Abstract: A light source includes a light emitting element configured to emit a light; a mounting substrate; and a ceramic substrate having a light emitting element mounted thereon and being bonded to the mounting substrate via a plurality of metal bumps made of gold, copper, a gold alloy, or a copper alloy. A method of manufacturing a light source includes forming a plurality of metal bumps on a mounting substrate; providing a ceramic substrate having at least one light emitting element mounted thereon; and bonding the mounting substrate and a ceramic substrate to each other via the metal bumps.

Abstract: A multi-layer pillar and method of fabricating the same is provided. The multi-layer pillar is used as an interconnect between a chip and substrate. The pillar has at least one low strength, high ductility deformation region configured to absorb force imposed during chip assembly and thermal excursions.

Abstract: A multi-layer pillar and method of fabricating the same is provided. The multi-layer pillar is used as an interconnect between a chip and substrate. The pillar has at least one low strength, high ductility deformation region configured to absorb force imposed during chip assembly and thermal excursions.

Abstract: The disclosure provides gold alloys. The alloys can have improved strength and hardness. The gold alloys can have various gold colors, including yellow gold and rose gold. The gold alloys can be used as enclosures for electronic devices.

Abstract: The present invention relates to a method for manufacturing at least one portion of a seal ensuring gas-tightness between at least one first and one second glass panel in a glazing system, the method including the following steps: depositing a first adhesive layer on a first peripheral area of the first panel and a second adhesive layer on a second peripheral area of the second panel; welding a first metal seal element to the first adhesive layer; welding a second metal seal element or said first metal seal element to the second adhesive layer. According to the invention, the first and second adhesive layers are deposited using a high-speed oxy-fuel flame-spraying method.

Abstract: Provided by the present invention are a fine crystallite high-function metal alloy member, a method for manufacturing the same, and a business development method thereof, in which a crystallite of a metal alloy including a high-purity metal alloy whose crystal lattice is a face-centered cubic lattice, a body-centered cubic lattice, or a close-packed hexagonal lattice is made fine with the size in the level of nanometers (10?9 m to 10?6 m) and micrometers (10?6 m to 10?3 m), and the form thereof is adjusted, thereby remedying drawbacks thereof and enhancing various characteristics without losing superior characteristics owned by the alloy.

Abstract: Compositions for forming Au-based bulk-solidifying amorphous alloys are provided. The Au-based bulk-solidifying amorphous alloys of the current invention are based on ternary Au—Cu—Si alloys, and the extension of this ternary system to higher order alloys by the addition of one or more alloying elements. Additional substitute elements are also provided, which allow for the tailoring of the physical properties of the Au-base bulk-solidifying amorphous alloys of the current invention.

Abstract: The invention concerns a gold alloy. It comprises at least 75% of gold, 0.5% to 2.1% of aluminium able to form precipitates with gold, an additional metal able to favour a stable face centred cubic structure and able to increase the solubility of aluminium in gold, and a precipitate selected to obtain a hardness of more than 250 HV. The selected precipitate of aluminium with gold is the aluminium and gold precipitate Al2Au5. It includes 0.5% to 2.1% of aluminium and a complement of additional metal including a majority of silver. The method of obtaining this alloy regulates the controlled growth of the precipitate during a structuring tempering treatment following dilution and hardening. The invention concerns the use of the aluminium and gold precipitate Al2Au5 for hardening a gold alloy. The invention concerns a timepiece or piece of jewellery including at least one component made of this type of alloy.

Abstract: Rose-color and yellow-color gold alloys are formed from a gold-base alloy containing silver and copper. Mining these elements is usually highly detrimental to the environmental. Environmentally friendly alloys are obtained through the use of recycled elements and elements recovered from mines utilizing specific guidelines. Jewelry manufactured from these environmentally friendly alloys may be more receptive to a consumer, resulting in a competitive advantage.

Abstract: A porous catalyst layer formed from discrete particles of unsupported metal, wherein at least 80%, suitably at least 90%, of the discrete particles have a mass of from 1 to 1000 zeptograms, and wherein the catalyst layer has a metal volume fraction of less than 30% and a metal loading of less than 0.09 mg/cm2 is disclosed. The catalyst layer is suitable for use in fuel cells and other electrochemical applications.

Abstract: A high strength aluminum alloy is suitable for ultra thick gauge wrought product. The alloy can have 6 to 8 wt % zinc, 1 to 2 wt % magnesium, and dispersoid forming elements such as Zr, Mn, Cr, Ti, and/or Sc with the balance made of aluminum and incidental elements and/or impurities. The alloy is suitable for many uses, including in molds for injection-molded plastics.

Abstract: To prepare a superconducting fault-current limiting element having a high sharing electric field at low cost, a superconducting fault-current limiting element includes an insulator substrate; a superconductive thin film formed on the insulator substrate; and an alloy layer formed on the superconducting thin film, said alloy layer having a room-temperature resistivity higher by twice or more than the room-temperature resistivity of a pure metal, in which, when the superconducting thin film goes into a normal conductive state by an overcurrent, the overcurrent flowing through the superconducting thin film is transferred only to the alloy layer.

Abstract: A gold-silver based wire for a semiconductor package has high humidity reliability as well as high dry reliability. The wire includes a first additive ingredient that contains 5˜15 wt % of at least one kind of elements from among first group elements composed of palladium (Pd) and platinum (Pt) added to a gold (Au)-silver (Ag) based alloy that contains 10˜40 wt % of Ag added to Au.

Abstract: A near field transducer includes gold and at least one dopant. The dopant can include at least one of: Cu, Rh, Ru, Ag, Ta, Cr, Al, Zr, V, Pd, Ir, Co, W, Ti, Mg, Fe, or Mo. The dopant concentration may be in a range from 0.5% and 30%. The dopant can be a nanoparticle oxide of V, Zr, Mg, Ca, Al, Ti, Si, Ce, Y, Ta, W, or Th, or a nitride of Ta, Al, Ti, Si, In, Fe, Zr, Cu, W or B.

Abstract: The present disclosure relates to white precious metal alloy compositions comprising at least one of platinum and palladium alloyed with gold, silver, and optionally one or more additional alloying elements. More specifically, and in one embodiment, the present disclosure relates to white precious metal alloy compositions that are suitable for the manufacture of jewelry and other finished articles. In addition, the present invention also relates to a method of manufacturing finished articles from such white precious metal alloy compositions.

Abstract: There is provided a gold alloy wire for a bonding wire having high initial bonding ability, high bonding reliability, high roundness of a compression ball, high straightness, and high resin flowability resistance. The gold alloy wire for a bonding wire comprises one kind or two kinds of Pt and Pd of 1000 to less than 5000 ppm in total, Ir: 1 to 200 ppm, Ca: 20 to 100 ppm, Eu: 10 to 100 ppm, Be: 0.1 to 20 ppm, if necessary, and La: 10 to 100 ppm, if necessary. The total amount of at least two kinds of Ca, Eu, Be, and La is in a range of 50 to 250 ppm.

Abstract: A gold alloy that is usable for jewelry and other applications. The gold alloy is made by combining Y % gold with Z % of a master alloy, wherein Y+Z=100. The master alloy includes 16% silver, 71.771% copper, 12% zinc and 0.229% X, wherein X being selected from the group consisting of silicon, germanium, or mixtures thereof. The gold alloy may be made by first forming the master alloy and then mixing the gold with the master alloy. The gold alloy may also be made by mixing gold with the elements of the master alloy without first forming the master alloy.

Abstract: A gold alloy that is usable for jewelry and other applications. The gold alloy is made by combining Y % gold with Z % of a master alloy, wherein Y+Z=100. The gold alloy may be made by first forming the master alloy and then mixing the gold with the master alloy. The gold alloy may also be made by mixing gold with the elements of the master alloy without first forming the master alloy. In another embodiment, the master alloy used to make a white gold (variable) karat alloy will include from about 23.33% to about 43.33% copper, from about 23.33% to about 43.33% nickel, from about 3.33% to about 23.33% zinc, and from about 10 to about 30% silver. Another embodiment of a master alloy used to make a white gold (variable) karat alloy will include from about 43.33% to about 66% copper, from about 8 to about 39.33% nickel, and from about 4.67% to about 36.67% zinc.

Abstract: There are provided a gold alloy wire for a bonding wire having high initial bonding ability, high bonding reliability, high roundness of a compression ball, high straightness, high resin flowability resistance, and low specific resistance. The gold alloy wire having high initial bonding ability, high bonding reliability, high roundness of a compression ball, high straightness, high resin flowability resistance, and low specific resistance contains one or more of Pt and Pd of 500 to less than 1000 ppm in total, Ir of 1 to 100 ppm, Ca of more than 30 to 100 ppm, Eu of more than 30 to 100 ppm, Be of 0.1 to 20 ppm, if necessary, one or more of La, Ba, Sr, and Bi of 30 to 100 ppm in total, if necessary, and a balance being Au and inevitable impurities.

Abstract: Rose-color and yellow-color gold alloys are formed from a gold-base alloy containing silver and copper. Mining these elements is usually highly detrimental to the environmental. Environmentally friendly alloys are obtained through the use of recycled elements and elements recovered from mines utilizing specific guidelines. Jewelry manufactured from these environmentally friendly alloys may be more receptive to a consumer, resulting in a competitive advantage.

Abstract: A metal nanoparticle composition includes a thermally decomposable or UV decomposable stabilizer. A method of forming conductive features on a substrate, includes providing a solution containing metal nanoparticles with a stabilizer; and liquid depositing the solution onto the substrate, wherein during the deposition or following the deposition of the solution onto the substrate, decomposing and removing the stabilizer, by thermal treatment or by UV treatment, at a temperature below about 180° C. to form conductive features on the substrate.

Abstract: The invention relates to a method for combining the different minerals used for the jewels comprising the process steps of thinning and fixing to each other the bottom and the top layers (1, 3), thinning by means of extruding from the cylinder the structure (A) that forms as a result of fixing the bottom and the top layers (1, 3), preparing the mixture comprising the welding material in the form of a plate and thus forming the intermediate layer (2), placing the intermediate layer (2) comprising the welding material between the two layers (1, 3) and injecting an oxygen-repelling gas, in order to obtain a fixed structure (A) by means of kiln-drying process carried out for a certain time at a particular temperature, obtaining the thin structure (B) by thinning the obtained fixed structure (A) by means of extruding it from the cylinder.

Abstract: Improved 14-karat rose-colored gold alloy compositions include: about 58.5% gold; about 9.0-12.0% silver; about 0.0-0.2% zinc; about 0.3-0.4% cobalt; about 0.0-0.02% iridium; and about 29.0-33.0% copper. Improved 18-karat rose-colored gold alloy compositions include: about 75.2% gold; about 7.0% silver; about 0.0-0.2% zinc; about 0.3-0.4% cobalt; about 0.0-0.02% iridium; and about 17.0-17.5% copper. The hardness of these compositions are capable of being selectively changed between their respective annealed-hardness and age-hardness values. The color of these compositions is between about 5-7 CieLab a* color units and between about 17-21 CieLab b* color units.

Abstract: Platinum, silver and gold solder compositions for repairing, assembling, or sizing jewelry. Platinum compositions having about 90% to about 95% by weight platinum. Silver compositions having at least 92.5% by weight silver. Gold solder compositions having about 25% to about 91.6% gold. The platinum and silver solder compositions further consisting of about 8.3% to about 75% by weight of an alloy consisting essentially of gallium, indium and copper in respective ratios of 6:3:1. The gold solder compositions further consisting of about 2% to about 14% by weight of an alloy consisting essentially of gallium, indium, and copper in respective ratios of 6:3:1. The melting temperature ranges of the respective solder compositions are from about 1300° C. to about 1500° C. for platinum, from about 1000° F. to about 1400° F. for silver, and from about 1100° F. to about 1550° F.

Abstract: A brazing filler metal is composed of gold, silver, copper, and an additive element including at least one kind of element out of aluminum, bismuth, gallium, germanium, indium, antimony, silicon, tin, lead, tellurium, and thallium, as main constituents thereof, wherein a total composition ratio of the additive element is in a range of more than 1 wt. % to less than 36 wt. %, and a composition ratio of the gold is less than 80 wt. %, and a composition ratio of the silver is less than 42 wt. %, so that the brazing filler metal joins metals for use as members of which decorativeness in external appearance is required, such as stainless steel and so on, at a low temperature which does not cause the crystal structure thereof to be coarsened, while securing excellent corrosion resistance and sufficient joining strength.

Abstract: A nickel- and palladium-free 14-karat white gold alloy composition consists of the following parts by weight: about 58.34% gold, about 35–40% silver, about 0.5–1.80% tin, and about 0–0.75% germanium.

Abstract: A hard precious metal alloy member is constituted of a gold alloy, which has a gold Au content of from 37.50 to 98.45 wt %, and contains a hardening additive in a range of not less than 50 ppm but less than 15,000 ppm, wherein the hardening additive is constituted of gadolinium Gd only, or gadolinium Gd and at least one element selected from the group consisting of rare-earth elements other than Gd, alkaline-earth elements, silicon Si, aluminum Al, and boron B.

Abstract: The present invention discloses a white gold composition consisting essentially of copper, silver, zinc, and manganese, and further consisting of small amounts of tin, cobalt, silicon/copper and boron/copper. More particularly, the white gold composition of the present invention discloses a white gold composition consisting essentially of about 36% to about 57% copper, about 10% silver, about 18.2% to about 24.2% zinc, about 14% to about 28.9% manganese, and the balance further consisting of about 1% tin, about 0.025% to about 0.03% cobalt, about 0.52% silicon/copper, and about 0.2% boron/copper. An objective of the present invention is to provide for methods and compositions of casting, fabricating and soldering white gold that does not incorporate nickel or palladium. The present invention also discloses no tarnish results when hydrogen is used as a catalyst to all compositions.

Abstract: A 14-karat gold alloy composition having a desirable yellow color and with reversible hardness contains about 58.65 weight percent gold, about 11.5-25.0 weight percent silver, about 11.85-23.35 weight percent copper, and about 2-7 weight percent zinc. The color of the composition has a value of between about −3.0 to about 0.5 CieLab a* color units, and has a value of between about +20.0 to about 22.0 CieLab b* color units. The alloy has a hardness ratio between about 0.4-2.0, and color ratio of less than about 1.0.

Abstract: The invention relates to a novel grey gold alloy essentially without whitening element such as nickel, palladium and cobalt, characterized in that it contains in addition to the gold, copper, silver and manganese, according to the following proportions in percentages by weight, of: gold 75-78  silver 1-10 manganese  7-15; and remainder of copper to 100. This alloy is particularly advantageous for manufacturing jewels, notably by the disposable wax casting technique.

Abstract: The invention relates to a novel grey gold alloy essentially without whitening element such as nickel, palladium and cobalt, characterized in that it contains in addition to the gold, copper, silver and manganese, according to the following proportions in percentages by weight, of: 1 gold 75-78  silver 1-10 manganese  7-15; and remainder of copper to 100.

Abstract: Novel 22 k gold alloys including silver, boron, cobalt and copper. The alloys meet modem jewelry fabrication techniques requirements and exhibit pleasing yellow color. They are stable under normal use and do not appreciably tarnish. They also have substantially no discoloring effect on the skin. These formulations possess work hardening properties consistent with gold alloys of lower karat while maintaining color properties consistent with traditional 22 k gold jewelry.

Abstract: The present invention is directed to brazing filler metals that can be used in the infiltration brazing of porous matrix materials without the need for a flux. The brazing filler metals contain two different Group II metals and a third metal of Group 9 and 10. A particular brazing filler metal of the invention contains silver, copper, and nickel. The invention is also directed to composite materials formed by infiltration of the brazing material into a porous matrix, and to methods for preparing the composite materials. The invention is further directed to composite articles fabricated from composite materials, including steel bearings or bushings, and to methods of preparing the composite articles.

Abstract: An improved 18-karat green gold alloy composition comprises about 75.0% gold; about 6.0-7.0% silver; about 9.0-11.7% copper; and about 6.5-9.0% zinc. The improved alloys are capable of being age-hardened to a hardness of about 240 VHN by being heated to about 550° F. for about one hour, and thereafter being permitted to cool in air. The hard-nesses of the alloys are reversible between their aged-hardness and annealed-hardness values. The color of said composition is between about −1.5 to about −3.0 CieLab a* color units, and between about 19 to about 26 CieLab b* color units.

Abstract: A process of producing a gold decorative item, including, sequentially producing an alloy of gold, silver, copper and zinc, forming the gold alloy into a specific shape according to the design of the decorative item and polishing the surface of the decorative item so formed, submerging the decorative item in an acid solution and etching its surface to form a scale pattern, submerging the decorative item in an alkaline solution removing unwanted substances formed on the surface during etching.

Abstract: The present invention is directed to brazing filler metals that can be used in the infiltration brazing of porous matrix materials without the need for a flux. The brazing filler metals contain two different Group II metals and a third metal of Group 9 and 10. A particular brazing filler metal of the invention contains silver, copper, and nickel. The invention is also directed to composite materials formed by infiltration of the brazing material into a porous matrix, and to methods for preparing the composite materials. The invention is further directed to composite articles fabricated from composite materials, including steel bearings or bushings, and to methods of preparing the composite articles.

Abstract: A solder composition that bonds well to oxides and other surfaces to which solder bonding is conventionally difficult is provided. The solder is particularly useful for reliable bonding and packaging of optical components that often have oxide surfaces. The solder composition exhibits a microstructure containing a solder matrix in which is distributed fine, micron-scale islands of rare-earth-containing intermetallic particles. The existence of the islands makes the rare earth elements better available for bonding, and reduce the extent to which the rare earths are oxidized. Advantageously, the solder contains Au and/or Ag, in which the rare earth elements tend to have some solid solubility. Due to this solubility, the Au and/or Ag tend to provide some additional protection of the rare earths against oxidation, and thereby also provide accelerated dissolution of the rare earth into the molten solder.

Abstract: A thin wire of gold alloy for wire bonding, consisting of: a first group consisting of 2 to 10 ppm by weight of scandium, 3 to 20 ppm by weight of beryllium, and 2 to 50 ppm by weight of indium; and the balance consisting of gold and unavoidable impurities. The thin wire has a loop height of 200 .mu.m or more and a wire flow after resin molding of not more than 5%.

Abstract: Sliding contacts comprising alloys such as Pd/Cu/Ag, Pt/Cu/Ag, Pd/Cu/Ag/Ni, Pt/Cu/Ag/Ni, Ag/Pd/Cu,Au, Ag/Pt/Cu/Au and two-layered composites comprising a surface layer of one of the foregoing alloys and a base layer comprised of copper or a copper-containing alloy. Also, three-layered composites comprising a surface layer of one of the foregoing alloys, an intermediate layer of one of the foregoing alloys and a base layer comprised of copper or a copper-containing alloy as well as direct current motors comprising commutators comprising a three-layered composite.

Abstract: A high gold content dental alloy comprises, on a weight basis, 91 to 99.4% of gold, 0.5 to 3% of at least one metal selected from titanium and tantalum, up to 5% of silver, 0.05 to 1% of iridium and/or tungsten, and up to 1% at least one element selected from the group comprising rhodium, ruthenium, platinum, osmium, iron, molybdenum, niobium and rhenium.

Abstract: An electrical conductor for a spacecraft solar generator with at least one solar module, wherein the electrical conductor is made of an alloy containing gold and traces of at least one of silver, palladium or copper and which can be used as a solar cell connector. The electrical conductor advantageously cannot be oxidized by atomic oxygen, has a high hardness and elasticity and can thus withstand high thermal stresses. Furthermore, the electrical conductor can be processed by resistance welding without damaging the cell.

Abstract: A 14K gold alloy includes by weight percentages about 58.5 to 58.8% gold, 12.8 to 14.4% silver, 22.9 to 24.8% copper, 3.5 to 4.1% zinc and 0.2 to 0.5% cobalt. The alloy exhibits a relatively large uniform, fine grain size and may be repetitively hardened and softened as desired. The brightness of the alloy is exceptional and the color, which is quite distinctive among 14K gold alloys, is similar to rich colored 18K gold alloys.

Abstract: According to the present invention provided is a gold wire for IC chip bonding which wire is unlikely to be broken after thermosonic wire bonding at an increased ultrasonic output, subsequent reverse deformation involving severe bonding and deformation of a ball neck portion and formation of a loop. The bonding gold wire essentially consists of 0.0001-0.005 wt % of Pt, 0.0001-0.005 wt % of Ag, 0.0005-0.005 wt % of Mg and 0.00005-0.005 wt % of Eu; with the balance being Au, said Au having less than 0.001% by weight of incidental impurity.

Abstract: Amorphous metal alloys rich in noble metals prepared by rapid solidification processing are disclosed. The alloys have at least a ternary composition having the formula M.sub.a G1.sub.b G2.sub.c, wherein M is at least one element selected from the group consisting of Ag, Au, Ru, Os, Rh, Ir, Pd, and Pt, and G1 is at least one element selected from the group consisting of B, C, Cu, Ni, Si, and Be, and G2 is at least one element selected from the group consisting of Y, the lanthanides, Zr, Hf, Ca, Mg, Ti, Nb, and Ta. The subscripts a, b, and c are atomic percentages; a ranges from 70 to 90 percent, and b and c range from 5 to 15 percent each. Preferably, a is at least 80 percent and b and c are generally equal. The amorphous metal alloys are readily glass forming and thermally stable at room temperatures.

Abstract: A dental alloy is provided which is compatible with a wide variety of composites and porcelain compositions. The alloy has a melting range of between about 870.degree. C. and 1230.degree. C. and a coefficient of thermal expansion of between 15.5.times.10.sup.-6 and 17.5.times.10.sup.-6 in/in/.degree. C. when heated from room temperature to 500.degree. C. The alloy contains between one and 85 percent by weight gold, between two and 65 percent by weight of a thermal expansion adjuster, between 0.25 and 34 percent by weight of a strengthener and oxide former, up to about one percent by weight grain refiner, and up to about 0.25 percent by weight deoxidizer.

Abstract: A 10-carat gold alloy for ornaments comprises 41.7% gold 12.0 to 13.0% silver, 40 to 41.5% copper, and 4.5 to 5.5% zinc.

Abstract: A dental alloy is provided which is free of palladium, gallium and copper and which is compatible with a wide variety of composites and porcelain compositions. The alloy has a melting range of between about 870.degree. C. and 1230.degree. C. and a coefficient of thermal expansion of between 15.5.times.10.sup.-6 and 17.5.times.10.sup.-6 in/in/.degree. C. when heated from room temperature to 500.degree. C. The alloy contains between about 40 and 80 percent by weight gold, between 5 and 50 percent by weight of thermal expansion adjuster, between two and 15 percent by weight strengthener and oxide former, up to about 1.5 percent by weight grain refiner, and up to about 0.25 percent by weight deoxidizer.

Abstract: A resin-coated, bonding fine wire for use in forming bonded electrical connections on a semiconductor device, wherein the wire is characterized as having a tensile strength exceeded when the wire is further elongated in length in a range of 0.5% to 3.5% of its original length by breaking of the wire during tension testing. It has been determined that an insulated bonding fine wire exhibiting such relatively low ductility produces a loop profile maintainable in a stable condition during a bonding operation while providing reliable bonding strength.

Abstract: The disclosure relates to yellow karat gold metal alloys particularly suited for the casting of jewelry articles such as rings, bracelets, earrings, and the like. The alloys include varying amounts of germanium up to about one percent by weight of the total volume of the alloy which serves as an oxygen scavenger, and which may be recycled along with scrap alloy material after casting. By varying the amounts of the grain refiners, it is possible to totally eliminate the use of deoxidizing agents such as silicon and boron and the accompanying disadvantageous effects of these elements, to result in a superior cast structure.

Abstract: A white gold alloy composition consisting essentially of about 35 to 50 weight percent of gold, about 35 to 63 weight percent of silver, about 0.1 to 7 weight percent of a whitening component of zinc, germanium or both, and palladium in an amount of about 9 weight percent or less. The whitening component and the palladium are present in an amount sufficient to impart a white gold appearance and a liquidus temperature of no greater than about 1950.degree. F. to the alloy, preferably between about 1700.degree. and 1900.degree. F., and more preferably less than about 1850.degree. F. Thus, the preferred amount of palladium is about 2 to 5 weight percent and the preferred amount of the whitening component is about 0.5 to 6 weight percent.