Abstract: An ion implantation system provides ions to a workpiece positioned in a vacuum environment of a process chamber on a cooled chuck. A pre-chill station within the process chamber has a chilled workpiece support configured to cool the workpiece to a first temperature, and a post-heat station within the process chamber, has a heated workpiece support configured to heat the workpiece to a second temperature. The first temperature is lower than a process temperature, and the second temperature is greater than an external temperature. A workpiece transfer arm is further configured to concurrently transfer two or more workpieces between two or more of the chuck, a load lock chamber, the pre-chill station, and the post-heat station.

Abstract: A component aligning apparatus includes a component aligning jig, in which electronic components to be aligned have a rectangular parallelepiped shape whose length dimension is L, width dimension is W, and thickness dimension is T, the component aligning jig includes electronic component accommodating recesses opening on a surface, the depth Z of the accommodating recesses is shorter than the length L of the electronic components so that a single electronic component is held in each of the electronic component accommodating recesses while partially projecting upwards from each of the recesses with the WT surface on one side facing up, and letting s be the shortest separation that is larger than the thickness T and is the narrowest distance between opposing inside surfaces of each of the accommodating recesses when each of the accommodating recesses is seen in plan view, W>S>T.

Abstract: A method for operating an assembly tool includes deposing a first component on an assembly surface with a first tool tip of a manipulator having a range of motion defined by a plane and an axis that is substantially normal to the plane, deposing a second component on the assembly surface, changing an orientation of the assembly surface relative to the axis from a first orientation to a second orientation, lifting the first component from the assembly surface with a second tool tip of the manipulator, and deposing the first component on the second component.

Abstract: In stacking tray supplying for receiving in a stacked state a plurality of trays that are received in a state in which components to be mounted onto a board are aligned, two tray stages are provided rotationally transferably on a concentric circle. In a state in which one is positioned in a feeding tray placement position and the other is positioned in a standby tray placement position, components are fed from the tray stage positioned in the feeding tray placement position. When a component depletion state occurs, the tray stages are rotationally transferred to switchover the mutual placement positions, by which waste of time required to feed components is reduced.

Abstract: In a chip transferring apparatus a wafer (44) and a lead frame (50) are positioned. A first chip (42) is picked up from the wafer (44) by a transfer head (14; 40a-40d) in a chip pick-up position, while bonding a second chip to the lead frame (50) by another transfer head in a chip bonding position. The first chip (42) is then transferred by said one of the transfer heads from the chip pick-up position to the chip bonding position. Next, the first chip (42) is bonded on the lead frame (50) by said one of the transfer heads (14; 40a-40d) in the chip bonding position, while another one of the transfer heads picks up a third chip from the wafer (44) in the chip pick-up position. Each transfer head (14; 40a-40d) comprises a collet (66a-66d) which, through a mechanical coupling, is coupled to another collet for compensating radial forces exerted on the collet relative to said axis of rotation.

Abstract: A manipulator for servicing tubes extending through a tube sheet having three major components: a base member, a block member, and a foot member. The base member has a holder for supporting tooling or inspection devices. The base member also has at least one gripper for releasably gripping a tube extending through the tube sheet. The block member is connected to the base member for linear movement and rotation relative to the base member. The foot member is connected to the block member for linear movement relative to the block member. The foot member has at least one, and preferably two grippers, for releasably gripping a tube extending through the tube sheet. The manipulator supports itself using the two sets of expandable and translatable grippers that anchor into the tube ends and can move from tube to tube by alternately engaging each set of grippers.

Abstract: An integrated system is disclosed for workpiece handling and/or inspection at the front end of a tool. The system comprises a rigid member of unitary construction such as a metal plate which mounts to the front of a tool associated with a semiconductor process. The front end components, including the load port assemblies, prealigners and workpiece handling robot, are mounted to the plate to provide precise and repeatable positioning of the front end components with respect to each other.

Abstract: A pick and place mechanism for assembling a large number of contactors on a contact substrate. The pick and place mechanism includes a first area for positioning an intermediate plate having a plurality of contactors thereon, a second area for positioning the contact substrate for receiving the contactors thereon, a carrier provided between the first and second areas for converting a direction of the contactor to a predetermined direction when receiving the contactor on a seat having an inclined back wall and a flat bottom surface, a first transfer mechanism for picking the contactor from the intermediate plate and placing the contactor on the seat of the carrier, a second transfer mechanism for picking the contactor from the seat of the carrier while maintaining the predetermined direction of the contactor defined by the carrier and placing the contactor on the contact substrate.

Abstract: The invention is a carrier comprising three support elements connected by an underlying frame. The periphery of a wafer rests upon the support elements. The invention also comprises a wafer handler with a plurality of arms. Spacers space the carrier above a base plate associated with a station in a wafer handling area. An arm slides beneath the frame and between the spacers, but the handler does not contact the wafer. A method of using the handler and carrier is provided where the handler lifts and rotates the carrier with the wafer through various stations in a wafer handling area. A control device reduces the handler speed only at critical points of the processing cycle. The handler is capable of moving a plurality of carriers and wafers simultaneously.

Abstract: Workpieces such as chips are removed from a receiving plane by a transfer unit, which carries them to a delivery plane. The workpieces are transported in two segments during two phases, each workpiece being deposited between the phases on an intermediate station arranged in the region of the feed path. The transfer unit has two working heads, which simultaneously transport one workpiece from the receiving plane to the intermediate station, and another workpiece from the intermediate station to the delivery plane. The workpiece can be pivoted or rotated at the intermediate station so that its lower surface can be grasped by the depositing head.