Abstract: A lamination chuck for lamination of film materials includes a support layer and a top layer. The top layer is disposed on the support layer. The top layer includes a polymeric material having a Shore A hardness lower than a Shore hardness of a material of the support layer. The top layer and the support layer have at least one vacuum channel formed therethrough, vertically extending from a top surface of the top layer to a bottom surface of the support layer.

Abstract: A wafer boat handling device, configured to be positioned under a process chamber of a vertical batch furnace. The wafer boat handling device comprises a main housing having a wall defining and bounding a wafer boat handling space, and a boat transporter comprising a wafer boat support for supporting a wafer boat and configured to transport the wafer boat to a cooldown position within the wafer boat handling space. A part of the wall adjacent the cooldown position is a wall part with a heat radiation surface absorptance of at least 0.60 so as to withdraw heat from the wafer boat which is in the cooldown position by means of heat radiation absorption.

Abstract: A plurality of workpieces include a plurality of first workpieces of a first workpiece group to be loaded onto a first loaded member according to a first loading sequence and a plurality of second workpieces of a second workpiece group to be loaded onto a second loaded member according to a second loading sequence. On a conveying device, workpieces are arranged at ransom with respect to respective arrangement sequences of the first workpiece group and the second workpiece group and the classifications of the first workpiece group and the second workpiece group. On a conveying device, workpieces of the first workpiece group are sequentially arranged based on the first loading sequence and workpieces of the second workpiece group are sequentially arranged based on the second loading sequence. At the same time, the workpieces of the first workpiece group and the second workpiece group are arranged together.

Abstract: In some examples, a dual-mode autonomous guided vehicle (AGV) is provided for docking a module in a fabrication bay. An example AGV may comprise a chassis for supporting the module on the AGV; drive means to transport the AGV under autonomous guidance, in a module transportation mode, to a specified location within the fabrication bay; a Cartesian x-y movement table to move the module under autonomous guidance, in a module docking mode, in an x- or y-docking direction, into a specific docking position; and a z-direction lift mechanism to move the module in a z-docking direction during the module docking mode.

Abstract: A storage shelf includes a body frame and a shelf plate attached to the body frame with an elastic body therebetween, the storage shelf storing thereon a FOUP including a contained object. The storage shelf includes a feed nozzle on the shelf plate to feed gas to the FOUP, and a feed tube with one end communicating with the feed nozzle and the other end communicating with a main tube connected to a feed source of the gas to be fed to the FOUP, the main tube being supported by the body frame. The feed tube has a flexible portion having flexibility at least partially between the one end and the other end.

Abstract: The present invention provides a quick-release valve module which includes a flexible grommet defining a channel, and a piston having a disc portion at an end thereof, wherein the disc portion of the piston is exposed to the flexible grommet.

Abstract: A substrate analysis apparatus is provided. The substrate analysis includes: an interlayer conveying module configured to transport a first FOUP; an exchange module which is connected to the interlayer conveying module, and configured to transfer a wafer from the first FOUP to a second FOUP; a pre-processing module configured to form a test wafer piece using the wafer inside the second FOUP; an analysis module configured to analyze the test wafer piece; and a transfer rail configured to transport the second FOUP containing the wafer and a tray containing the test wafer piece. The wafer includes a first identifier indicating information corresponding to the wafer, the test wafer piece includes a second identifier indicating information generated by the pre-processing module which corresponds to the test wafer piece, and the analysis module is configured to analyze the first identifier and the second identifier in connection with each other.

Abstract: Embodiments of equipment front end modules (EFEMs) are provided herein. In some embodiments, an EFEM includes: two or more loadports for receiving two or more types of substrates; an overhead storage unit having a plurality of storage shelves disposed above the two or more loadports and configured to hold two or more types of front opening unified pods (FOUPs) of different sizes that store the two or more types of substrates, respectively, wherein a horizontal alley is disposed between the plurality of storage shelves and the two or more loadports to provide a horizontal passageway for the FOUPs during transport to the two or more loadports; and an overhead transport system having a pair of vertical actuators disposed on opposite sides of the overhead storage unit and configured to transport FOUPs from the overhead storage unit to the two or more loadports.

Abstract: An apparatus includes a first arm comprising an unequal-link linkage having a first end effector; a second arm comprising an equal-link linkage having a second end effector; and a drive unit coupled to the first arm and the second arm, the drive unit being configured to move the first arm and the second arm. The first end effector is asymmetric to the second end effector. The first end effector is angled relative to the second end effector such that a first substrate support section on the first end effector is not positioned over or under a second substrate support section on the second end effector.

Abstract: A rooftop package delivery receptacle for unmanned aerial vehicles (UAV) is transformed from a normally closed downwardly pitched transparent or translucent aesthetically acceptable rooftop aperture, appearing as an ordinary skylight, into a preferably larger substantially horizontal delivery platform providing a safe, secure, above ground location for a drone to land or tether for package delivery. Upon a wireless command signal from either an arriving UAV or a local user, the curb frame mounted receptacle containing a center pivoting platform supporting a plurality of slidably mounted panels rotates upwards and expands both longitudinally and transversely enabling a larger substantially horizontal landing area. After the package is delivered the platform contracts to its original size and continues in an upwards rotation urging the package to move inwards for collection. A pair of weatherproof accordion shaped shudders surround the openings and enclose any gaps during the operation.

Abstract: An overhead transport vehicle temporarily places a FOUP at a ceiling suspended shelf while transporting the FOUP to a target position by traveling along a rail on a ceiling of a building from which the ceiling suspended is suspended. The ceiling suspended shelf includes an upper shelf including an upper support surface that supports the FOUP. A level of the upper support surface is the same or substantially the same as a level of the rail.

Abstract: An apparatus for automated chemical vapor processing. The apparatus includes a chemical vapor processing chamber to treat articles with surface-smoothing chemical vapor and an article loading chamber to receive articles pending treatment by the chemical vapor processing chamber. The apparatus further includes an automated conveyor to move the articles between the article loading chamber and the chemical vapor processing chamber. The apparatus further includes an air lock to connect the article loading chamber to the chemical vapor processing chamber, and a controller to control the automated conveyor to move the articles between the article loading chamber and the chemical vapor processing chamber, and to control the air lock to seal the chemical vapor processing chamber from the article loading chamber when the automated conveyor is not moving articles between the article loading chamber and the chemical vapor processing chamber.

Abstract: An action of a robot included in a robot system is controlled based on a learning result of a machine learning device. The machine learning device includes a behavior observing unit, a displaced amount observing unit, and a learning unit. The behavior observing unit observes a behavior pattern of the robot picking out a workpiece from a container. The displaced amount observing unit observes, based on pieces of image data captured before and after the pick-out action of the robot and output from an image capturing device, a workpiece displaced amount indicating a displaced amount of an untargeted workpiece in the container caused by picking out a targeted workpiece from the container. The learning unit learns an influence rate on the untargeted workpiece with an associated behavior pattern of the robot for picking out the targeted workpiece from the container, the influence rate depending on the workpiece displaced amount.

Abstract: A method and a device are provided for homogeneously coating surfaces of 3D substrates in a vacuum chamber which has a sputtering source, such as a planar source or a tube or double-tube source, wherein individual substrates, with a curved substrate surface directed toward the sputtering source, are able to be moved past said source in a translational manner. The sputtering source is fastened to a chamber wall within a vacuum chamber so as to have two degrees of freedom such that the sputtering source is able to be set both in terms of its spacing to a surface to be coated of a substrate, which is moved past in front of said sputtering source in a translational manner, and with respect to the surface normal of the surface to be coated proceeding from a fixed point such that the surface normal deviation is 0° at all times.

Abstract: A workpiece processing system has a cooling chamber enclosing a chamber volume. A workpiece support within the cooling chamber supports a workpiece having a material with an outgassing temperature, above which, the material outgases an outgas material at an outgassing rate that is toxic to personnel. A cooling apparatus selectively cools the workpiece to a predetermined temperature. A vacuum source and purge gas source selectively evacuates and selectively provides a purge gas to the chamber volume. A controller controls the cooling apparatus to cool the workpiece to the predetermined temperature, where the one or more materials are cooled below the outgassing temperature. The vacuum source and purge gas source are controlled to provide a predetermined heat transfer rate while removing the respective outgas material from the chamber volume.

Abstract: A processing system for forming an optical coating on a substrate is provided, wherein the optical coating including an anti-reflective coating and an oleophobic coating, the system comprising: a linear transport processing section configured for processing and transporting substrate carriers individually and one at a time in a linear direction; at least one evaporation processing system positioned in the linear transport processing system, the evaporation processing system configured to form the oleophobic coating; a batch processing section configured to transport substrate carriers in unison about an axis; at least one ion beam assisted deposition processing chamber positioned in the batch processing section, the ion beam assisted deposition processing chamber configured to deposit layer of the anti-reflective coating; a plurality of substrate carriers for mounting substrates; and, means for transferring the substrate carriers between the linear transport processing section and the batch processing section

Abstract: Embodiments herein relate to a transport system and a substrate processing and transfer (SPT) system. The SPT system includes a transport system that connects two processing tools. The transport system includes a vacuum tunnel that is configured to transport substrates between the processing tools. The vacuum tunnel includes a substrate transport carriage to move the substrate through the vacuum tunnel. The SPT system has a variety of configurations that allow the user to add or remove processing chambers, depending on the process chambers required for a desired substrate processing procedure.

Abstract: A warped semiconductor die is attached onto a substrate such as a leadframe by dispensing a first mass of die attach material onto an area of the substrate followed by dispensing a second mass of die attach material so that the second mass of die attach material provides a raised formation of die attach material. For instance, the second mass may be deposited centrally of the first mass. The semiconductor die is placed onto the first and second mass of die attach material with its concave/convex shape matching the distribution of the die attach material thus effectively countering undesired entrapment of air.

Abstract: A robot apparatus may include an upper arm adapted to rotate about a first rotational axis and a forearm rotatably coupled to the upper arm at a second rotational axis. A first wrist member may be rotatably coupled to the forearm at a third rotation axis. A second wrist member may be rotatably coupled to the forearm at the third rotation axis. A first end effector may be coupled to the first wrist member and a second end effector may be coupled to the second wrist member. The first wrist member and the second wrist member may be configured to rotate about the third rotational axis between a first pitch and a second pitch as a function of extension of the robot apparatus. Other apparatus and methods are disclosed.

Abstract: An overhead transport vehicle travels along a rail on a ceiling of a building to transport a FOUP. The overhead transport vehicle includes a holding base and an upper shelf transfer device. The holding base holds at least one of a side surface and a bottom surface of the FOUP. The upper shelf transfer device moves the holding base at least upwardly while holding the FOUP. The upper shelf transfer device moves the holding base from the holding position in which the holding base holds and transfers the FOUP to the upper transfer position to transfer the FOUP, which is a different position from the holding position in a plan view and higher than the holding position.

Abstract: A substrate processing apparatus includes a carrier block, a first processing block including first lower and upper processing blocks to deliver a substrate to and from the carrier block, a second processing block including second lower and upper processing blocks provided adjacent to the first lower and upper processing blocks, a relay block including a lifting and transferring mechanism that delivers the substrate between the second lower and upper processing blocks, a controller that controls an operation of each main transfer mechanism such that one of upper and lower processing blocks forms an outward path through which the substrate is transferred from the carrier block to the relay block and the other forms a return path through which the substrate is transferred from the relay block to the carrier block, and a bypass transfer mechanism provided for each of the first and second processing blocks.

Abstract: The disclosure describes devices and systems for a two-sided seal for a load port, and methods for using said seal. A factory interface for an electronic device manufacturing system can include a load port for receiving a substrate carrier. The load port can include a frame adapted for connecting the load port to a factory interface, the frame comprising a transport opening. The load port can also include a seal coupled to the frame. The seal can include a first contact point configured to engage with a load port door when the load port door is in a first position, and configured to disengage with the load port door when the load port door is in a second position and a second contact point configured to engage with a front of a substrate carrier when the substrate carrier is docked on the load port.

Abstract: Provided is a centrifuge apparatus for a processing cartridge, including a rotary plate and at least one cartridge holder, and the cartridge holder is rotatable around its centre axis and arranged off-centre the centre axis of the rotary plate and comprises an inner side wall surrounding a through-going passage, wherein the through-going passage is able to accommodate the processing cartridge; and the inner side wall includes a resilient locking assembly for interaction with at least one cooperating first abutting surface on the processing cartridge, such that the processing cartridge may be inserted into the through-going passage and releasably secured by the locking assembly; and at least one stopping element for interaction with at least one cooperating second abutting surface on the processing cartridge, the at least one stopping element being arranged to retain the processing cartridge at a desired vertical level when the cartridge is releasably secured.

Abstract: Synchronization of multiple vehicles in an independent cart system to reduce spacing and increase throughput designates one of the movers as a leader and at least one additional mover as a follower, defining a chain of vehicles. A motion command for the chain is provided to a controller for the leader, and the controller generates a motion profile. The controller passes this motion profile to a controller for each of the follower movers. If the follower is unable to maintain the motion profile for the leader, the controller for the follower generates a message to the controller for the leader indicating a modification to the motion profile is required. The controller for the leader modifies the motion profile and forwards the modified motion profile to controllers for each follower. If all movers are following the modified profile, the controller for the leader may return to the original motion profile.

Abstract: The disclosure relates to an apparatus for forming patterns on a surface of a substrate plate by a sputtering process, and the apparatus comprises a first vacuum chamber, a sputtering source inside the first vacuum chamber, and an arrangement to place a mask between the sputtering source and the surface of the substrate plate. The disclosure also relates to a method for forming patterns on a surface of a substrate plate by a sputtering process.

Abstract: Methods for aligning a processing chamber using a centering ring and processing chambers having the centering ring are describes. The method includes determining an average central position for the centering ring based on the concentricity of the centering with the support surfaces and adjusting average position of centering ring to a final position based on the average central position.

Abstract: A side storage pod includes an outer enclosure having a sealing surface configured to couple to an EFEM and a side storage pod chamber having a body coupled to vertically-spaced storage members. Each of the vertically-spaced storage members is configured to support a corresponding substrate within the body. The side storage pod further includes a removable door. The removable door and the body are to seal relative to each other responsive to the removable door being in a closed position. A load-unload robot of the EFEM is to access the vertically-spaced storage members responsive to the removable door being in an open position. An environment within the side storage pod chamber is to be controlled to be one or more of: at first environmental conditions responsive to the removable door being in the closed position; or at second environmental conditions responsive to the removable door being in the open position.

Abstract: Disclosed are implementations for efficient purging of substrate carriers (and content held therein) and preventing external contaminants from entering a gas purge apparatus by coupling the gas purge apparatus to a substrate carrier, performing a first gas purging session of an environment of the substrate carrier, receiving a first signal of a first signal type, responsive to receiving the first signal, keeping the gas purge apparatus coupled to the substrate carrier, performing a second gas purging session of the environment of the substrate carrier, receiving a second signal of a second signal type, and, responsive to receiving the second signal, decoupling the purge apparatus from the substrate carrier.

Abstract: A substrate transport apparatus includes a transport chamber, a drive section, a robot arm, an imaging system with a camera mounted through a mounting interface of the drive section in a predetermined location with respect to the transport chamber and disposed to image part of the arm, and a controller connected to the imaging system and configured to image, with the camera, the arm moving to or in the predetermined location, the controller effecting capture of a first image of the arm on registry of the arm proximate to or in the predetermined location, the controller is configured to calculate a positional variance of the arm from comparison of the first image with a calibration image of the arm, and determine a motion compensation factor changing an extended position of the arm. Each camera effecting capture of the first image is disposed inside the perimeter of the mounting interface.

Abstract: The present invention provides a method for handling the content of a catch from a fishing boat comprising the steps of providing a sorting table having crate handling platforms and installing crates on these platforms. The method also has the step of replacing a full crate with an empty crate and placing the full crates on a crate handling frame which frame can be secured within vertical storage containers.

Abstract: A transfer system includes: a transfer chamber having a side wall provided thereon with a plurality of processing chambers in which a processing is performed on a substrate under a decompressed atmosphere, and configured such that the substrate is transferred in the decompressed atmosphere; a plurality of robots fixed in the transfer chamber and configured to transfer the substrate; and a movable buffer configured to hold the substrate and move in a horizontal direction along the side wall between the side wall and the robots in the transfer chamber. The robots exchange the substrate between the movable buffer and the processing chambers in cooperation with a movement of the movable buffer.

Abstract: A vertical batch furnace assembly for processing wafers having a cassette handling space, a wafer handling space, and a first wall and separating the cassette handling space from the wafer handling space. The first wall has at least one wafer transfer opening in front of which, at a side of the first wall which is directed to the cassette handling space, a wafer transfer position for a wafer cassette is provided. The cassette handling space comprises a cassette storage having a plurality of cassette storage positions and a cassette handler configured to transfer wafer cassettes between the cassette storage positions and the wafer transfer position. The cassette handler has a first cassette handler arm and a second cassette handler arm.

Abstract: A transport apparatus including a drive with a drive axis and a first arm connected to the drive. The first arm includes a first link, a second link and an end effector connected in series with the drive. The end effector includes a substrate support section and a leg connecting the substrate support section to a wrist joint of the end effector with the second link. The leg has a first section connected to the wrist joint, a second section connected to the substrate support section, and a bend portion between the first and second sections such that the first and second sections are angled or offset relative to each other. Connection of the leg to the second link at the wrist joint is offset relative to a centerline of the substrate support section and offset relative to the drive axis.

Abstract: A semiconductor apparatus includes a transfer chamber, an annealing station, a robot arm, an edge detector and a trigger device. The transfer chamber is configured to interface with an electroplating apparatus. The robot arm is arranged to transfer a wafer from the transfer chamber to the annealing station. The edge detector, disposed over a predetermined location between the transfer chamber and the annealing station, comprises a first charge-coupled device (CCD) sensor and a second CCD sensor. When the robot arm is carrying the wafer to pass through the predetermined location, the first CCD sensor and the second CCD sensor are located over a first portion and a second portion of the edge bevel removal area respectively, and the trigger device is configured to activate the first CCD sensor and the second CCD sensor to capture an image of the first portion and an image of the second portion respectively.

Abstract: In a vacuum processing device, a loading/unloading port, a normal pressure transfer chamber and a vacuum transfer chamber are arranged in that order from a front side toward a rear side, and load-lock chambers are connected to the normal pressure transfer chamber. The position in the front-rear direction in a movement range of a wafer W in the normal pressure transfer chamber overlaps with the positions in the front-rear direction of the load-lock chambers. Three vacuum processing modules are connected to each of the left and right sides of the vacuum transfer chamber. Vacuum processing units are arranged in each of the vacuum processing modules in a front-rear direction when viewed from the vacuum transfer chamber side. Wafer mounting shelves for holding wafers W in the load-lock chambers are arranged in the front-rear direction when viewed from the vacuum transfer chamber side.

Abstract: A first robot arm places a calibration object into a load lock that separates a factory interface from a transfer chamber using a first taught position. A second robot arm retrieves the calibration object from the load lock using a second taught position. A controller determines, using a sensor, a first offset amount between a calibration object center of the calibration object and a pocket center of the second robot arm. The controller determines a characteristic error value that represents a misalignment between the first taught position of the first robot arm and the second taught position of the second robot arm based on the first offset amount. The first robot arm or the second robot arm uses the first characteristic error value to compensate for the misalignment for objects transferred between the first robot arm and the second robot arm via the load lock.

Abstract: The invention relates to a transport apparatus for transferring a sample between two devices. The transport apparatus comprises a transport tube provided with a carrier for holding a sample. The carrier is movable within said transport tube along a length thereof. The transport apparatus further comprises an actuator tube extending substantially next to said transport tube and which is provided with an actuator element that is movable within said actuator tube. Said actuator element comprises a first magnet part, and said sample carrier is provided with a second magnet part, wherein said first magnet part and said second magnet part are configured such that movement of the sample carrier through said transport tube is linked to movement of the magnetic actuator element through the actuator tube. In this way, movement of the magnetic actuator causes movement of the sample carrier, allowing safe, reliable and protected transport of the sample.

Abstract: A surface decontamination device (1) for decontaminating outer packagings (2) which contain pre-sterilised consumer goods and have a circumferential collar (3) prior to transfer into an insulator includes a conveyor for conveying the outer packagings (2) in a conveying direction (F) along a conveying path from an inlet side to an outlet side of the device (1). The conveying path passes through a decontamination chamber (5) between the inlet side and outlet side. An irradiation source (6) is associated with the chamber (5) for irradiating the outer packagings (2) conveyed through the chamber (5). The conveying path passes through at least one lock chamber (8) arranged between the inlet side and outlet side, adjacent to the chamber (5) and having an inlet and an outlet, the inlet and outlet being able to be opened and closed by a closer.

Abstract: An apparatus for fabricating a semiconductor device has a housing defining a buffer chamber, a plurality of reactor ports formed in the housing for establishing interfaces with a plurality of process chambers that are to receive a wafer during a fabrication process to fabricate the semiconductor device, a wafer positioning robot positioned within the buffer chamber to transport the wafer between the plurality of process chambers through the plurality of reactor ports, a purge port formed in the housing for introducing a purge gas into the buffer chamber, a pump port formed in the housing for exhausting a portion of the purge gas from the buffer chamber, and a first flow enhancer that directs the purge gas flowing in an axial direction along a longitudinal axis of the purge port into the buffer chamber in a plurality of radial directions relative to the longitudinal axis.

Abstract: The present disclosure is an alignment mechanism of a bonding machine, in particular an alignment mechanism of a wafer bonding machine, which mainly has a support pedestal, at least three first alignment pins, and at least three second alignment pins, a first cam and a second cam. When the first cam rotates relative to the support pedestal, it will drive the first alignment pin to move relative to the support pedestal to position the first substrate on the support pedestal. When the second cam rotates relative to the support pedestal, it drives the second alignment pin to move relative to the support pedestal to position the second substrate above the first substrate, so that the second substrate is aligned with the first substrate to facilitate bonding the first substrate and the second substrate.

Abstract: A support member system is described for association with an overhead transport system. The support member system provides a safety feature to the overhead transport system by which the overhead transport system is able to avoid damage to wafers that are contained within a wafer cassette that is unintentionally released by the overhead transport system. The support member system is able to prevent such released cassettes from impacting the ground or tools located under the overhead transport system. The support member system targets wafer cassettes that have dimensions which are different than the dimensions of wafer cassettes for which the overhead transport system was originally designed to transport. Stocker systems for receiving, storing and delivering different types of wafer cassettes are also described.

Abstract: A system comprises a front opening universal pod (FOUP) configured to hold one or more semiconductor wafers and a load dock having a stage and a receiving portion extending above the stage. The FOUP is positioned on the stage. A fan filter unit (FFU) positioned above the load dock. An air flow optimizer device is disposed on the receiving portion and under the FFU. The air flow optimizer device has an inlet opening and an outlet opening and a channel extends between the inlet opening and the outlet opening.

Abstract: In an embodiment, a semiconductor processing tool for implementing hybrid laser and plasma dicing of a substrate is provided. The semiconductor processing tool comprises a transfer module, where the transfer module comprises a track robot for handling the substrate, and a loadlock attached to the transfer module. In an embodiment, the loadlock comprises a linear transfer system for handling the substrate. In an embodiment, the processing tool further comprises a processing chamber attached to the loadlock, wherein the linear transfer system of the loadlock is configured to insert and remove the substrate from the processing chamber.

Abstract: A reticle pod is provided. The reticle pod includes a container and a fluid regulating module mounted to the container. The fluid regulating module includes a first cap, a second cap and a sealing film. The first cap and the second cap are connected to each other. A flowing path is formed between the first cap and the second cap for allowing a fluid passing through the fluid regulating module. The sealing film is positioned between the first cap and the second cap and configured for regulating a flow of the fluid passing through the flowing path.

Abstract: An automated storage and retrieval system includes a grid-based rail structure and a plurality of remotely operated vehicles arranged to operate on the grid-based rail structure. The automated storage and retrieval system includes a locking device arranged in a zone of the grid-based rail structure where a human and/or a robotic operator is permitted to interact with the remotely operated vehicle or contents of a storage container that the remotely operated vehicle is carrying. The locking device is arranged to lock the remotely operated vehicle against accidental displacement prior to interaction with the human and/or robotic operator, and wherein the locking device being arranged to unlock the remotely operated vehicle once interaction with the human and/or robotic operator is no longer required.

Abstract: To realize a laser irradiation apparatus by using which accuracy in processing a substrate can be improved. A laser irradiation apparatus according to an embodiment includes a laser irradiation unit configured to apply laser light to a substrate, a base part, and a conveyance stage configured to convey the substrate. The conveyance stage includes a stage configured to be movable over the base part, a base flange fixed over the stage, a substrate stage fixed to an upper end part of the base flange and configured so that the substrate is placed thereover, and a pusher pin for supporting the substrate, the pusher pin being configured to penetrate the substrate stage and to be movable up and down.

Abstract: A substrate treating apparatus includes a transporting space, transport mechanisms, and heat-treating sections. The transport mechanisms are provided in the transporting space. The heat-treating section, transporting space, and heat-treating section are aligned in the stated order in a transverse direction. One heat-treating section includes a plurality of heat-treating units. The heat-treating units are arranged in a longitudinal direction. The other heat-treating section includes a plurality of heat-treating units. These heat-treating units are also arranged in the longitudinal direction. One transport mechanism transports substrates to the heat-treating units. The other transport mechanism also transports substrates to the heat-treating units.

Abstract: A substrate processing apparatus includes a first atmosphere control system configured to control an atmosphere inside a processing zone of a substrate processing area and a second atmosphere control system configured to control an atmosphere inside a substrate transfer zone of the substrate processing area. The first atmosphere control system supplies, when a liquid processing is performed in a liquid processing unit, an atmosphere control gas to the corresponding liquid processing unit by a first gas supply, and discharges an atmosphere inside the corresponding liquid processing unit by a first gas discharge unit. The second atmosphere control system circulates an atmosphere adjustment gas in a circulation system of the corresponding second atmosphere control system, and discharges an atmosphere inside the circulation system of the second atmosphere control system when at least one of the liquid processing unit is opened to the substrate transfer zone.

Abstract: A substrate processing method capable of improving thin film uniformity on a substrate by controlling the position of a substrate supporting apparatus includes: a first operation of moving the substrate supporting apparatus in a first direction by a first predetermined distance; a second operation of moving the substrate supporting apparatus in a second direction by a second predetermined distance; a third operation of moving the substrate supporting apparatus in the second direction by the first predetermined distance; and a fourth operation of moving the substrate supporting apparatus in the first direction by the second predetermined distance, wherein the second direction may be opposite to the first direction.

Abstract: A wafer transfer apparatus is provided. In a minimum transformed state where a robot arm is transformed such that a distance defined from a pivot axis to an arm portion, which is farthest in a radial direction relative to the pivot axis, is minimum, a minimum rotation radius R, is set to exceed ½ of a length B in the forward and backward directions of an interface space, the length B corresponding to a length between the front wall and the rear wall of the interface space forming portion, and is further set to be equal to or less than a subtracted value obtained by subtracting a distance L0 in the forward and backward directions from the rear wall of the interface space forming portion to the pivot axis, from the length B in the forward and backward directions of the interface space (i.e., B/2<R?B?L0).