Abstract: A test apparatus for testing device under test (DUT) having an antenna located on the DUT is disclosed. The test apparatus includes: a housing, a socket configured to electrically connect the DUT to a load board, a gripper assembly configured to hold the DUT in place, a retractor configured to release the DUT from the gripper assembly, and an alignment plate configured to align the DUT with the socket. The gripper assembly includes a base and an extender, the base is attached to the housing, and the extender is configured to hold the DUT in place. When the retractor is disengaged from the extender, the extender is configured to hold the DUT in place. When the retractor is engaged with the extender, the extender is configured to release the DUT on the alignment plate.

Abstract: The present invention relates to a locking mechanism for a press head, and an electronic device testing apparatus comprising the same, wherein a slider and a locking pin are disposed on the press head and a test socket substrate, respectively. When the press head is moved and engaged with the test socket substrate, an actuator drives the slider to secure the locking pin, so as to secure the press head and the test socket substrate and prevent the press head and the test socket substrate from being separated from each other. The mechanism is simple in construction, easy to install and maintain, reliable, and can be integrated into the support arms, and occupies a relatively small space. Energy is consumed only when the actuator is actuated to effect locking or unlocking. That is, only when the slider is driven and moved, energy is consumed. No extra energy is needed to persistently press down or drive the locking mechanism.

Abstract: Provided is a camera module including a liquid lens including an electrode; a holder for receiving the liquid lens therein; a base disposed under the holder; a sensor board disposed under the base and including an image sensor; a connection board connected to at least a portion of the electrode of the liquid lens; and a terminal plate disposed at the base and electrically connected to the sensor board and the connection board.

Abstract: A detachable robot system includes a mobile working machine and an intelligent device. The mobile working machine includes a transmission wheel device, a first fastening portion and a first conductive contact. The first fastening portion and the transmission wheel device are oppositely arranged on the first main body. The transmission wheel device loads and moves the first main body. The intelligent device is completely removable from the mobile working machine, and includes a second fastening portion and a second conductive contact. Thus, when the intelligent device is loaded on the mobile working machine, the intelligent device is fixedly coupled to the mobile working machine by the first fastening portion and the second fastening portion engaged with each other, so that the first conductive contact and the second conductive contact are aligned and connected to each other.

Abstract: An adapter has two conductors each with a U-shaped bend forming upper longer legs and lower shorter legs. The conductors face each other with the longer legs linearly aligned with each other and the shorter legs aligned with each other, thereby forming a first gap between the longer legs and a second gap between the shorter legs. The first gap is substantially smaller than the second gap, so that an electrical package can be placed across the first gap to contact the two upper longer legs, while the two shorter legs are spaced further apart to span a larger gap between conductors of a connector. Thus, the adapter enables the electrical package to be connected to conductors having a gap that is larger than the electrical package.

Abstract: An active filtering system arranged for being connected between a first power supply line and a second power supply line of a DC bus, the bus being arranged for being connected to a DC voltage source located upstream, the system including a first capacitor arranged for being connected both to the first power supply line of the bus and to the second power supply line of the bus and to the terminals whereof a voltage is applied including an AC component, a switching assembly controlled by a processor for generating a compensation voltage, opposite to the AC component of the voltage at the terminals of the first capacitor, and including a first terminal connected to the first capacitor and a second terminal intended to be connected to the second power supply line.

Abstract: Disclosed herein are systems and methods for providing a compressible interconnect for allowing electrical communication between an electronics unit and an analyte sensor in an on-body analyte monitoring device. In other embodiments, systems and methods are provided for reducing the Z-height of an on-body analyte monitoring device by utilizing novel interconnects.

Abstract: A connector includes a body, a slot within the body configured to receive a substrate and including a first end and a second end, contacts arranged along the slot between the first end and the second end, and a biasing mechanism arranged at the first end to align the substrate as the substrate is inserted into the slot so that substrate is in contact with the second end when the substrate is fully inserted into the slot.

Abstract: A connector reduced in inspection cost by making it possible to visually check a state of connection between contact portions of contacts and terminal portions of an object to be connected. A male-side holding member includes a plurality of belt-like holding portions that hold linking portions of a plurality of male-side contacts, a holding member-side linking portion that links the plurality of holding portions arranged in parallel to each other, and a plurality of visually checking portions for visually checking a state of connection between contact portions of the male-side contacts and terminal portions of an electronic component from the other surface side of the male-side holding member. The visually checking portions are adjacent to the holding portions.

Abstract: A socket connector includes an insulative base (2), a plurality of contacts (3) therein with an engaging portion (32) and a floating cover (5). The floating cover (5) includes a plurality of through holes (53) for receiving the engaging portions (32) extending therethrough. The socket connector includes a metallic shell (4) having a plurality of receiving holes (41) for receiving the contacts therein and electrically engaging with a metallic surface (52) formed on bottom of the floating cover (5).

Abstract: A burn-in socket for an IC package includes a base loaded with several terminals, a sliding plate, an actuator and a pair of locking elements. The sliding plate is assembled on the base and defines an upper surface. The actuator is mounted on the base and defines a receiving opening facing the upper surface. The locking elements is assembled on the actuator under a condition that the locking elements rotate inwards to press against the IC package and outwards to release the IC package when the actuator is push downwards in a vertical direction. Each locking element includes a rotating element and a pressing element. The rotating elements rotate in relative to the actuator and the pressing element rotates in relative to the rotating element. The pressing element defines a sliding slot and the rotating element defines a sliding post slidably receiving in the sliding slot.

Abstract: A socket for electric parts which is dawn sized. The socket of the present invention comprises a socket body to accommodate an electric part, plural contact pins disposed to a peripheral edge of the socket body, a latch rotatably located on the socket body so as to positioned above the contact pins, which presses an upper part of the electric part when the latch is closed and is in a state the IC socket can be accommodated and taken out when the latch is opened, an operating member which is vertically movably disposed in the socket body and comprises an operating portion for closing constituted so as to press upward an operation portion to be operated for closing formed to both side end portion of the latch and rotate the latch in an closing direction when the operating member moves upward.

Abstract: Methods, systems, and devices are disclosed for producing and delivering packetized power within a DC computing environment. Within the DC computing environment a power requirement or request is communicated to a power router. The power router then determines a power source capable of fulfilling the power requirement and then causes the power to be delivered in packetized form. The packetized power is appended to a message header which allows the power packet to be received by the requesting device.

Abstract: A fixing apparatus for fixing a waveguide plate includes a number of conductive fixing members fixed to corresponding sides of the waveguide plate, and a bracket. Each fixing member includes a fixing portion having an identical length to the corresponding sidewall and a resilient abutting portion extending from a side of the fixing portion. Each fixing portion is in tight contact with the corresponding side of the waveguide plate. The waveguide plate is received in the bracket. The resilient abutting portions resiliently abut against an inner surface of the bracket.

Abstract: An insert for a handler which may be easily replaced when damaged because a semiconductor device is often received in the insert. The insert in which the semiconductor device including a plurality of terminals is received and which allows the semiconductor device to contact an external contactor includes: an insert body that has a through-hole which is formed in a central portion of the insert body and into which the semiconductor device is to be inserted; and a support member that crosses the through-hole to be detachably coupled to the insert body and supports the semiconductor device inserted into the through-hole, wherein a plurality of communication holes are formed to correspond in position to the terminals of the semiconductor device and to pass through the support member from a top surface to a bottom surface of the support member such that the terminals and the external contactor are brought into contact with each other.

Abstract: An apparatus having a three-dimensional integrated circuit structure is described herein. The apparatus include an interposer for carrying a plurality of high and low-power chips. The high-power chips are attached and connected to one side of the interposer, while the low-power chips are attached and connected to the other side of the interposer. In generally, the high-power chips produce more heat than does the low-power chip during their operations. The interposer further include through silicon vias and redistribution layers for connecting the chips on both surfaces. In addition, the interposer assembly is attached and connected to a substrate layer, which is in turn attached and connected to a printed circuit board. In order to provide improve thermal management, the interposer surface carrying the high-power chips are oriented away from the circuit board. A heat spreader is attached to the back sides of the high-power chips for dissipating the heat.

Abstract: A semiconductor chip package test socket may include a socket housing; a plurality of probe needles in the socket housing; a conductive pad on the probe needles; a floating guide configured to cover an edge of the conductive pad and configured to provide a semiconductor chip package on the conductive pad; and/or clamps fixed at the socket housing. The clamps may combine the floating guide with the socket housing.

Abstract: A burn-in socket for an IC package includes a base loaded with several terminals, a sliding plate, an actuator and a pair of locking elements. The sliding plate is assembled on the base and defines an upper surface. The actuator is mounted on the base and defines a receiving opening facing the upper surface. The locking elements is assembled on the actuator under a condition that the locking elements rotate inwards to press against the IC package and outwards to release the IC package when the actuator is push downwards in a vertical direction. Each locking element includes a rotating element and a pressing element. The rotating elements rotate in relative to the actuator and the pressing element rotates in relative to the rotating element. The pressing element defines a sliding slot and the rotating element defines a sliding post slidably receiving in the sliding slot.

Abstract: A test socket is provided including a socket board, socket pins and a guiding member. The socket pins are exposed to an upper surface of the socket board and are configured to be electrically contacted by external terminals of an object. The guiding member is disposed on an upper surface of the socket board and is arranged to guide the external terminals as a single unit to contact the external terminals with the socket pins. The guiding member is also configured to a center of the socket board with a center of the object.

Abstract: Methods, systems, and devices are disclosed for producing and delivering packetized power within a DC computing environment. Within the DC computing environment a power requirement or request is communicated to a power router. The power router then determines a power source capable of fulfilling the power requirement and then causes the power to be delivered in packetized form. The packetized power is appended to a message header which allows the power packet to be received by the requesting device.

Abstract: A multimode system with at least two end points may include a multimode signaling path that, in some embodiments, is a multimode cable or a multimode board and is pluggably connectable to packages at each end point. Each end point may include a processor die package coupled to a socket. The socket may also receive a connector that couples the cable to the package. Power supply signals and input/output signals may be decoupled at each end point.

Abstract: Methods, systems, and devices are disclosed for producing and delivering packetized power within a DC computing environment. Within the DC computing environment a power requirement or request is communicated to a power router. The power router then determines a power source capable of fulfilling the power requirement and then causes the power to be delivered in packetized form. The packetized power is appended to a message header which allows the power packet to be received by the requesting device.

Abstract: An electrical connector is adapted for electrically connecting an electronic package (3) to a circuit board. The electrical connector includes an insulative housing (11), a stiffener (13) supporting the insulative housing and formed with a stopper (137), a clip (30) formed with a depressing portion (34), and a leaf (50) formed with an anchor (52). The clip is mounted on the stiffener and is pivotable between a first position and a second position. The leaf is mounted on the clip and is pivotable between the second position and a locked position. When the leaf is positioned at the locked position, the anchor is blocked by the stopper and the depressing portion of the clip depresses the electronic package.

Abstract: An electrical connector is adapted for electrically connecting an electronic package (3) to a circuit board. The electrical connector includes an insulative housing (10) for receiving an electronic package, a stiffener (30) supporting the insulative housing, a pair of latching members (50) mounted on the stiffener and pivotable about a respective first axis therethrough, and a lever (70) mounted on the stiffener and pivotable about a second axis perpendicular to the first axis, the lever being operable to pivot the latching members to a closed position for pressing against the electronic package.

Abstract: An IC socket comprises a socket body, a plurality of contacts, an actuator mounted on the socket body and moveable up-and-down relative to the socket body, and a latch member configured with one end thereof connecting with the actuator via a pivotal shaft and another end thereof movably connecting with the socket body. When the actuator is moved downwardly, the pivotal shaft is pushed downwardly and drives the latch member to rotate from a closed position to an open position. The actuator further defines a supporting element extending to a position under the latch member for abutting against the latch member during rotational movement of the latch member.

Abstract: An IC socket includes a base receiving a number of contacts, a lid mounted upon the base, and at least one latch mounted in the base. The lid is able to be operated between a first position away from the base and a second position adjacent to the base. The latch is driven by the lid to open and close. At least one stopper is disposed on the lid and extends into a recess defined on the latch to lock with latch the latch when the lid located at the first position for preventing the lid from dropping from the base.

Abstract: A camera includes an electrically conductive housing defined by exterior walls and an interior cavity. The exterior walls of the housing have a lens opening and a connector opening formed therein. An imaging device is disposed within the interior cavity of the housing and communicates with the lens opening. A printed wiring board (PWB) is disposed within the interior cavity of the housing separating the imaging device from the connector opening. The PWB has an electrically conductive chassis plane operatively connected to the exterior walls of the housing so that the chassis plane and the housing form at least a partial Faraday cage around the imaging device.

Abstract: A semiconductor device comprises: a plurality of semiconductor chip; a socket; and a mounting board equipped with the socket. Each of the semiconductor chips has a major surface, a back surface and a plurality of connection terminals on the major surface. The socket has internal connection terminals inside and external connection terminals outside, and the internal connection terminals are in contact with the connection terminals of the semiconductor chips.

Abstract: An IC socket includes a driving member, a socket body mounted below the driving member and a latch member assembled to the base. The driving member is operated between an upper position and a lower position, and drives the latch member to shift between a closed position and an opened position. The base is assembled with a detachable latch hinge, to which the latch member is pivotally attached. The latch hinge can be easily replaced with another proper one according to a thickness of the IC package to the received in the IC socket.

Abstract: An electrical connector (1) for receiving a CPU (5) includes a rectangular planar receiving portion (10) having a top surface (14) for mating with the CPU. At least two posts (20) extend perpendicularly from corners of the planar receiving portion. At least two posts and the planar receiving portion together define a receiving space for receiving the CPU. The post includes a resilient portion (22) and a fixing portion (24). A gap (241) is defined between a resilient portion and a fixing portion, and the resilient portion forms a protrusion block (26) protruding into the receiving space.

Abstract: A burn-in socket (100) includes an insulative main body (1) defines a plurality of passageways; a slider (2) and a bottom plate (3) fits to the insulative main body; a plurality of contacts (16) receives in the insulative main body and the slider. The actuator frame (4) attached to the insulative main body forms a plurality of posts (44) positioning in the slots of the insulative body, the actuator frame includes a pair of opposing walls, each opposing wall has an upper guiding surface (45) protruding into the receiving room and a lower guiding surface (46) returns back towards the opposite wall both along the mating direction.

Abstract: A three dimensional object creation system for printing a three dimensional object comprised of layers stacked vertically with respect to each other includes a series of printheads for printing the layers, the series of printheads simultaneously printing at least two layers of different vertical positions within the stack; and a semiconductor memory for storing data defining at least one layer. The series of printheads are arranged in groups of one or more printheads per group, each group being fixedly positioned downstream of a preceding group with respect to the three dimensional object. Each group of printheads is adapted to print a layer at a predetermined vertical position within the stack.

Abstract: A clamping mechanism (18) for an IC socket (14) is disclosed having two moveable arms (36) which are spaced apart on opposite sides of the IC socket (14), with first ends pivotally secured to a fixed shaft (34) at moveable arm pivot points for moving from a lifted position to a lowered position, extending across the IC socket (14). Two clamp arms (38) are spaced apart on opposite sides of the IC socket (14), and have formed ends (40) pivotally secured to the second ends (166) of the moveable arms (36) at latch pivot points. The clamp arms (38) are configured such that, when the moveable arms (36) are disposed in the lowered positions and the clamp arms (38) are disposed in the clamping positions, a hooking shaft (32) is disposed in the self-locking positions in openings (156) in the clamp arms (38) such that upward forces applied to the moveable arms (36) will engage the hooking shaft (32) against the clamp arms (38) and urge the clamp arms (38) into the latched position.

Abstract: A socket for mounting an electronic component that can connect an electronic component always in a correct orientation is provided. Socket-side engaging parts (9) are provided at a plurality of places of a peripheral wall (3) of a socket housing (5) having an electronic component accommodating part (4) that is surrounded by the peripheral wall (3) raised from the four side parts of a quadrangle-shape bottom plate (2). The socket-side engaging parts (9) include elastic fixing pieces whose fixing protrusions (9a) at the tip ends are locked in the bottom parts of respective locking recessed parts of the peripheral wall of the electronic component (6). An electronic component is held in the electronic component accommodating part (4) by these socket-side engaging parts (9).

Abstract: A socket connector includes a frame having a receiving cavity therein, a plurality of wafers aligned along a direction and received in the receiving cavity of the frame, and a plurality of contacts. The wafer is formed with a plurality of parallel slots located along at least one surface thereof and matched with corresponding slots of a neighboring wafer to constitute a plurality of receiving holes. The contacts are received in the receiving holes respectively. Each contact includes a top contacting section extending upwardly beyond an upper surface of the wafers and a bottom contacting section extending downwardly beyond a lower surface of the wafers.

Abstract: An IC socket for receiving an IC package comprises a socket body for carrying the IC package. A plurality of contacts are received in the socket body for electrical connection with the IC package. A driving member is mounted upon the socket body and able to operate between an upper position and a lower position. At least one latch device comprises an upper section, a lower section parallel to the upper section and a regulator. The regular links the upper section and the lower section and force the lower section to move relative to the upper section.

Abstract: An electrical connector (100) adapted for electrically connecting a package to a printed circuit board comprises a base (4), an adapter (3) assembled on the base (4), a plurality of contacts (6) received in the base (4), a frame (1) assembled on the base (4) and moves up and down relative to the base (4), an actuator (2) assembled on the base (4) and moves from a closed position to an opened position when the frame (1) moves up and down, the base (4) comprises a plurality of passageways (4101), the adapter (3) comprises a plurality of receiving holes (31) corresponding to the passageways (4101) of the base (4), the contacts (6) are received in the passageways (4101) and go through the receiving holes (31), a hook (311) is formed on one of the adapter (3) and the base (4) to latch the adapter (3) on the base (4).

Abstract: A burn-in socket includes a base, a sliding plate mounted to the base, a number of contacts, and an actuator mounted on the base. The contact each has a base portion secured to the base and a pair of arms extending through the pin holes of the sliding plate. The actuator includes a frame and a number of actuating portion extending downwardly from the frame for driving the sliding plate to slide on the base in a first direction. The actuator includes a number of pushing portions contacting with the sliding plate and driving the sliding plate to move in a second direction opposite to said first direction.

Abstract: A socket connector (1), used for receiving a CPU (central processing unit), includes an insulative housing (11) defining a plurality of passageways (113), a plurality of electrical contacts (14) received in the passageways, a metallic reinforcing plate (10) receiving the insulative housing, a cover member (12) pivotally mounted to the reinforcing plate, and a lever (13) attached to the reinforcing plate, pivotally driving the cover member to move toward the insulative housing. The lever rotates along a same direction as the cover member.

Abstract: An LGA socket includes an insulative housing and a plurality of electrical contacts secured on the insulative housing. The insulative housing defines a top face and a bottom face opposite to each other. The insulative housing has a number of alignment posts at corners and the alignment posts together form a receiving space. The alignment post is provided with two crash ribs for positioning an integral module received in the receiving space.

Abstract: A socket for electrically connecting an IC package to a printed circuit board, comprises an insulative housing, a stiffener surrounding the housing and having a front wall defining a hole; and a load plate pivotably mounted to the front wall of the stiffener. The load plate has a pivotal portion with a hook, the hook has a latching finger engaging with the latching hole of the stiffener, a protruding finger and a gap defined between the latching finger and the protruding finger. The protruding finger resists the stiffener when the load plate deflects on a top-to-bottom direction relative to the stiffener. The protruding finger also can engage with the stiffener to guide the load plate to rotate in a correct direction.

Abstract: A burn-in socket, for electrically connecting an IC package to a print circuit board, includes a base, a lid assembled upon the base and being movable up and down relative to the base and a latch pivotally linking to the base by a first shaft thereof. The latch defines a through hole which receives a second shaft pivotally linking to the lid. When being brought by the lid, the second shaft moves up and down in the through hole and drives the latch to rotate.

Abstract: A semiconductor package socket (1, 101) has a socket base (10, 110) including a package rest (11, 111) on which a semiconductor package (50) having gull-wing leads (52) is put, a cover member (20, 120) movably attached on the socket base, and a plurality of contacts (30, 130) each including a first contact piece (31, 131) capable of making contact, from above, with a horizontal shoulder portion of the lead, a second contact piece (32, 132) capable of making contact, laterally, with a vertical leg portion of the lead and a fixed portion, and formed to advance onto or retract from the package rest due to vertical movement of the cover member. The package rest is formed with a dam wall that allows the leads to be lied thereover, wherein the first and the second contact pieces each have an elastic deforming portion to determine a contact pressure.

Abstract: A production line is provided for forming a layered product. The production line includes a conveyor configured to convey a substrate. A plurality of elongate printheads extend transverse to the conveyance direction and is configured to print voxels upon the conveyed substrate to form the layered product. The printheads are arranged to form a plurality of sets which are equidistantly spaced apart.

Abstract: An electrical connector (1) for receiving an IC package includes a socket body (2) with a plurality of contacts (4) therein. A cover (3) is pivotally mounted with respect to the socket body (2) and defines an inner side close to the socket body (2) and an outer side opposite to the socket body (2). A heat sink (5) is provided to be mounted with the cover (3) by a plurality of fasteners (6). The fasteners (6) are inserted into the cover (3) and the heat sink (6) from the inner side of the cover (3).

Abstract: An electric connector is disclosed to include an electrically insulative housing, which has solder ball receiving portions, terminals respectively mounted in the housing corresponding to the solder ball receiving portions, each terminal having an endpiece, which defines with the sidewall of each of the solder ball receiving portions a respective receiving chamber, and solder balls respectively movably accommodated in the receiving chambers defined by the endpieces of the terminals and the sidewalls of the solder ball receiving portions.

Abstract: An IC socket, adapted for electrically connecting an IC package and a printed circuit board, includes a base, a socket body received in the base, a plurality of contacts received in the socket body, and an actuating mechanism moveably assembled on the base. The socket body includes a first insulative housing and a second insulative housing located under the first insulative housing. The actuating mechanism can actuate the first insulative housing and a second insulative housing to move in a horizontal direction relative to each other and drive the contact to stretch in a vertical direction.

Abstract: A clip comprises two pieces of load plates. Each load plate has a pressing portion extending downwardly in a middle position thereof and two retention portions at two ends thereof, the two pieces of load plates across dispose when the load plates are secured.

Abstract: A socket connector (1), used for receiving a CPU (central processing unit), includes an insulative housing (11) defining a plurality of passageways (113), a plurality of electrical contacts (14) received in the passageways, a metallic reinforcing plate (10) receiving the insulative housing, a cover member (12) pivotally mounted to the reinforcing plate, and a lever (13) attached to the reinforcing plate, pivotally driving the cover member to move toward the insulative housing. The lever rotates along a same direction as the cover member.

Abstract: A sensor isolation system including a sensor, a package for the sensor, and a compliant interposer disposed between the sensor and the package and interconnecting the sensor to the package to isolate the sensor from thermal and mechanical stresses and yet at the same time providing a physical interconnect between the sensor and the package.