatively higher frequency signals through a longer path through the resistor than is experienced by signals having a relatively low frequency.

Abstract: A chip resistor includes a resistor body, a wire-bonding electrode, and a soldering electrode respectively disposed on a first major surface and a second major surface of the resistor. Two electrodes are electrically connected to each other only through the resistor body. The resistor body includes an insulating substrate having a resistance layer printed on both its major surfaces and one of its side surfaces. The resistor body may include a semiconductor material. A semiconductor device having the chip resistor in which a wire from an electronic component is directly bonded to the wire-bonding electrode of the chip resistor is also disclosed.

Abstract: A resistive body of a hybrid integrated circuit has a resistance pattern on a resin film. Bonding pads permit connection of current through the resistance pattern. The resistance pattern may form part of a detecting bridge for overcurrent detection. One embodiment of the invention uses a rectangular resistance pattern with an opening in the center to force current to flow on a perimeter path for minimizing maximum temperature. Another embodiment uses a serpentine resistance pattern. A face-down resistance patter reduces interference. A direct-connection bonding pad reduces the voltage generated in a parasitic capacitance to improve the resistance of the resin film to voltage breakdown.

Abstract: An electronic probe circuit having ac and dc amplifiers and an input compensation subcircuit is enclosed within a trim housing that replicates the electrical effect of the probe housing. The circuit is laser trimmed through ports in the trim housing. The difference between the voltage at 80 nsec and 1.4 .mu.sec points on a step voltage provides a first calibration factor while the difference between the 3 nsec voltage and the 80 nsec voltage provides a second calibration factor. A resistor in the DC amplifier is trimmed to an absolute voltage with a step scan laser cut. A resistor in the AC amplifier is trimmed with a laser L-cut until the difference between the 80 nsec and 1.4 .mu.sec points of the step voltage equals the first calibration factor. A capacitor in the input compensation subcircuit is trimmed until the voltage difference between the 3 nsec and 80 nsec points equals the second calibration factor.

Abstract: A square chip resistor in which, when the protective glass layers are fired, a powder of an inorganic material such as alumina or the like having a greater thermal expansion coefficient than glass is mixed into glass paste to thereby adjust the thermal expansion coefficient of the protective glass layers. This makes it possible to prevent generation of any crack on the glass surface due to a stress produced by a difference between the thermal expansion coefficients of the glass layer and an alumina substrate.

Abstract: A resistor and method of forming the resistor as an annular resistor body between a conductive pad surrounding a through-hole in the PCB and a surrounding conductive layer, the annular resistor body being formed from a conductive material having a selected resistivity, the outer and inner perimeters of the annular resistor body preferably being substantially constant radii whereby the operative resistance of the annular resistor body may be simply determined from the radii of its outer and inner perimeters, an effective thickness of the annular resistor body and its resistivity, the annular resistor body more preferably being formed from a liquid precursor facilitating formation of conductive interconnections at its outer and inner perimeters.

Abstract: An apparatus and method is provided for dividing a voltage with a resistor voltage divider and for employing the voltage divider in an integrated circuit. The resistor voltage divider utilizes inaccessible compensation taps that are placed between nonlinearly spaced output taps. The compensation taps reduce the impact of tap resistance on the voltage divider transfer function. The number of inaccessible compensation taps placed between output taps is dependant upon a chosen tap density that is substantially maintained across the body of the resistor voltage divider. The resistor may be used in integrated circuits employing amplifiers, such as volume control circuitry.

Abstract: A network-type resistor array in which a plurality of resistors are successively arranged, in which electrode portions of the resistors are respectively separated by angular electrode-separating notches, so as to prevent the short-circuit between the adjacent electrode portions due to the flowing along of molten solder for electrode connection.

Abstract: A Neuro device is a representation of a nerve cell constituting human brains, eyes and the like, that is, a neuron by an electronic circuit. A circuit of the Neuro device according to the present invention comprises n (n : natural number) input terminals 4, n variable resistors 8 (the resistance values of the n variable resistors 8 are respectively set to R1, R2,..., Rn) respectively connected to the input terminals 4, and an arithmetic circuit 100 to which signals from the variable resistors 8 are together applied, and an output terminal 5 to which a signal from the arithmetic circuit 100 is outputted. The variable resistor 8 is so constructed that a chalcogenide semiconductor is interposed between a pair of electrodes. The chalcogenide semiconductor can be reversibly transferred to a high resistive amorphous state and a low resistive crystallized state by applying a predetermined write voltage.

Abstract: A heater comprises an insulating substrate which carries a pair of transversely conductor strips, a resistor line extending between the respective conductor strips. The respective conductor strips are connected to the resistor line by electrode teeth spaced longitudinally of the main resistor line and arranged in staggered relation on both sides of the resistor line.

Abstract: The effective parasitic end resistance of small-value precision integrated circuit resistors is reduced by providing N resistors connected in parallel and causing at least two of the resistors to share a terminal contact. The resulting integrated circuit resistor includes multiple terminal contacts of any number n greater than two. Of the n terminal contacts, N-1 terminal contacts are shared amongst said resistors. The parasitic end resistances are diminished by a factor equal to the number of resistors connected in parallel. By increasing the length of the active area of the N resistors by a factor equal to the number of the resistors, the desired resistance value remains undiminished. As a result, the parasitic end resistances may be made negligible compared to the desired resistance even for small value resistors.

Abstract: The film-type electrical power resistor includes a flat chip of aluminum oxide, having a resistive film screen-printed onto one of its sides. Leads are bonded to that side and electrically connected to the film, the leads being such that the chip may be cantilevered by the leads in a mold cavity before introduction of synthetic resin into the cavity, and with the lower chip surface spaced above the bottom cavity wall. A molded body is molded in the cavity to fully encapsulate the chip, film, and inner ends of the leads, there being no mold cup around the molded body. The molded body is formed of high thermal-conductivity thermosetting synthetic resin. Provided through the body is a bolthole for clamping of the resistor to an external chassis or heatsink. The space between the bottom surface of the chip and the flat bottom surface of the molded body is a heat-sinking volume formed of the high thermal-conductivity resin; and the bottom surface of such volume of resin is the bottom surface of the resistor.

Abstract: A low noise miniature potentiometer utilizes thick film deposits of resistive material which extend adjacent to deposits of conductive material. The conductive region is sliced into a plurality of spaced-apart conductive elements. Electrical paths through resistive elements can be lengthen by laser trimming of the resistive material thereby providing for very precise incremental resistances between pairs of spaced apart conductive elements. If desired, an increased range of resistivity can be achieved by utilizing a second deposited thick film region extending along the conductive region and in contact therewith. Laser trimming can be used to increase conductive path lengths in the second resistive element thereby providing a broader range of resistance values.