Having Marginal Feature For Indexing Or Weakened Portion For Severing Patents (Class 428/571)
  • Patent number: 11139593
    Abstract: A connecting structure includes at least one conductive terminal having a body, a conducting portion connected below the body, a pre-breaking portion provided at an upper end of the body, and a temporary soldering portion connected above the pre-breaking portion; a first strip connected to the conducting portion; and a second strip soldered to the temporary soldering portion. A method for manufacturing an electrical connector includes: forming a first strip and at least one conductive terminal connected thereto; soldering a second strip to the temporary soldering portion of the conductive terminal; separating the conducting portion of the conductive terminal and the first strip; operating the second strip to control the conductive terminal to be mounted to a housing; and disconnecting the pre-breaking portion of the conductive terminal, and removing the second strip and the temporary soldering portion of the conductive terminal.
    Type: Grant
    Filed: January 13, 2020
    Date of Patent: October 5, 2021
    Assignee: LOTES CO., LTD
    Inventor: Chien Chih Ho
  • Patent number: 11075091
    Abstract: In a first step of a method of manufacturing a semiconductor device, a portion to be the first lead frame is formed by selectively punching a metal plate, furthermore, notch portions depressed in the reference direction are formed on both side surfaces of a portion, of the first lead frame where the first bent portion is formed, in line contact with the first conductive layer in the reference direction; in the second step of the method, a first bent portion is formed by bending the one end of the first lead frame so as to protrude downward along the reference direction; and in the third step of the method, the upper surface of the first conductive layer and the lower surface of the first bent portion of the first lead frame are joined at the end of the substrate, by the first conductive bonding material, furthermore, the upper surface of the first conductive layer and the notch portions of the first bent portion are joined, by embedding a part of the first conductive bonding material in the notch portions.
    Type: Grant
    Filed: October 26, 2017
    Date of Patent: July 27, 2021
    Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
    Inventors: Soichiro Umeda, Takenori Ishioka
  • Patent number: 9463530
    Abstract: A method for producing analytical aids for obtaining bodily fluid, in particular lancets or microsamplers, in which the aids are formed as a shaped part (10) from a flat metallic material by material separation on shaped part edges (28), wherein at least one sharp shaped part edge (28) is finished by laser irradiation, a laser beam (36) is guided repeatedly over the shaped part (10) along an irradiation path (38) in irradiation intervals, and the shaped part edge (28) is rounded by the cumulative energy input of the laser beam (36).
    Type: Grant
    Filed: May 9, 2014
    Date of Patent: October 11, 2016
    Assignee: Roche Diabetes Care, Inc.
    Inventors: Guenther Ihle, Hans List
  • Patent number: 9361917
    Abstract: In certain embodiments, a method of fabricating a base plate for piezoelectric actuation, comprises providing a plate having a major surface; striking a first removable portion of the plate in a first direction substantially normal to the major surface to shear the first removable portion relative to the plate by a shear distance that is less than the plate thickness; striking the first removable portion in a second direction substantially opposite the first direction to reduce the shear distance by a reduction in shear that is less than the plate thickness; and leaving the first removable portion in place rather than removing the first removable portion. In other embodiments, the removable portion may be created by lancing one or more portions spanning at least one opening through a base plate adjacent a first side of at least one opening and adjacent a second side of the at least one opening.
    Type: Grant
    Filed: July 19, 2011
    Date of Patent: June 7, 2016
    Assignee: INTRI-PLEX TECHNOLOGIES, INC.
    Inventors: David Django Dexter, Damon Douglas Brink, Ryan John Schmidt
  • Publication number: 20140182474
    Abstract: A fragmentation body comprising a substantially monolithic structure comprising a metal material and comprising a major surface having an indentation pattern therein, and an opposing major surface having an opposing indentation pattern therein, the opposing indentation pattern being substantially aligned with the indentation pattern. A warhead and an article of ordnance are also described.
    Type: Application
    Filed: July 17, 2012
    Publication date: July 3, 2014
    Applicant: ALLIANT TECHSYSTEMS INC.
    Inventors: James D. Dunaway, John E. Bott
  • Patent number: 8479394
    Abstract: A method of assembling parts to form an aircraft component, in which a first surface of a first part (for example a wing skin) is to be positioned in the assembly adjacent to a second surface of a second part (for example a rib foot). The method comprises the steps of taking measurements of the first part, taking measurements of the second part with a laser, and calculating the size and shape of the space that will be generated when the first and second parts are assembled. A shim of varying thickness in dependence upon the results of the calculating step is manufactured, for example by stereolithography, and the first and second parts are assembled with the shim positioned between the first and second parts, the varying thickness of the shim compensating for a varying spacing of the first and second surfaces.
    Type: Grant
    Filed: September 21, 2006
    Date of Patent: July 9, 2013
    Assignee: Airbus Operations Limited
    Inventor: Christopher John Glazebrook
  • Patent number: 8206836
    Abstract: A conductive clip having a riser or post formed along a side thereof includes a notch or opening formed in the riser or post to create a first riser or post section and second riser or post section separated by the notch or opening through which a tiebar extends. The conductive clip organization is will suited for formation as elongated strips of such conductive clips for automated machine assembly of the conductive clips in an integrated circuit package context.
    Type: Grant
    Filed: February 3, 2010
    Date of Patent: June 26, 2012
    Assignee: Intersil Americas, Inc.
    Inventors: Loyde M. Carpenter, Jr., Randolph Cruz, Nikhil Kelkar
  • Publication number: 20120132247
    Abstract: The connector for PV cells is a strip of electrically conductive material which has a flat cross-section with two broad sides and with two narrow sides which each connect opposite edges of the broad sides. At least one broad side has a corrugated structure running in longitudinal direction of the strip and is pre-tinned in an area the length of which is somewhat less than the length of the edge of a PV cell.
    Type: Application
    Filed: June 29, 2011
    Publication date: May 31, 2012
    Applicant: Schlenk Metallfolien GmbH & Co. KG
    Inventors: Thomas Booz, Fabian Distelrath
  • Publication number: 20110212341
    Abstract: A lead frame sheet made of an electrically conductive material has lead frames integrally formed on it. Spacing members also are formed from the sheet. A first one of the spacing members is proximal to a first longitudinal edge of the sheet and a second one of the spacing members is proximal to a second longitudinal edge of the sheet. The spacing members extend from an underside surface of the sheet and, in use, space the underside surface from a planar support such as a surface of a heating block.
    Type: Application
    Filed: January 19, 2011
    Publication date: September 1, 2011
    Applicant: FREESCALE SEMICONDUCTOR, INC.
    Inventors: Ting Li, Qingchun He, Yongqiang Liu
  • Publication number: 20110151271
    Abstract: A metal forming process and welded coil assembly that may be used to form complex metal components in a manner that is efficient, reduces scrap material, and maintains the structural integrity of the components. Generally, a number of individual metal blanks are welded to one or more sheet metal coils in order to produce a welded coil assembly. The metal blanks may be welded along the length of the inner sides of two sheet metal coils, or the metal blanks may be welded along the length of the outer sides of a single sheet metal coil, to cite a couple of possibilities. The welded coil assembly can then be fed through a progressive stamping apparatus or other machine to create a complex metal part.
    Type: Application
    Filed: July 10, 2009
    Publication date: June 23, 2011
    Applicant: SHILOH INDUSTRIES, INC.
    Inventor: James F. Keys
  • Patent number: 7914901
    Abstract: Structures and methods for hindering molded part deformation during densification are discussed. Such devices and techniques can help alleviate stresses that tend to result in part deformation during firing, sintering, or other densification processes, and thus reduce the need for secondary straightening operations post-densification. In some instances, a support structure is utilized to orient a molded greenbody in a preferred direction to reduce deformation during firing (e.g., orienting a thin tail section is a plane parallel to the direction of gravity). The support structure can also be part of, or the entirety of, a thermal mass to help alleviate stresses that lead to part deformation. Though such structures and methods can be used for any molded piece, it can be particularly used to create a portion, or an entirety of, a medical device such as a jaw of an surgical instrument.
    Type: Grant
    Filed: December 19, 2006
    Date of Patent: March 29, 2011
    Assignee: Ethicon Endo-Surgery, Inc.
    Inventors: Nabeel Mark Jadeed, Charles Frank Benjey, Donald F. Heaney
  • Publication number: 20110033724
    Abstract: A conductive clip having a riser or post formed along a side thereof includes a notch or opening formed in the riser or post to create a first riser or post section and second riser or post section separated by the notch or opening through which a tiebar extends. The conductive clip organization is will suited for formation as elongated strips of such conductive clips for automated machine assembly of the conductive clips in an integrated circuit package context.
    Type: Application
    Filed: February 3, 2010
    Publication date: February 10, 2011
    Inventors: Loyde M. Carpenter, JR., Randolph Cruz, Nikhil Kelkar
  • Publication number: 20100129678
    Abstract: The method serves for the production of a wire strip (1) comprising a plurality of wires (2) arranged parallel to each other. For this purpose a metal strip is first pre-notched either on one side or both sides for the formation of the wires (2), whereby wires (2) are generated which are still connected to webs (3). To transform the webs (3) subsequently into thin, easy to separate and, when separated, smooth and burr-free separation webs forming separation areas, the wire strip (1) is subjected to a milling process during which each web (3) is subjected to a multiple bending strain along the longitudinal axis thereof in such a way that incipient cracks form, due to fatigue fracture, in the area of the webs (3), and thereby the separation web is created.
    Type: Application
    Filed: February 8, 2008
    Publication date: May 27, 2010
    Inventor: Karl-Hermann Stahl
  • Publication number: 20100055488
    Abstract: A structural inner, such as a vehicular door inner, formed from an engineered non-linearly welded blank comprising blank sections of differing thickness, a method of reducing the mass of the blank and redistributing the stresses experienced thereby during a drawing process, and a modified three-piece draw die having a control split device adapted for stamping the blank and localizing, minimizing and redirecting a blank failure to a predetermined location, such as the speaker hole of the door, during the process.
    Type: Application
    Filed: August 25, 2009
    Publication date: March 4, 2010
    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
    Inventors: Jeffrey J. Gress, Venkat Aitharaju
  • Patent number: 7316849
    Abstract: A band-shaped semi-finished product is made out of a ductile material and is configured to be separated into at least two sections. At least one pair of wedge-shaped, non-cuttingly formed longitudinal notches are formed, between the tips of which there remains a thin web of material, which can be torn easily with little force. The semi-finished product is distinguished by burr-free separated edges, defined geometry of the separating surfaces, and extremely reduced breaking-surface portions. It shows improved resistance during static and dynamic stress, in particular for alternating bending loads, in comparison to conventional, for example via the rolling-cutting technique, separated semi-finished products.
    Type: Grant
    Filed: December 20, 2002
    Date of Patent: January 8, 2008
    Assignee: Wieland-Werke AG
    Inventors: Andreas Boegel, Isabell Buresch, Robert Kloeckler, Heinz-Ulrich Koboecken, Eberhard Lepin, Karl-Hermann Stahl, Hans-Juergen Stoeckl
  • Patent number: 7081293
    Abstract: A metallic nanowire having an aspect ratio of at least 100 and a diameter less than 200 nanometers composed of at least one of bismuth, indium, tin, lead, zinc, antimony and alloys of the same and a method of making the same from a thin film composite.
    Type: Grant
    Filed: December 30, 2004
    Date of Patent: July 25, 2006
    Assignee: General Motors Corporation
    Inventors: Anita M. Weiner, Curtis A. Wong, Yang-Tse Cheng, Michael P. Balogh, Micheal J. Lukitsch
  • Patent number: 6837087
    Abstract: A blank positioning and guide construction which includes guide pin slotting that effects the accurate positioning of the sheet on the forming die and guide pin thereof and which provides for the enlargement of the guide pin slot by the predetermined deformation of portion of the sheet at a predetermined bend line adjacent to the guide pin slot to eliminate adherence of the part to the pin so that the part can be ejected from the die without detrimental part distortion of the part.
    Type: Grant
    Filed: September 13, 2002
    Date of Patent: January 4, 2005
    Assignee: General Motors Corporation
    Inventors: Richard Murray Kleber, Donald L. Kenyon, Verril J. Gamet
  • Patent number: 6696169
    Abstract: The invention relates to expanded metal mesh consisting of mesh webs and nodes and to a tool for producing said expanded metal mesh. At least some of the mesh nodes are configured as predetermined breaking points (8, 9a, 9b). The expanded metal mesh is produced by a shear blade which has tooth bases of differing depths between the individual teeth on the blade profile.
    Type: Grant
    Filed: October 9, 2001
    Date of Patent: February 24, 2004
    Inventors: Wilhelm Röttger, Albrecht Klöckner, Hermann Klöckner
  • Publication number: 20040013898
    Abstract: Redundantly constrained laminar structures as weak-link mechanisms and a novel method for manufacturing the redundantly constrained laminar structures as weak-link mechanisms are provided. The method for producing the redundantly constrained laminar structures as weak-link mechanisms is carried out by lithographic techniques. A designed pattern is repeatedly chemically etched with a mask to produce a plurality of individual identical units. The units are stacked together to form the laminar structure and are secured together with fasteners. A high quality adhesive can be applied to the sides of the laminar structure to provide the mechanism equivalent to a single piece mechanism. The redundantly constrained laminar structures as weak-link mechanisms of the invention include a stack of a plurality of thin material structures.
    Type: Application
    Filed: July 14, 2003
    Publication date: January 22, 2004
    Applicant: THE UNIVERSITY OF CHICAGO
    Inventors: Deming Shu, Thomas S. Toellner, E. Ercan Alp
  • Patent number: 6607840
    Abstract: Redundantly constrained laminar structures as weak-link mechanisms and a novel method for manufacturing the redundantly constrained laminar structures as weak-link mechanisms are provided. The method for producing the redundantly constrained laminar structures as weak-link mechanisms is carried out by lithographic techniques. A designed pattern is repeatedly chemically etched with a mask to produce a plurality of individual identical units. The units are stacked together to form the laminar structure and are secured together with fasteners. A high quality adhesive can be applied to the sides of the laminar structure to provide the mechanism equivalent to a single piece mechanism. The redundantly constrained laminar structures as weak-link mechanisms of the invention include a stack of a plurality of thin material structures.
    Type: Grant
    Filed: August 15, 2001
    Date of Patent: August 19, 2003
    Assignee: The University of Chicago
    Inventors: Deming Shu, Thomas S. Toellner, E. Ercan Alp
  • Publication number: 20020060200
    Abstract: Redundantly constrained laminar structures as weak-link mechanisms and a novel method for manufacturing the redundantly constrained laminar structures as weak-link mechanisms are provided. The method for producing the redundantly constrained laminar structures as weak-link mechanisms is carried out by lithographic techniques. A designed pattern is repeatedly chemically etched with a mask to produce a plurality of individual identical units. The units are stacked together to form the laminar structure and are secured together with fasteners. A high quality adhesive can be applied to the sides of the laminar structure to provide the mechanism equivalent to a single piece mechanism. The redundantly constrained laminar structures as weak-link mechanisms of the invention include a stack of a plurality of thin material structures.
    Type: Application
    Filed: August 15, 2001
    Publication date: May 23, 2002
    Applicant: THE UNIVERSITY OF CHICAGO
    Inventors: Deming Shu, Thomas S. Toellner, E. Ercan Alp
  • Patent number: 6177203
    Abstract: Diffusion bonding techniques are extended to the simultaneous bonding of an array of multilevel piece parts. The problems of uneven expansion and contraction of different levels of different piece parts in the array are obviated by positioning each level of the array within a frame. The stack of frames is pinned in one corner. The opposite corner of the array has a slot at a 45° angle with respect to the x and y axes of the array. The slot engages a pin and allows the entire array to expand and contract along the slot in a manner to maintain the registration of features between respective levels of each piece part.
    Type: Grant
    Filed: November 12, 1998
    Date of Patent: January 23, 2001
    Assignee: Opto Power Corporation
    Inventor: Juan Alfonso Garcia
  • Patent number: 6112405
    Abstract: A component assembly, or fan, comprises a hub having secured thereto a plurality of radially extending components. The hub, which is generally of semi-circular configuration, includes planar raised portions constructed and arranged to be vacuum gripped by a rotary indexing support, or turret, and holes which accommodate guide rods of a hopper for storing a supply of the fans. The components are connected to the hub at angularly spaced intervals by severable linkage portions.
    Type: Grant
    Filed: January 8, 1997
    Date of Patent: September 5, 2000
    Assignee: Unilever Patent Holdings BV
    Inventor: John C Inkster
  • Patent number: 6114049
    Abstract: A stent and a method for fabricating the stent are disclosed. The stent has an originally flat pattern and connection points where the sides of the flat pattern are joined. The method includes the steps of a) cutting a stent pattern into a flat piece of metal thereby to produce a metal pattern, b) deforming the metal pattern so as to cause two opposing sides to meet, and c) joining the two opposing sides at least at one point. Substantially no portion of the stent projects into the lumen of the stent when the stent is expanded against the internal wall of a blood vessel.
    Type: Grant
    Filed: July 2, 1998
    Date of Patent: September 5, 2000
    Assignee: Medinol Ltd.
    Inventor: Jacob Richter
  • Patent number: 6051613
    Abstract: A pharmaceutical composition containing an extract from inflammatory tissue inoculated with vaccinia virus may be used to suppress the death of cells caused by endotoxin, and suppress excessive production of nitrogen monoxide induced by endotoxin. The extract may also be used to relieve hypotension induced by endotoxin. In sepsis and other serious bacterial infectious diseases, endotoxin (an intracellular toxin) is produced and a shock symptom is induced by its action. The extract, having an excellent inhibitory action toward endotoxin-induced toxicity, is quite useful for the treatment or the prevention of endotoxin-induced shock symptoms, sepsis and various symptoms accompanied thereby. In addition, the extract has an inhibitory action towards abnormal nitrogen monoxide production during the diseased state and, therefore, it is also useful as a therapeutic and preventive agent for diseases wherein an excessive nitrogen monoxide production occurs, such as acute hypotension.
    Type: Grant
    Filed: January 5, 1998
    Date of Patent: April 18, 2000
    Assignee: Nippon Zoki Pharmaceutical Co., Ltd.
    Inventors: Kousaku Ohno, Jin-emon Konishi, Seishi Suehiro
  • Patent number: 5840416
    Abstract: A lining material for forming a tight barrier coating on a base material. The lining includes a thermoplastic polymer that does not cross-link in an aqueous dispersion. The thermoplastic polymer is 65%-85% of lining by dry matter weight. The lining also includes an additive including at least one particulate material having barrier-forming properties and in an aqueous dispersion. The additive is 15%-35% of the lining by dry matter weight. At least 95% of the particles of at least one particulate material fulfill the condition that the ratio between the largest and the smallest dimension of a particle of the particulate material is greater than 5:1.
    Type: Grant
    Filed: July 14, 1994
    Date of Patent: November 24, 1998
    Assignee: Clariant Finance (BVI), Ltd.
    Inventor: Harri Repo
  • Patent number: 5800905
    Abstract: A pad including thermal insulation and heat sink areas. The pad includes a plurality of layers of metal foil forming a stack with the layers arranged one above the other, the stack including at least one heat sink area and at least one insulating area adjacent to the heat sink area, the layers providing better heat conduction in the vertical direction at the heat sink area than at the insulating area. At least one of the layers includes a plurality of embossments therein separating the one layer from an adjacent one of the layers in the insulating area. The pad can include a single insulating area surrounded by a heat sink area and a black coating can be provided on selected portions of the layers to improve heat radiating characteristics of the pad. For instance, the heat sink area can be coated with the black coating to radiate heat away from the pad at a desired location.
    Type: Grant
    Filed: September 19, 1995
    Date of Patent: September 1, 1998
    Assignee: ATD Corporation
    Inventors: William M. Sheridan, Raymond E. Ragland
  • Patent number: 5786493
    Abstract: Cyclic silane esters and solvolysis products thereof and processes for making these materials. The cyclic silanes and their solvolysis products are useful as adhesives, crosslinking agents and reagents for modifying polymers containing ester groups.
    Type: Grant
    Filed: July 16, 1997
    Date of Patent: July 28, 1998
    Assignee: Huels Aktiengesellschaft
    Inventors: Hartwig Rauleder, Hans-Joachim Koetzsch, Jaroslaw Monkiewicz, Claus-Dietrich Seiler, Hans-Guenther Srebny
  • Patent number: 5770320
    Abstract: A sheet metal member with a securing arrangement to securely attach the member to another sheet member. The securing arrangement is an elongate structure with two ends integral with an edge of a body of the sheet metal member. The elongate structure extends between its ends around a spatial area and has a specific width. The elongate structure is flexible to a greater width in which a locking part securely grips the other sheet member between the body and the locking part of the structure.
    Type: Grant
    Filed: September 26, 1996
    Date of Patent: June 23, 1998
    Assignee: Northern Telecom Limited
    Inventors: Richard P. Hughes, Patrick T. Lawless
  • Patent number: 5725930
    Abstract: A supply feedstock intended for use in a workpiece finishing machine wherein individual workpieces are successively separated and presented in a predetermined fashion to an automated loading means. The feedstock includes a plurality of individual workpieces arranged in side-by-side order in the form of a continuous belt, or bandolier, of workpieces, each of the workpieces being interconnected at head and tail portions of the workpieces by integral webs, successive workpieces being trimmed from the bandolier and presented to a loading means, while the separated webs are discharged to waste.
    Type: Grant
    Filed: March 14, 1996
    Date of Patent: March 10, 1998
    Assignee: Bi-Link Metal Specialties
    Inventor: Frank Ziberna
  • Patent number: 5503895
    Abstract: A supply feedstock intended for use in a workpiece finishing machine wherein individual workpieces are successively separated and presented in a predetermined fashion to an automated loading means. The feedstock includes a plurality of individual workpieces arranged in side-by-side order in the form of a continuous belt, or bandolier, of workpieces, each of the workpieces being interconnected at head and tail portions of the workpieces by integral webs, successive workpieces being trimmed from the bandolier and presented to a loading means, while the separated webs are discharged to waste.
    Type: Grant
    Filed: September 20, 1993
    Date of Patent: April 2, 1996
    Assignee: Bi-Link Metal Specialties
    Inventor: Frank Ziberna
  • Patent number: 5391439
    Abstract: In a leadframe for supporting semiconductor devices and including a plurality of outer lead sections, a recess or recesses are provided on each of the outer lead sections at a central portion or both sides of each outer lead section in a region including a cutting line. The recess or recesses reduce the cross-sectional area of the lead section, thus enabling a new cut surface of the lead section to be well covered by solder and enabling ready cutting of the lead section.
    Type: Grant
    Filed: February 4, 1994
    Date of Patent: February 21, 1995
    Assignees: Dai Nippon Printing Co., Ltd., Yamaha Corp.
    Inventors: Koji Tomita, Kazunori Kato, Jun Kato
  • Patent number: 5387472
    Abstract: A assembly of mated molded parts and a method for making same are disclosed in which the assembly has first and second parts with precisely mating surfaces. The first part is formed by molding, casting, or the like such that the mating surface of the first part is formed with at least one protrusion. The second part is formed in place against the first part such precisely mating surfaces are formed with the second part enveloping the protrusion. The two parts thus formed are forced apart from each other. The protrusion may be formed with a head which interlocks with the second part. When the parts are separated, the head breaks from the protrusion. In a particular embodiment, a bearing cap is disclosed having a central opening for the passage of a shaft.
    Type: Grant
    Filed: December 21, 1992
    Date of Patent: February 7, 1995
    Assignee: Nelson Metal Products Corporation
    Inventor: Dennis S. Shimmell
  • Patent number: 5106699
    Abstract: A simple cylindrical steel element, having a tapered portion at an insertion end and a plug of a difficult-to-machine material securely attached therein, is forcibly inserted into a previously formed hole, e.g., in a hard inner layer of a multilayer wall of a safe for containing valuables. To facilitate intromission of the tapered end of the device into the hole, all layers except the hard inner layer are machined to slightly enlarge the hole originally formed therethrough. In the preferred embodiment, markings in the form of regularly spaced circumferential grooves are provided along the length of the device and are readily utilizable to determine where the device should be cut so that, by the application of a sharp force as from a hammer, the tapered end of the device, with the hard-to-machine plug embedded therein, is firmly lodged into the hard inner layer. Welding material is provided thereafter to firmly connect an outer end of the device with the material of an outer layer of the wall.
    Type: Grant
    Filed: May 22, 1990
    Date of Patent: April 21, 1992
    Inventor: J. Clayton Miller
  • Patent number: 4900636
    Abstract: There is disclosed a metal plate laminated body. When a portion encircled by inner and outer closed curves is embossed, a projection is protruded from a lower surface of a metal plate. Since a width of protrusion is slightly larger than that of a recess, when press-fitting the projection into the recess of the contiguous metal plate, an outer peripheral surface of the projection which is formed along the outer closed curve is brought into press-contact with an outer peripheral surface of the recess; and an inner peripheral surface of the projection which is formed along the inner closed curve similarly comes in press-contact with an inner peripheral surface of the recess. These inner and outer peripheral surfaces cooperate to become effective contactual surfaces, and the contiguous metal plates are joined to each other.
    Type: Grant
    Filed: June 20, 1988
    Date of Patent: February 13, 1990
    Assignee: Nippondenso Co., Ltd.
    Inventors: Syoishi Takenouchi, Kazuhiro Morita, Shinichi Ezaka, Yoshitaka Kuroda
  • Patent number: 4869969
    Abstract: A metallic wall having coined knockouts. The wall includes a first surface and a second surface spaced from the first surface. A plurality of spaced knockout portions are positioned in incipient apertures in the wall and are disposed substantially between the surfaces. Each knockout portion is defined by a first indentation encompassing the knockout portion and extending from the first surface, and by a second indentation encompassing the knockout portion and extending form the second surface. These indentations are in alignment with a web of material of substantially uniform thickness throughout its length spacing the indentations. The outside surface defining the first indentation is inclined inwardly. A coating is applied to the second surface after formation of the indentations. A sharp blow to the knockout portion from the second surface fractures the web to allow removal of the knockout portion without any material of the wall extending substantially beyond the first surface.
    Type: Grant
    Filed: May 3, 1988
    Date of Patent: September 26, 1989
    Assignee: Allied Tube & Conduit Corporation
    Inventors: Zorica Pavlov, Vijay B. Patel
  • Patent number: 4863806
    Abstract: An optical isolator is fabricated upon a lead frame having an LED section which is rotated 180.degree. to position the LED over the photodiode. Prior to rotation both the LED and the photodiode attachment portions of the leads are down set a predetermined amount to fix the size of the isolation gap between the LED and the photodiode. Dielectric sheets are attached to the outer surfaces of the LED and photodiode leads and an optically transmissive resin is injected therebetween to form a light guide and to encapsulate the LED and photodiode dice and their associated bond wires. In an alternate embodiment a sheet is attached to the outer surface of one lead and a dielectric sheet thereagainst is positioned at a tilted angle between the LED and the photodiode.
    Type: Grant
    Filed: July 21, 1987
    Date of Patent: September 5, 1989
    Assignee: Hewlett-Packard Company
    Inventors: Stephen P. Merrick, Robert W. Teichner
  • Patent number: 4777096
    Abstract: Surgical needles are produced by a process which comprises the steps of:(a) coating at least one side of a metal sheet with a light sensitive photoresist;(b) exposing the photoresist with light in the image of a plurality of surgical needles, each needle having a pointed end and a suture attachment end;(c) removing the unexposed photoresist, to thereby leave in place on the metal sheet hardened photoresist in the image of a plurality of surgical needles;(d) exposing the product of step (c) to an etchant to remove metal not protected by said hardened photoresist, to thereby form a plurality of surgical needles.
    Type: Grant
    Filed: March 17, 1987
    Date of Patent: October 11, 1988
    Assignee: Ethicon, Inc.
    Inventor: Emil Borysko
  • Patent number: 4737417
    Abstract: A cast metallic fixture for workpieces including twin turbine blades has two spaced-apart walls which surround portions of the exterior of a workpiece and several webs which connect the walls to each other. The fixture is made in a casting mold which has one or more inserts extending into the interior of a workpiece which is placed into the cavity of the mold preparatory to pouring of a molten alloy which is then caused to harden and to thus form the fixture. When the fixture has served its purpose of holding the workpiece in a grinding machine, it is broken up by subjecting its walls to bending and tensional stresses to destroy the webs, whereupon the walls are moved apart to afford access to the workpiece. The webs can be destroyed by melting simultaneously with or in lieu of the application of mechanical stresses to the walls of the fixture.
    Type: Grant
    Filed: April 20, 1987
    Date of Patent: April 12, 1988
    Assignee: Korber AG
    Inventors: Heinrich Mushardt, Uwe Uhlig, Ralf Bleich
  • Patent number: 4721992
    Abstract: In an assembly tape to be used in the tape automated bonding of semiconductor devices a single layer or two or three layer tape is described. The arrays of finger patterns created in the tape are isolated by forming transverse slots across the tape. These slots act to mechanically isolate adjacent finger patterns and improve tape flexibility. When the tape is passed under the guide shoe in an inner lead bonding machine the metal fingers will not be distorted as the tape flexes. After the semiconductor device is bonded to the tape the increased tape stiffness does not cause the tape to be deflected from its desired location with respect to the guide shoe. The slots desirably span the space between tape locator holes. If desired, the slots can be extended on the finger side of the tape to span the locator holes to form slot extension regions of reduced tape thickness. Alternatively, a slot can be formed from a plurality of shorter slots that in the aggregate perform the same function.
    Type: Grant
    Filed: June 26, 1986
    Date of Patent: January 26, 1988
    Assignee: National Semiconductor Corporation
    Inventors: Ali Emamjomeh, Richard Pice
  • Patent number: 4701363
    Abstract: A process for step etching a metal tape adapted for use in tape automated bonding comprises forming an etch resist pattern on the tape having a first portion defining a pattern of leads and a second portion within the first portion defining steps in the leads. The metal tape is etched in the regions not covered by the resist at a desired rate and etched in the regions for forming the step at a reduced rate as compared to the desired rate, thereby forming the tape having a plurality of leads corresponding to the resist pattern with each of the leads having a step therein generated by the second portion of the resist pattern. The metal tape formed by the process has a unique structure wherein the web between bumps formed at the end of the leads and the remainder of the leads has a unique channel beam cross section for stiffening the web which is relatively thin as compared to the leads or the bump.
    Type: Grant
    Filed: January 27, 1986
    Date of Patent: October 20, 1987
    Assignee: Olin Corporation
    Inventor: Larry J. Barber
  • Patent number: 4670352
    Abstract: A method for tearing a thin sheet material and a tearable thin sheet material having a predetermined tear line wherein the material is corrugated along a predetermined tear line to be torn. The corrugations have at least one edge, a base and an apex and the material is torn along said edge.
    Type: Grant
    Filed: October 6, 1986
    Date of Patent: June 2, 1987
    Assignee: Canada Cup, Inc.
    Inventor: John H. Kurz
  • Patent number: 4635092
    Abstract: Power semiconductor devices are manufactured using a flexible metal tape carrier to facilitate automation of the manufacturing process. Control leads are fashioned from portions of the tape carrier, with a main portion of the tape carrier serving as a main current lead. The manufacturing process permits thorough electrical testing of a power semiconductor chip prior to incorporation into a relatively expensive power device package. In particular, the power chip can be tested at full-rated current, at least where the current is pulsed at a low duty cycle.
    Type: Grant
    Filed: June 4, 1984
    Date of Patent: January 6, 1987
    Assignee: General Electric Company
    Inventors: Alexander J. Yerman, James A. Loughran
  • Patent number: 4447502
    Abstract: The invention relates to a bottleneck foil consisting of an aluminum foil section provided on at least one side with a special protective layer which comprises 1-40 percent by weight of a binder which is not resistant to alkaline solutions and 60-99 percent by weight of a binder which is resistant to alkaline solutions.
    Type: Grant
    Filed: August 23, 1982
    Date of Patent: May 8, 1984
    Assignee: Haendler & Natermann GmbH
    Inventor: Klaus Sommerer
  • Patent number: 4438181
    Abstract: A preformed metallic tape for thermocompression bonding to electronic component chips and a method and apparatus for the use thereof. The tape has etched thereinto a chip bonding site which includes a central, pull-tab region surrounded by a frame region. Intermediate the pull-tab and the frame regions, electrically conductive leads are formed and connected to the pull-tab. Several of the leads are further connected to the frame. The leads are formed with neck regions located respectively between their ends and the pull-tab and frame. One surface of the tape is a bonding surface and the opposite surface is a pressure pad surface. Protruding above the pressure pad surface are a plurality of mushroom-shaped pressure pads located respectively at the ends of leads. The tape is bonded to a chip by first aligning mating electrical contact pads thereof and terminal ends of the leads. The pads are then urged into the tape so that the pressure pads located on the opposite side thereof contact a heated anvil.
    Type: Grant
    Filed: January 13, 1981
    Date of Patent: March 20, 1984
    Assignee: Jon M. Schroeder
    Inventor: Jon M. Schroeder
  • Patent number: 4400443
    Abstract: An encoder disc comprised of two or more stainless steel laminations, at least one of which is thinner than the others for the purpose of providing more accurately sized openings in the disc.
    Type: Grant
    Filed: August 18, 1980
    Date of Patent: August 23, 1983
    Assignee: Hutchinson Technology Incorporated
    Inventor: Jeffrey W. Green
  • Patent number: 4348464
    Abstract: A scoring tool combination wherein the score anvil is provided with a pair of transversely spaced generally rounded material compressing ribs disposed on opposite sides of the scoring rib of the score tool. The material compressing ribs compress the material of the sheet being scored on opposite sides of the score so as to strengthen the sheet and thus permit deeper scoring and lesser score residuals without failure due to cracking. The material compressing ribs also control coating damage and exposed metal areas.
    Type: Grant
    Filed: November 29, 1978
    Date of Patent: September 7, 1982
    Assignee: The Continental Group, Inc.
    Inventor: Nick S. Khoury
  • Patent number: 4312926
    Abstract: In an automatic assembly tape for semiconductor device assembly a continuous tape includes a plurality of sequential metal finger patterns. Each pattern includes a plurality of fingers that extend inwardly to form an array that mates with the bonding pads on a semiconductor device chip. The fingers are bonded to the chip pads so that the chip is then associated with the tape and therefore emenable to further assembly on high speed machines on a reel-to-reel tape handling basis. Each finger pattern includes an inner tear strip ring that initially holds the fingers together in a unitary structure. The fingers are joined to the ring via intermediate weakened regions. After the fingers are bonded to the chip pads, the ring is torn away so as to separate at the weakened regions. Prior to bonding, the fingers are held in precise location and in a common plane. This allows close spaced complex finger patterns and avoids bent fingers which can cause bond failure and possibly clogging of the auto assembly machines.
    Type: Grant
    Filed: April 14, 1980
    Date of Patent: January 26, 1982
    Assignee: National Semiconductor Corporation
    Inventor: Carmen D. Burns
  • Patent number: 4258458
    Abstract: A blank for a stone setting comprising a base and prongs extending radially therefrom, said blank having a planar lower side and a notched upper side, the notches at the upper side defining at the junctions of the prongs with the base hinges which enable bending the prongs upwardly relative to the base to form a stone cage and at the distal ends thereof a seat for the stone and tangs for fixing the stone against the seat. A method of making a setting including making the blank by striking it from malleable sheet metal, removing parts of the sheet metal from around the bank, stripping the blank from the sheet metal, using a punch to force it into a die for bending the prongs and tangs at their notched areas to shape it into a cage. A further method of setting a stone by seating a stone against the seat at the top of the cage and bending the tangs against the stone.
    Type: Grant
    Filed: January 14, 1980
    Date of Patent: March 31, 1981
    Assignee: B. B. Greenberg Co.
    Inventor: Louis J. Danna
  • Patent number: 4252864
    Abstract: A continuous strip of stamped and formed lead frames for a semi-conductor chip comprises spaced apart parallel carrier strips with the lead frames connected to one of the carrier strips at regularly spaced intervals. Each lead frame comprises a chip supporting portion which is centrally located between the carrier strips, and second arm which extends from the chip support portion towards one of the carrier strips and first and third arms on each side of the chip support portion which extend towards the other carrier strip. Terminal tabs are provided on each of the arms, the first and third tabs on the first and third arms extending parallel to each other towards the other carrier strip and the tab on the second arm extending parallel to the other tabs and towards the one carrier strip. Each lead frame is secured to the one carrier strip by a connection section extending from the second tab.
    Type: Grant
    Filed: November 5, 1979
    Date of Patent: February 24, 1981
    Assignee: AMP Incorporated
    Inventor: Daniel R. Coldren