Abstract: A device for determining a layer thickness in a multilayer film includes a radiation source configured to generate an electromagnetic primary radiation, a detector configured to detect an electromagnetic secondary radiation emitted by the multilayer film, the secondary radiation being induced by an interaction of the primary radiation with the multilayer film, and a first contact block transparent to the electromagnetic primary radiation and having a first contact surface for creating contact with the multilayer film. The radiation source is arranged on the first contact block in such a way that the electromagnetic primary radiation is guided from the first contact block onto the multilayer film.

Abstract: Systems and methods that process a plurality of surgical instruments for cleaning and/or packaging. A device identifies a robot-ready insert having a predetermined configuration for accepting at least one type of surgical instrument. The surgical instruments are identified and oriented according to type using an automated apparatus. Specialized tools are also provided for automatically opening and closing surgical instruments, flipping instruments and assisting in the processing and maintenance of surgical instruments. The automated apparatus then places each of the surgical instrument types in one or more predetermined areas of the insert, configured to accept a predetermined set of surgical instrument types.

Abstract: Systems and methods that process a plurality of surgical instruments for cleaning and/or packaging. A device identifies a robot-ready insert having a predetermined configuration for accepting at least one type of surgical instrument. The surgical instruments are identified and oriented according to type using an automated apparatus. Specialized tools are also provided for automatically opening and closing surgical instruments, flipping instruments and assisting in the processing and maintenance of surgical instruments. The automated apparatus then places each of the surgical instrument types in one or more predetermined areas of the insert, configured to accept a predetermined set of surgical instrument types.

Abstract: The present invention provides a circuit pattern edge inspection method of finding out a failure in a fabricating process and image distortion in an observing apparatus by analyzing, by a non-destructive inspection, the shape of an edge of a line of a fine pattern in which characteristics of the material, process, and an exposure optical system in a semiconductor fabricating process appear, and performing analysis quantitatively. The method includes a step of detecting a set of edge points indicative of positions of edges of the pattern in a two-dimensional plane by a threshold method; a step of obtaining an approximation line for the set of edge points detected; and a step of obtaining an edge roughness shape and a characteristic by calculating the difference between the set of the edge points and the approximation line. A plurality of values are used as thresholds used for the threshold method.

Abstract: In a high resolution optical electronic imaging system to detect defects and dimensional changes in articles of manufacture for example, metal cutting tool inserts, a convergent blade-shaped laser light beam emitted by a laser passes through a focusing optical system and is then directed to a revolving head which contains a mirror system. The focusing and mirror system scans the apex of the blade beam along the cutting edges of an insert so that edge defects and dimensional changes cause reflection and refraction of the laser beam. High resolution and contrast television camera and optic system receives the reflections and refractions and creates an image of the device with sharply contrasted defects.