Abstract: This disclosure is directed to automated warehouse facilities that are configured to assemble mixed pallets. The warehouse facilities can include one or more layer handling devices that are configured to remove layers from pallets in a delayering operational mode, and to add layers to pallets in a palletizing operation mode. The warehouse facilities also may include one or more item retrieval devices that are configured to retrieve individual items from storage racks. The warehouse facilities can include other automated devices as well.

Abstract: An operation method of a semiconductor removing apparatus includes moving a semiconductor structure to a stage, wherein the semiconductor structure includes a lower substrate, a cap, and a micro electro mechanical system (MEMS) structure between the lower substrate and the cap, and the cap has a diced portion; pulling, by a clamp assembly, a tape of a tape roll from a first side of the stage to a second side of the stage opposite to the first side, such that the tape is attached to the cap of the semiconductor structure; and pulling, by the clamp assembly, the tape of the tape roll from the second side of the stage back to the first side of the stage, such that the diced portion of the cap separates from the semiconductor structure.

Abstract: A component supply device includes a pallet configured to allow a tray to be arranged thereon, a magazine operable to hold a plurality of pallets, and a magazine holder configured to allow the magazine to be arranged therein. The magazine holder is configured to allow the pallet to be conveyed from the magazine that has been arranged to a component supply position. The component supply device further includes a magazine supply unit configured to supply the magazine to the magazine holder, a magazine ejection unit configured to receive the magazine ejected from the magazine holder, and a magazine conveyance unit configured to convey the magazine from the magazine supply unit to the magazine holder.

Abstract: The present disclosure, in some embodiments, relates to a method of transporting a semiconductor wafer. The method includes transferring a semiconductor wafer into a first wafer slot of a second plurality of wafer slots within an adaptive inset. The adaptive inset is arranged within an interior cavity of a wafer cassette having a first plurality of wafer slots while transferring the semiconductor wafer into the first wafer slot. The wafer cassette and the adaptive inset are transported into a loading port of a semiconductor processing tool configured to perform a fabrication process on the semiconductor wafer.

Abstract: A method and apparatus for controlling a continuous machining process includes a robot, a machining tool, a table, and a raw parts supply mounted inside a machining cell enclosure. The table has first and second vises for holding parts. The machining tool is operated to machine a raw part in one of the vises while the robot is operated to pick a machined part from the other vise and then place another raw part into the other vise. The table can be fixed or rotatable. The robot places the picked machined parts on an exit conveyor to remove the machined parts from the enclosure.

Abstract: A system for performing tests using automated test equipment (ATE) is disclosed. The system comprises a robot comprising an end effector operable to pick up and transfer a DUT in-and-out of a test slot in a primitive. The system further comprises a system controller comprising a memory and a processor for controlling the robot. Also, the system comprises a test rack comprising a plurality of primitives, wherein the primitive is a modular device comprising a plurality of slots for testing a plurality of DUTs, and wherein the robot is configured to access slots in the plurality of primitives within the test rack using the end effector.

Abstract: A component supply device is a feeder which uses a supply tape to supply an electronic component, and includes a main carrier route for carrying the supply tape to a component suction position, a first carrier route for carrying the supply tape from a tape insertion position to a rear end part of the main carrier route, a second carrier route provided so as to be aligned below the first carrier route, a second sprocket which carries the supply tape to the component suction position, a third sprocket which carries the supply tape from the tape insertion position to the second sprocket, and a route switching device provided to a loading unit which automatically changes a carrier route of the supply tape from the first carrier route to the second carrier route when the supply tape is carried to the component suction position.

Abstract: A system and method for automatically moving one or more parts between a bin at a source location and a destination using a robot is provided. The system includes a first vision system to identify a part within the bin and to determine the pick location and pick orientation of the part. A second vision system determines the location and orientation of a destination inside or outside of the bin, which may or may not be in a fixed location. A controller plans the best path for the robot to follow in moving the part between the pick location and the destination. An end effector is attached to the robot for picking the part from the bin, holding the part as the robot moves it, and placing the part at the destination. The system may also check the part for quality by one or both of the vision systems.

Abstract: A feeder includes a feeder main body, a tape guide provided in feeder main body, a tape separating device to separate cover tape covering component storage sections, a tape conveyance path between the feeder main body and the tape guide and having recessed groove through which the component storage sections of the embossed carrier tape can be inserted, and a pressing device disposed in the recessed groove of the tape conveyance path to press the embossed carrier tape in a direction in which the embossed carrier tape is brought into abutment with the tape guide. The pressing device is positioned at both sides of the component storage sections in a width direction in of the recessed groove and presses flange sections of the embossed carrier tape without pressing the component storage sections.

Abstract: Apparatus, systems and methods for providing smart pick-up and drop-off are presented. The apparatus comprises at least one vertical support member and at least one storage shelf supported by the at least one vertical support member. A payload transfer surface, supported by the vertical support members, is located below the lowest storage shelf. The payload transfer surface has an access channel so that a self-driving material-transport vehicle equipped with a lift appliance can pick up or drop off a payload on the payload transfer surface. A sensor associated with the payload transfer surface senses the presence or absence of a payload on the payload transfer surface, and sends a signal to a fleet-management system in communication with the self-driving material-transport vehicle.

Abstract: A method and a system for the exact positioning an autonomous robot device relative to a stationary structure, such as a DBCS robot in a delivery bin and sorting facility. The robot device is driven from a starting position towards a target position. An absolute positioning sensor is used to monitor the approach to towards an assumed absolute position of the target. Once the target position has entered the field of view of a vision sensor mounted to the robot device, the vision sensor takes an instantaneous image of a visual marker at the target position. The image is evaluated to determine a deviation of an actual location of the target position from the assumed target position. The latter is corrected by adding the deviation to the assumed target position. The robot device then continues and is stopped exactly at the corrected target position.

Abstract: A reel holder on which is loaded tape reel is held on feeder main body of tape feeder so as to be displaceable in the width direction of feeder main body by link mechanism. By this, it is possible to displace the position of tape reel of tape feeder set on feeder setting table of a component mounter in the width direction of feeder main body based on the reel width of tape reel of an adjacent tape feeder, and tape reel of each tape feeder can be arranged making efficient use of the empty space between adjacent tape feeders.

Abstract: A system to process semiconductor wafers includes an end effector, a proximity sensor and a controller. The end effector may be adapted to handle a semiconductor wafer. The proximity sensor may be attached to the end effector and may output a first sensor signal if a distance between the end effector and an object separated from the end effector is less than or equal to a first predetermined distance. The controller is responsive to the first sensor signal to slow a movement of the end effector. The proximity sensor further outputs a second sensor signal if the distance between the end effector and the object is less than or equal to a second predetermined distance in which the second predetermined distance being less than the first predetermined distance. The controller is responsive to the second sensor signal to stop movement of the end effector.

Abstract: A tape feeder includes a reel holding section, a feeder main body, and a movable mechanism which is provided between the feeder main body and the reel holding section, and allows the reel holding section to relatively move with respect to the feeder main body. The movable mechanism is capable of changing a position of the reel holding section with respect to the feeder main body between an upper position and a lower position, and is capable of changing the position of the reel holding section between a proximity position and a separation position at least at the lower position.

Abstract: Reliability in the restriction of the movement of a container is improved. A content moving device 1 includes: a table portion 20 on which a container 50 is placed; and a restricting mechanism 30. A flange 55 of the container 50 is shaped to provide a recessed portion 56a. A restricting mechanism 30 includes: a collar portion 31; a first restricting portion 32 configured to be located in the recessed portion 56a; a second restricting portion 33a provided above the first restricting portion 32 and inward of the collar portion 31; and a second moving mechanism.

Abstract: An apparatus for treating a substrate, an apparatus for transferring a substrate and a method for transferring a substrate are provided. The substrate treating apparatus comprises a receiving unit having a plurality of vertically arranged substrate supporting members and a transferring unit having an upper transfer member transferring a substrate to the receiving unit. The upper transfer member comprises a first arm and a second that are vertically spaced apart from each other and are independently driven to extend horizontally. A plurality of vertically arranged first hands is connected to the first arm and a single hand is connected to the second arm. According to an embodiment, a plurality of substrates can be transferred to a right position.

Abstract: A modular cluster tool is disclosed. According to one embodiment, a system, comprises a wafer transfer station that includes a first vacuum chamber that stores a plurality of semiconductor wafers. The system also includes an equipment front end module interface, and two or more shuttle lock interfaces.

Abstract: A substrate transport apparatus for transporting substrates, the substrate transport apparatus including a frame, at least one transfer arm connected to the frame, at least one end effector mounted to the at least one transfer arm and at least one substrate support pad disposed on the at least one end effector, the at least one substrate support pad has a configuration that effects increased friction force, resulting from an increased friction coefficient, in at least one predetermined direction.

Abstract: A substrate storing container that stores substrates composed of semiconductor wafers includes: a locked portion that is arranged at a center portion of an upper wall and is locked by a lifting member that can lift a container main body; in which the locked portion includes a plate-like flange portion having a lower face that faces the upper wall and an elastically deformable elastic member provided at a lower face of the flange portion and/or at a rim portion of the flange portion; and in which the locked portion is locked by the lifting member in a state in which the elastic member is sandwiched between the flange portion and the lifting member.

Abstract: The substrate storage container includes: a container body for storing a semiconductor wafer; a lid body for opening and closing a front of the container body; and a locking mechanism for locking the lid body that has closed the front of the container body. The lid body is formed of a lid main body to be fitted to the front of the container body and a cover plate for covering a front face of the lid main body. The locking mechanism includes a rotating operation portion that is pivotally supported by the lid main body and rotationally operated from an outside of the cover plate. A plurality of posture control members for the rotating operation portions are provided for, at least, the cover plate, among the cover plate and the rotating operation portion.

Abstract: A separating device includes a base, a feed mechanism operable to convey first and second electronic component to a discharge end thereof, and a separating mechanism disposed on the base and including a first carrier connected slidably to the base and configured to carry the first electronic component, a second carrier connected slidably to the base and configured to carry the second electronic component, and a drive unit for driving reciprocation of the first and second carriers between a pick-up position, where the first carrier abuts against the second carrier, and a separating position, where the first and second carriers are separated from each other.

Abstract: Disclosed is a working method using a sensor, which increases recognition of a component to increase mounting of a component and enhancing productivity. The working method includes: extracting an object to be picked from a pile of objects using the sensor; picking the extracted object to move the picked object to a predetermined place; and estimating an angle of the moved object in the current position using the sensor. Accordingly, the working method can perform precise component recognition and posture estimation by two steps: a component picking step and a component recognition step, and effectively apply to a manufacturing line, thereby improving mounting of a component and enhancing productivity of a product.

Abstract: To provide a work transfer apparatus which can transfer works at high speed with controlling respectively the posture of the right and left of works. The work transfer apparatus includes an arm moving back and forth between machines in order to transfer work(s), a crossbar coupled to the arm, and a pair of right and left work holding devices provided at the left and right sides of the crossbar and tilt drive devices being provided on the arm, respectively controlling the work holding devices to rotate around an axis of a longitudinal direction of the crossbar.

Abstract: The present invention provides a substrate carrying mechanism, a substrate processing apparatus, and a semiconductor device manufacturing method that, when carrying a substrate, suppress the generation of scratches and particles caused by substrate deformation, suppress a decrease in substrate holding force due to substrate deformation, and realizes stable high-speed carriage. Namely, the substrate carrying mechanism, the substrate processing apparatus, and the semiconductor device manufacturing method of the present invention include: a plate-like body that becomes a support base body of a substrate that is a carrying subject; and substrate support portions in which plural convex portions disposed on a surface of the plate-like body are placed on a circumference of a circle that is smaller than the diameter of the substrate.

Abstract: An information processing apparatus for performing recognition processing by a recognizer for a position and orientation of a work subject to undergo work by a working unit of a robot arm. The information processing apparatus including an obtaining unit adapted to obtain, for each of a plurality of positions and orientations of the work subject, a position and an orientation of the working unit in which the working unit can perform the work, and a restriction unit adapted to restrict a position and an orientation of the work subject used in the recognition processing by the recognizer to a position and an orientation of the work subject corresponding to the position and the orientation of the working unit that have been obtained by the obtaining unit.

Abstract: An electronic component feeder and a chip mount having the electronic component feeder are provided. The electronic component feeder includes a body having a pickup position at which electronic components are picked up and a plurality of component feed paths guiding respective component feed tapes holding the electronic components to the pickup position, and which switches the component feed paths to select a component feed path guiding a component feed tape to the pickup position so that the electronic components held in the component feed tape are picked up at the pickup position, based on a component holding state about the electronic components held in one of the component feed tapes.

Abstract: After a cassette is mounted on a cassette mounting part, a control unit instructs a substrate treatment apparatus to start treatment on substrates in the cassette. Thereafter, the control unit indicates, to the substrate treatment apparatus, a cassette on the cassette mounting part to which a substrate is transferred at completion of the treatment. If the transfer destination cassette for the substrate at the completion of treatment has not been indicated when a number of remaining treatment steps for the substrate reaches a predetermined set number, an alarm is given from the substrate treatment apparatus. This alarm is sent from the substrate treatment apparatus to the control unit, and the control unit indicates a transfer destination cassette for the substrate.

Abstract: At least a first reticle is stored in a housing of a stocker. A first gas is delivered to the housing. At least one reticle pod having an additional reticle is delivered into a enclosure within the housing of the stocker. A second gas different from the first gas is delivered to the enclosure. The reticle pod is automatically retrieved from the enclosure. The delivery and retrieval of the reticle pod and delivery of the first gas and the second gas are automatically controlled.

Abstract: A substrate processing apparatus having a station for loading and unloading substrates from the apparatus, includes an aperture closure for sealing a loading and unloading aperture of the station, a fluidic magazine door drive for removing a door of a substrate magazine and thus opening the substrate magazine and for operating the aperture closure to open the aperture, and sensor for mapping vertical locations of substrates mounted to the magazine door of the drive. The fluidic magazine door drive may include an encoder different from the sensor, the encoder being configured for determining the vertical location of the sensor.

Abstract: The present invention provides a glass support system, including methods and equipment for supporting a glass substrate on a column of air. The disclosed glass alignment equipment may be used to prevent or reduce defects or contamination on the surface of a glass substrate which may arise when the glass is aligned prior to etching. In particular, a support pin of the present invention may be used with an air circulation system to support or align glass over a column of air so as to reduce or prevent defects or contamination on the glass in dry etching processes used in the manufacturing of LCDs and other devices.

Abstract: A joint tong apparatus for a radiation shielding facility. A spherical ball has a through-hole. An inner spherical socket and an outer spherical socket are installed in a hole formed in a partition between a radiation-shielded room and a control room so as to enclose the spherical ball on inner and outer sides. A bar is inserted and coupled into and to the through-hole of the spherical ball. An inner joint assembly has a first housing coupled to a shielded room-side end of the bar and a first pivot member pivotably mounted on a free end of the first housing. An outer joint assembly having a second housing coupled to a control room-side end of the bar and a second pivot member pivotably mounted on a free end of the second housing. The apparatus further includes a tong assembly, a handle assembly, a tong manipulation cable, and a pair of pivot manipulation cables.

Abstract: A device for unloading a container having a removal opening has a rotatably mounted supporting surface mounted to turn around a first turning axis, a rotatably mounted retaining device, and a synchronizing device. The unloading device causes a container on the supporting surface to tilt so that the removal opening of the tilted container points obliquely or vertically downwards. The retaining device prevents an article inside the tilted container from moving linearly through the removal opening. The retaining device is mounted to turn around a second turning axis. The synchronizing device is configured for synchronizing turning of the supporting surface around the first turning axis and the retaining device around the second turning axis. The synchronized turning of the supporting surface and retaining device causes the container standing on the supporting surface to tilt such that the removal opening of the tilted container points obliquely or vertically downwards.

Abstract: An apparatus to feed elongated metallic workpieces to a manufacturing process including a storage hopper configured to hold a plurality of workpieces that are randomly oriented and a movement device having a workpiece support that is automatically engageable with a workpiece.

Abstract: A structure for independently supporting a wafer and a mask in a processing chamber is provided. The structure includes a set of extensions for supporting the wafer and a set of extensions supporting the mask. The set of extensions for the wafer and the set of extensions for the mask enable independent movement of the wafer and the mask. In one embodiment, the extensions are affixed to an annular ring which is capable of moving in a vertical direction within the processing chamber. A processing chamber, a mask, and a method for combinatorially processing a substrate are also provided.

Abstract: A system for transporting and storing rod shaped articles, including a loading station, the loading station including an inlet aperture, an outlet aperture, a rotor rotatably disposed within the loading station, and a buffer container. The system also including an unloading station, the unloading station including an inlet aperture, a transfer conduit, a rotor rotatably disposed within the unloading station, and a buffer container. The system further including a mobile container selectively coupleable to the loading station and the unloading station, and further including an inlet/outlet aperture defined in a wall thereof and a plurality of translatable magazines disposed within the mobile container.

Abstract: A system and method is disclosed for calibrating a semiconductor wafer handling robot and a semiconductor wafer cassette. A robot blade boot is attached to a robot blade of the semiconductor handling robot. The robot blade boot decreases a value of tolerance for the robot blade to move between two semiconductor wafers in the semiconductor wafer cassette. In one embodiment the vertical tolerance is decreased to approximately twenty thousandths of an inch (0.020?) on a top and a bottom of the robot blade boot. The use of the robot blade boot makes the calibration steps more critical and precise. The robot blade boot is removed from the robot blade after the calibration process has been completed.

Abstract: A feeder for a surface mount placement system includes a feeder body comprising a shaft, a front cover, and a rear cover. The front cover has one end pivotally installed on the feeder body via the shaft, a free end, and a pair of sidewalls respectively extending from two sides of the free end towards the feeder body. The rear cover pivotally installed on the feeder body, including a blocking portion, and the free end of the front cover overlap. The blocking portion is wider than the distance between the sidewalls of the front cover.

Abstract: In the present invention, through the provision of a tray placing rack for storing trays in multi steps, the trays accommodating electronic parts after inspection are received in the racks and through the provision of a tray stacking rack above the tray placing rack, an empty tray emptied by having been inspected of the electronic parts before inspection at an inspection stage is stacked on the tray stacking rack. When a certain tray is filled with electronic parts after inspection and is discharged, an empty ray is taken out from the tray stacking rack and the empty tray is fed to the rack position of the discharged tray to permit re-use of empty trays.

Abstract: Disclosed is a substrate processing system with a magnetic conduit configuration to improve the movement of a substrate carrier within the system. The configuration specifically provides for safe, secure movement of a carrier between multiple levels of a substrate processing system by using magnetic conduits to redirect magnetic forces created by a linear motor, permitting the linear motor to be positioned outside of the system and in a location that will not interfere with the movement of the carrier.

Abstract: A viscous material feed system, comprises a feed tube that receives material expressed from a container; and a container evacuator comprising a chamber to hold a container to express material from the container to the feed tube and a plunger comprising a platen axially and slidably accommodated within the chamber, the platen comprising an O-ring fitted against a platen driving face; a full ring with tabs extending to secure the O-ring to the platen driving face with a circumferential surface exposed to the chamber and a vacuum breaker valve to the chamber that seals the platen face when in contact with container material and retains residual material adhering to the platen face when the valve is activated at a termination of a driving cycle of the platen through a container content.

Abstract: A loader picks up a workpiece from a container, and delivers it to a workstation downstream. An unloader receives the workpiece from the workstation upstream and puts it into a container. In the loader and the unloader respectively, a first stacker and a second stacker, for holding containers in stacked manner, are placed in parallel along direction Y. A table working as a container moving mechanism moves an extracted container along direction Y. A first container transfer mechanism extracts a container from the containers stacked in the first stacker and delivers it to the container moving mechanism. A second container transfer mechanism receives the container from the moving mechanism, and stacks it in the second stacker. A transfer-head working as a workpiece transfer mechanism picks up the workpiece from the container on the table, moves it along direction X, and delivers it to the workstation downstream.

Abstract: A product (Pr) can be used in the semiconductor, MEM, flat screen and/or solar cell industries, where the product is capable of being gripped by a handling system (Bm). The product can include: a plate (1) made of silicon, quartz, silicon carbide, silicon nitride, arsenic, and/or gallium arsenide, comprising one first (2) and one second (3) opposite faces, a plateau (4) defined by at least one face (5) opposite the plate, an attachment means (7) of the plate (1) on the plateau (4) so that the at least one face (5) of the plateau (4) is opposite the first (2) or second (3) face of the plate, and a first gripping means (11) mounted in association with the plateau (4), where these said first gripping means is able to cooperate and is removable with second gripping means (12) in addition to the first gripping means (11), the second additional gripping means belonging to the handling system (Bm). Another embodiment of the invention is directed to a system for handling the product.

Abstract: The invention provides methods, systems and apparatus for opening a substrate carrier. The invention provides a novel loadport for receiving a substrate carrier from a substrate carrier transport system. The loadport includes a door opening mechanism adapted use vacuum pressure to hold a substrate carrier door against the door opening mechanism. The loadport is further adapted to apply a gas flow to the periphery of the substrate carrier to block potential contaminants from entering the substrate carrier. Numerous other features are provided.

Abstract: In an automated guided vehicle including a transfer equipment which transfers a wafer, a buffer cassette which temporarily stores the wafer, and a pressing member which is provided at an opening of the buffer cassette, when traveling the automated guided vehicle, if the pressing member is slid to a center position from an end position of the opening of the buffer cassette to contact and press against the edge of the wafer, the pressing member was easily damaged by being rubbed against a periphery of the wafer, and there was a problem in durability of the pressing member. The pressing member 55 can transfer between a “pressing” position which contacts against the edge of the wafer 10 to press the wafer 10, and a “receding” position which is located away from the edge of the wafer 10.

Abstract: The present invention provides tools and methods of processing microelectronic substrates in which the tools maintain high throughput yet have dramatically lower footprint than conventional tools. In preferred aspects, the present invention provides novel tool designs in which multiple tool functions are overlapped in the x, y, and/or z axes of the tool in novel ways.

Abstract: A mechanical apparatus and method are disclosed for orienting and positioning semiconductor wafers while avoiding contamination of elements on the faces thereof, by only contacting the peripheries thereof. The apparatus may include a frame for wafer supports and a semiconductor wafer gripping arm. The gripping arm is mounted on a translator for movement in X, Y, and Z directions to engage and move wafers in, from, and between supports. The gripping arm comprises a rigid structure with a plurality of semiconductor support wheels mounted thereon to support a wafer only around its periphery. A drive wheel is provided to orient a supported wafer rotationally while it is being supported around its periphery. A detector is provided to detect orientation of the wafer relative to a notch or other position mark on its periphery.

Abstract: According to one aspect of the invention, a system for handling microelectronic dies is provided. Two vertical supports are secured to the frame of the die handler. A wafer support, to support a semiconductor wafer, is mounted between the vertical supports such that the wafer can rotate about its central axis. An ejector arm track is mounted between the vertical supports below the wafer. An ejector arm is mounted to the track for rotation about the central axis of the wafer, and an ejector head is mounted to the ejector arm for translational movement along the ejector arm. A pick arm track is mounted between the vertical supports above the wafer. A pick arm is mounted to the track for rotation about the central axis of the wafer, and a pick head is mounted to the pick arm for translational movement along the pick arm.

Abstract: The present invention relates to an apparatus for handling strapped units of boards, said apparatus comprising a stacker carrier (5) capable of moving the strapped units (2) placed on a support bed (4) in a storage area into storage stacks and off from said storage stacks, respectively. To the opposite sides of said stacker carrier (5) are adapted lift units (23, 24) adapted so as to be individually movable and arranged to cooperate so as to elevate/lower the strapped units of boards resting on said support bed (4). The invention also 23 concerns a support bed suitable for use in the apparatus.

Abstract: Reticle-holding devices (reticle “pods”) are disclosed for holding circular reticles as used microlithography systems that use circular reticles. An exemplary reticle pod includes a base and cover. Mounted to the base are multiple (desirably three) reticle-support blocks providing three respective, equally spaced, reticle-contact surfaces that support a reticle in the peripheral “handling zone” of the reticle. Mounted to the inside surface of the cover are corresponding compliant pressure-application members (desirably respective flat springs terminating with respective reticle-contact members) that apply a holding force to the reticle. A respective portion of the reticle is situated between each pressure-application member and a respective reticle-support surface. Thus, the reticle, configured as a SEMI standard wafer, is stably held at three points in the handling zone of the reticle without damaging the reticle.

Abstract: A position detecting device and a takeout apparatus capable of obtaining information on height or stage number of an object in a stack of objects by a two-dimensional image capturing device for an operation of taking out the object by a robot. A CCD camera is arranged at a position above a place where workpieces stacked in multiple stages are provided. An image processing device determines a size of the image of the uppermost workpiece in a two-dimensional image captured by the camera. The height or stage number of the workpiece is determined from the size of the workpiece image using a stored relation table or arithmetic expression representing relationship between the height or stage number of the workpiece and the size of the workpiece. For a plurality of kinds of workpieces, the relation table/arithmetic expression is stored for each kind of workpiece and selectively used in accordance of a mark on the workpiece which indicate the kind of workpiece.