Abstract: A solid-state imaging device includes an imaging element and a logic element. The imaging element includes a first semiconductor substrate, a first wiring layer, and a first metal layer, in which a pixel region which is a light sensing surface is formed. The logic element includes a second semiconductor substrate, a second wiring layer, and a second metal layer, in which a signal processing circuit that processes a pixel signal obtained at the pixel region is formed. The logic element is laminated to the imaging element so that the first metal layer and the second metal layer are bonded to each other, and the first metal layer and the second metal layer are formed on a region excluding a region in which a penetrating electrode layer penetrating a bonding surface of the imaging element and the logic element is formed.

Abstract: Provided is a line layout for a semiconductor memory apparatus, which is a line layout of a line layer formed over a memory region so as to cross the memory region. The line layout includes as unit lines: a data line disposed between a pair of shielding lines; a pair of address line groups disposed at one side of the shielding lines; and a power supply line disposed between the pair of address line groups.

Abstract: According to one embodiment, a nonvolatile semiconductor memory device includes a first memory string including a first memory cell and a second memory cell aligned along a first axis, a source contact provided at a source-side end of the first memory string, a second memory string that extends along the first axis and includes a third memory cell that aligns with the first memory cell along a second axis perpendicular to the first axis, and a shield conductive layer. The shield conductive layer extends along the first axis between the first memory string and the second memory string and is electrically connected to the source contact.

Abstract: A semiconductor memory device has an array structure of an open bit line structure and comprises a plurality of normal memory mats, two dummy mats and a plurality of rows of sense amplifiers. The normal memory mat includes a plurality of memory cells and arranged in a bit line extending direction, while the dummy mat includes a plurality of dummy cells and arranged in a bit line extending direction at both ends of the plurality of normal memory mats. The rows of sense amplifiers are arranged between the normal memory mats and between each of the normal memory mats and each of the dummy mats. A first predetermined number of the dummy cells, the number of which is smaller than a number of the memory cells arranged along each bit line of the normal memory mats, are arranged along each bit line of the dummy mats.

Abstract: A method of programming memory cells in a nonvolatile memory, includes applying a programming voltage to a first bitline and setting a second bitline in a floating state. The method further includes applying a compensation voltage to a shield conductive line coupled to the bitline set in the floating state, and setting in the floating state a shield conductive line coupled to the bitline receiving the programming voltage. The method is applicable to the reduction of the parasitic programming phenomena of memory cells by capacitive coupling between bitlines.

Abstract: A semiconductor device is disclosed which comprises a first wiring layer, a second wiring layer formed over the first wiring layer, data input/output terminals, and a data bus formed in the first and second wiring layers. The data bus includes N data lines transmitting data between a predetermined circuit and the input/output terminals. M first data lines among the N data lines have a length shorter than a predetermined length and residual N-M second data lines have a length longer than the predetermined length. Shield lines adjacent to the N data lines are formed in the first and second layers. The N data lines are arranged at positions at which the data lines do not overlap one another in a stacking direction of the first and second wiring layers.

Abstract: A semiconductor device is disclosed which comprises a first wiring layer, a second wiring layer formed over the first wiring layer, data input/output terminals, and a data bus formed in the first and second wiring layers. The data bus includes N data lines transmitting data between a predetermined circuit and the input/output terminals. M first data lines among the N data lines have a length shorter than a predetermined length and residual N-M second data lines have a length longer than the predetermined length. Shield lines adjacent to the N data lines are formed in the first and second layers. The N data lines are arranged at positions at which the data lines do not overlap one another in a stacking direction of the first and second wiring layers.

Abstract: A sectioned bit line of an SRAM memory device, an SRAM memory device having a sectioned bit line, and associated systems and methods are described. In one illustrative implementation, the sectioned bit line may comprise a local bit line, a memory cell connected to the local bit line, and a pass gate coupled to the local bit line, wherein the pass gate is configured to be coupled to a global bit line. In other implementations, an SRAM memory device may be configured involving sectioned bit lines and a global bit line wherein the pass gates are configured to connect and isolate the sectioned bit line and the global bit line.

Abstract: A memory having isolated dual memory cells is provided. A first isolation wall and a second isolation wall are separately disposed between a source and a drain on a substrate. An isolation bottom layer and a polysilicon layer are orderly disposed on the substrate between the first and the second isolation walls. A first charge storage structure and a first gate are orderly disposed on the substrate between the first isolation wall and the source. A second charge storage structure and a second gate are orderly disposed on the substrate between the second isolation wall and the drain. A word line disposed on the polysilicon layer, the first gate, the second gate, the first isolation wall and the second isolation wall is electrically connected to the first gate, the second gate and the polysilicon layer.

Abstract: In a lithographic apparatus, a part of a reflector is heated and cooled. The rate of heating and/or the rate of cooling is adjusted to adjust the temperature of the part. The change in temperature of the part exerts a force on the reflector, which changes its shape.

Abstract: A memory array including a plurality of memory cells, a plurality of word lines, a dummy word line, and a plug is provided. Each word line is coupled to corresponding memory cells. A dummy word line is directly adjacent to an outmost word line of the plurality of word lines. The plug is located between the dummy word line and the outmost word line.

Abstract: A method of reading a memory cell is disclosed. The method includes the step of connecting (708) a reference voltage generator (600) to a first bitline (/BL). The first bitline is charged to a reference voltage (VREF) from the reference voltage generator. The reference voltage generator is disconnected (RFWL_A/B low at t4, FIG. 10B) from the first bitline. A signal voltage (PL high at t4, FIG. 10B) from the memory cell is applied to a second bitline (BL) after the step of disconnecting. A difference voltage between the first and second bitlines is amplified (SAEN high at t7, FIGS. 8A and 10B).

Abstract: A memory array including a plurality of memory cells, a plurality of word lines, a dummy word line, at least a first conductive region and at least a first plug is provided. Each word line is coupled to corresponding memory cells. A dummy word line is directly adjacent to an outmost word line of the plurality of word lines. The first conductive region is disposed only between the dummy word line and the outmost word line. The first plug is located between the dummy word line and the outmost word line.

Abstract: Word lines of a NAND flash memory array are formed by concentric, rectangular shaped, closed loops that have a width of approximately half the minimum feature size of the patterning process used. The resulting circuits have word lines linked together so that peripheral circuits are shared. Separate erase blocks are established by shield plates.

Abstract: A semiconductor device is disclosed which comprises a first wiring layer, a second wiring layer formed over the first wiring layer, data input/output terminals, and a data bus formed in the first and second wiring layers. The data bus includes N data lines transmitting data between a predetermined circuit and the input/output terminals. M first data lines among the N data lines have a length shorter than a predetermined length and residual N-M second data lines have a length longer than the predetermined length. Shield lines adjacent to the N data lines are formed in the first and second layers. The N data lines are arranged at positions at which the data lines do not overlap one another in a stacking direction of the first and second wiring layers.

Abstract: A shielded integrated circuit structure including an integrated circuit having a plurality of functional elements thereon, and a tiled array comprising a plurality of shielding elements, each functional element having one of the plurality of shielding elements proximate thereto. The shielding elements comprise a magnetic material having a saturation less than or equal to 20,000 gauss.

Abstract: The present disclosure provides a portable information apparatus, including, an apparatus main body, an incidental article mounted on the apparatus main body when the portable information apparatus is used, a solid-state magnetic memory provided at a portion of the apparatus main body at which the incidental article is mounted and adapted to retain information in accordance with a magnetization state of a magnetic material, and a magnetic shield provided on the incidental article including a portion opposed to the solid-state magnetic memory when the incidental article is mounted on the apparatus main body.

Abstract: A memory comprises a memory array, a sense unit, and a biasing and shielding circuit. The biasing and shielding circuit is coupled to the memory array and the sense unit, wherein the biasing and shielding circuit comprises a first transistor, a second transistor, and a capacitor. The first transistor has a gate coupled to a biasing voltage and a first terminal coupled to the sense unit. The second transistor has a gate coupled to the biasing voltage and a first terminal coupled to a first potential. The capacitor is coupled to the sense unit and the first transistor.

Abstract: A semiconductor integrated circuit device has a negative voltage generation circuit provided at each power supply circuit unit for six memory macros. Therefore, the response with respect to variation in a negative voltage is increased. In a standby mode, a negative voltage supply line for the six memory macros is connected by a switch circuit, and only a negative voltage generation circuit of one power supply circuit unit among six negative voltage generation circuits of the six power supply circuit units is rendered active. Thus, increase in standby current can be prevented.

Abstract: A resist pattern forming method capable of obtaining a smooth resist pattern. An exemplary method may utilize a photomask including a plurality of mask cells arranged in the form of a matrix. The length of one side of each of the mask cells may be smaller than the length corresponding to the resolution limit of the optical system of the exposure device. Each mask cell may have one or both of a light transmission region and a light shielding region, and the intensity of light passing through each mask cell may be determined by the ratio of the area of the light transmission region to the area of the mask cell. The photomask may be positioned at a vertical focus position other than the optimal focus position. The resist film may be exposed with light and may then be developed to produce the resist pattern.

Abstract: An MRAM comprises: a plurality of magnetic memory cells each having a magnetoresistive element; and a magnetic field application section. The magnetic field application section applies an offset adjustment magnetic field in a certain direction to the plurality of magnetic memory cells from outside the plurality of magnetic memory cells. Respective data stored in the plurality of magnetic memory cells become the same when the offset adjustment magnetic field is removed.

Abstract: A memory device is provided. The memory device comprises a substrate, a plurality of word lines, a plurality of conductive regions and at least a shielding plug. The substrate has a memory region and a peripheral region. The word lines are disposed on the substrate and at least a dummy word line disposed in the peripheral region and adjacent to the word lines. The conductive regions are disposed in the substrate and between the word lines respectively. The shielding plug is located on the substrate and adjacent to the dummy word line and between the dummy word line and the word lines and there is no self-aligned source region around the dummy word line.

Abstract: A memory having isolated dual memory cells is provided. A first isolation wall and a second isolation wall are separately disposed between a source and a drain on a substrate. An isolation bottom layer and a polysilicon layer are orderly disposed on the substrate between the first and the second isolation walls. A first charge storage structure and a first gate are orderly disposed on the substrate between the first isolation wall and the source. A second charge storage structure and a second gate are orderly disposed on the substrate between the second isolation wall and the drain. A word line disposed on the polysilicon layer, the first gate, the second gate, the first isolation wall and the second isolation wall is electrically connected to the first gate, the second gate and the polysilicon layer.

Abstract: A semiconductor device. The device includes a substrate and an integrated circuit chip. The device also includes an electrically or thermally reactive layer located between a top surface of the substrate and a bottom surface of the integrated circuit chip, wherein the reactive layer is positioned such that detection of tampering causes the reactive layer to be electrically or thermally energized such that the semiconductor device is at least partially destroyed.

Abstract: A sense amplifier comprises a sense node, a reference node, a memory input stage circuit, a reference input stage circuit, an output stage circuit, and a shielding circuit. The memory input stage circuit comprises first input node for maintaining a first sense voltage established by a cell current and establishes a second sense voltage on the sense node in response to the first sense voltage. The reference input stage circuit comprises an output node and a second input node, which is for maintaining a first reference voltage established by the reference current and establishes a second reference voltage on the reference node in response to the first reference voltage. The output stage circuit obtains a sense result in response to the second reference voltage and the second sense voltage. The first shielding circuit shields the output node from being interfered with the second reference voltage on the reference node.

Abstract: A semiconductor memory device having a double-patterned memory cell array that includes a plurality of first bit lines spaced apart from each other and having a first pattern, a plurality of second bit lines spaced apart from each other and having a second pattern, the second bit lines being between the first bit lines to define an alternating array of first and second bit lines, the first and second patterns being different from each other, a first main memory cell array defined by a first portion of the alternating array, a second main memory cell array defined by a second portion of the alternating array, bit lines in the first main memory cell array having a substantially same regularity as bit lines in the second main memory cell array, and a dummy array between the first main memory cell array and the second main memory cell array.

Abstract: A shielded integrated circuit structure including an integrated circuit having a plurality of functional elements thereon, and a tiled array comprising a plurality of shielding elements, each functional element having one of the plurality of shielding elements proximate thereto. The shielding elements comprise a magnetic material having a saturation less than or equal to 20,000 gauss.

Abstract: The present invention provides a method for providing magnetic shielding for a circuit comprising magnetically sensitive materials, comprising actively shielding the circuit from a disturbing magnetic field. A corresponding semiconductor device is also provided. The method and device allows shielding for strong disturbing magnetic fields.

Abstract: A memory device is provided. The memory device comprises a substrate, a plurality of word lines, a plurality of conductive regions and at least a shielding plug. The substrate has a memory region and a peripheral region. The word lines are disposed on the substrate and at least a dummy word line disposed in the peripheral region and adjacent to the word lines. The conductive regions are disposed in the substrate and between the word lines respectively. The shielding plug is located on the substrate and adjacent to the dummy word line and between the dummy word line and the word lines and there is no self-aligned source region around the dummy word line.

Abstract: Provided are a semiconductor device and a method of fabricating the same. The semiconductor device includes a semiconductor substrate including a cell array region, memory cell transistors disposed at the cell array region, bitlines disposed on the memory cell transistors, and a source plate disposed between the memory cell transistors and the bitlines to veil the memory cell transistors thereunder.

Abstract: A flash NAND electronic memory device includes non-volatile cells having a high integration density and a relative programming method. The memory device is integrated on a semiconductor substrate and includes a matrix with word lines and bit lines organized in sectors of memory cells. The memory device is between the cells of the opposite word lines belonging to at least one of the sectors of the matrix. A lateral coating along the direction of the bit lines has at least one conductive layer with a contact terminal being selectively biased or left floating during each program, read or erase operation. Each cell belongs to a sector.

Abstract: An integrated circuit having a memory cell arrangement with a plurality of memory cells and a memory cell arrangement controller is provided. The memory cell arrangement controller is configured such that during programming of at least one memory cell of the plurality of memory cells, at least one memory cell, which is arranged adjacent to the memory cell to be programmed, is driven to shield the memory cell to be programmed.

Abstract: A memory comprises a memory array, a sense unit, and a biasing and shielding circuit. The biasing and shielding circuit is coupled to the memory array and the sense unit, wherein the biasing and shielding circuit comprises a first transistor, a second transistor, and a capacitor. The first transistor has a gate coupled to a biasing voltage and a first terminal coupled to the sense unit. The second transistor has a gate coupled to the biasing voltage and a first terminal coupled to a first potential. The capacitor is coupled to the sense unit and the first transistor.

Abstract: A circuit with an inter-module radiation interference shielding mechanism is disclosed. The circuit includes a circuit module producing a radiation field. At least one radiation shielding module is situated between the circuit module and another module that is vulnerable to the interference of the radiation field. The shielding module is substantially tangential to the radiation field.

Abstract: A semiconductor memory device includes a plurality of sense amplifiers each supplying a higher write potential and a lower write potential to each of memory cells; a driver circuit supplying the higher write potential to each of the sense amplifiers; a driver circuit supplying the lower write potential to each of the sense amplifiers; and an auxiliary driver circuit supplying either the lower write potential or an auxiliary potential lower than the lower write potential to each of the sense amplifiers. It is thereby possible to suppress a fluctuation in the lower write potential at start of a sensing operation. Therefore, the sensing operation can be accelerated as compared with a sensing operation performed by sense amplifiers in a conventional semiconductor memory device.

Abstract: A shielding circuit for preventing a sense current of a target cell from the influence of a source current of first adjacent cell includes a pre-discharge device, first and second biasing units, first and second voltage pull-down units, and a connection units. The pre-discharge device is for setting the voltage of the sense node to a negative voltage. The first and second biasing units are for biasing the source voltage of the target and the first adjacent cell equal to a biasing voltage, respectively. The first and second voltage pull-down units are for pulling down the source voltage of the target and the first adjacent cell closing to a ground level, respectively. The connection unit is for receiving and outputting the sense current passing through the first biasing unit to the sense node.

Abstract: The present invention provides a method for providing magnetic shielding for a circuit comprising magnetically sensitive materials, comprising actively shielding the circuit from a disturbing magnetic field. A corresponding semiconductor device is also provided. The method and device allows shielding for strong disturbing magnetic fields.

Abstract: Embodiments of the invention relate generally to integrated circuits, to methods for manufacturing an integrating circuit, and to memory modules. In an embodiment of the invention, an integrated circuit is provided having a memory cell. The memory cell may include a first magnetic layer structure, a tunnel barrier layer structure disposed above the first magnetic layer structure, a second magnetic layer structure disposed above the tunnel barrier layer structure, and at least one sacrificial material layer to suppress electrochemical corrosion of the first magnetic layer structure or the second magnetic layer structure.

Abstract: An exposure apparatus illuminates a pattern with an energy beam and transfers the pattern onto a substrate via a projection optical system. The exposure apparatus includes a substrate stage on which the substrate is mounted that moves within a two-dimensional plane holding the substrate. The apparatus also includes a supply mechanism that supplies liquid to a predetermined spatial area which includes a space between the projection optical system and the substrate on the substrate stage, and an adjustment unit that adjusts exposure conditions based on temperature information on the liquid between the projection optical system and the substrate.

Abstract: A dynamic CAM cell has features that reduce the effect of noise within a CAM array. By shielding the matchline from the wordline, noise transmitted from the matchline to the wordline is reduced. By placing the searchline equally distant from a bitline and the bitline complement, the noise transmitted by the searchline is received equivalently by both the bitline and the bitline complement and therefore cancelled out.

Abstract: A NAND flash memory having a cell string structure includes a wordline configured to transfer a wordline voltage to a memory cell. A selection line is configured to transfer a selection voltage to a selection transistor connected to the memory cell and at least one shielding line is interposed between the wordline and the selection line and is operable to reduce capacitance-coupling between the wordline and the selection line during a programming operation.

Abstract: A memory device is provided with a structure for improved transmission line operation on integrated circuits. The structure for transmission line operation includes a first layer of electrically conductive material on a substrate. A first layer of insulating material is formed on the first layer of the electrically conductive material. A number of high permeability metal lines are formed on the first layer of insulating material. The number of high permeability metal lines includes composite hexaferrite films. A number of transmission lines is formed on the first layer of insulating material and between and parallel with the number of high permeability metal lines. A second layer of insulating material is formed on the transmission lines and the high permeability metal lines. The structure for transmission line operation includes a second layer of electrically conductive material on the second layer of insulating material.

Abstract: A technique for reducing influences of the bias magnetic field developed by yokes used for concentrating the magnetic field on magnetoresistance elements, on MRAM operations. An MRAM is composed of a plurality of magnetoresistance elements having magnetic anisotropy in a first direction; a wiring extended in a second direction different from the first direction, through which a write current flows for writing data into the magnetoresistance elements; and a yoke layer formed of ferromagnetic material, extended along the second direction, and covering at least a portion of a surface of the wiring. The plurality of magnetoresistance elements include a first magnetoresistance element, and a second magnetoresistance element of which the distance from an end of the yoke layer is further than that of the first magnetoresistance element. The first magnetoresistance element has a magnetic anisotropy stronger than that of the second magnetoresistance element.

Abstract: Magnetic shielding is provided using a variety of methods, systems, devices and circuits. Aspects of present invention provide a method for providing magnetic shielding for a circuit comprising magnetically sensitive materials. The circuit is actively shielded from a disturbing magnetic field. A corresponding semiconductor device is also provided. The method and device can provide shielding for strong disturbing magnetic fields.

Abstract: A flash memory device includes a core region, high-voltage pump regions disposed at one side of the core region, and a peripheral control region disposed at one side of the core region and between the high-voltage pump regions.

Abstract: An environmentally hardened architecture comprises a hybrid processor, a high speed bus having environmentally-sensitive interfaces, an environmentally hardened bus having environmentally-hardened interfaces, and an environmentally-hardened processor communicatively coupled to an environmentally-sensitive interface of the high speed bus and communicatively coupled to an environmentally-hardened interface of the environmentally hardened bus. The hybrid processor includes an environmentally-hardened processing section and an environmentally-sensitive processing section. At least one environmentally-sensitive interface is configured to pass data to and from the environmentally-sensitive processing section and another environmentally-sensitive interface is configured to pass data to and from the environmentally-hardened processing section of the hybrid processor. An environmentally-hardened interface is configured to pass data to and from the environmentally-hardened processing section of the hybrid processor.

Abstract: A method and system for providing a multi-bank memory is described. The method and system include providing a plurality of banks. Each of the plurality of banks includes at least one array including a plurality of memory cells and analog sensing circuitry. The method and system further include providing common digital sensing circuitry coupled with the plurality of banks.

Abstract: A memory device is provided with a structure for improved transmission line operation on integrated circuits. The structure for transmission line operation includes a first layer of electrically conductive material on a substrate. A first layer of insulating material is formed on the first layer of the electrically conductive material. A number of high permeability metal lines are formed on the first layer of insulating material. The number of high permeability metal lines includes composite hexaferrite films. A number of transmission lines is formed on the first layer of insulating material and between and parallel with the number of high permeability metal lines. A second layer of insulating material is formed on the transmission lines and the high permeability metal lines. The structure for transmission line operation includes a second layer of electrically conductive material on the second layer of insulating material.

Abstract: An electronic memory device with a high density of non-volatile memory cells has a reduced capacitance cell-to-cell interference. The memory cells are integrated on a semiconductor substrate and are organized in a matrix of cells with word lines and bit lines connected to the cells. Each memory cell includes at least one floating gate transistor having a floating gate region projecting from the substrate, and a control gate region capacitively coupled to the floating gate region. Between the cells of opposite word lines, a lateral coating is provided that includes at least one conductive layer floating along the direction of the bit lines.

Abstract: A semiconductor memory device formed on a semiconductor chip comprises a plurality of first memory arrays, a plurality of second memory arrays, a first voltage generator, and a plurality of first bonding pads. The semiconductor chip is divided into a first rectangle region, a second rectangle region, and a third rectangle region and the third rectangle region is arranged between the first rectangle region and the second rectangle region. The plurality of first memory arrays are formed in the first rectangle region. The plurality of second memory arrays are formed in the second rectangle region. The voltage generator and the plurality of first bonding pads are arranged in the third rectangle region. The plurality of first bonding pads are arranged between the first rectangle region and the voltage generator and no bonding pads are arranged between the voltage generator and the plurality of second memory arrays.