Abstract: A spindle configured for a reciprocating knife sharpener is provided. The spindle includes a head including an arbor configured for manual exchange of abrasive material. A knife sharpener and a cutting table are disclosed.

Abstract: A drive assembly for a grinder has a housing device, a drive device, multiple transmission devices and multiple grinding devices. The drive device has a motor, a driving wheel and a driving band connected with the motor and the driving wheel. Each transmission device has a transmission wheel, multiple driven wheels and a transmission band. Each transmission band is engaged with the driven wheels and the transmission wheel is engaged with the driving band. With two-layer arrangement of the bands, the driving band and the transmission bands are not long and can be rotated smoothly to reduce energy waste. Accordingly, the motor's load is greatly reduced, and life spans of the driving band and the transmission bands are prolonged.

Abstract: Composition, apparatus, and methods of composition and apparatus manufacture, for sharpening a paper shredder blade. Composition includes grinding powder, thickening agent, and additive. The thickening agent may be a white oil, an animal oil, an vegetable oil, or a stearine wax. The additive may be an antirust powder, an antiwear powder, an antistatic powder, or an antioxidation powder. The grinding composition is dispensed into a polyethylene film, and sealed to form the grinding apparatus, as a grinding sheet or a grinding packet. A method for forming a grinding sheet includes selecting the constituent materials for a grinding composition; stirring the constituent grinding composition materials; heating the constituent materials to melting; mixing the constituent materials, while melting and intermixing; cooling and packaging the grinding composition to form a grinding sheet or packet.

Abstract: Composition, apparatus, and methods of composition and apparatus manufacture, for sharpening a paper shredder blade. Composition includes grinding powder, thickening agent, and additive. The thickening agent may be a white oil, an animal oil, a vegetable oil, or a stearine wax. The additive may be an antirust powder, an antiwear powder, an antistatic powder, or an antioxidation powder. The grinding composition is dispensed into a polyethylene film, and sealed to form the grinding apparatus, as a grinding sheet or a grinding packet. A method for forming a grinding sheet includes selecting the constituent materials for a grinding composition; stirring the constituent grinding composition materials; heating the constituent materials to melting; mixing the constituent materials, while melting and intermixing; cooling and packaging the grinding composition to form a grinding sheet or packet.

Abstract: A golf ball kit having an abrasive material adapted for imparting enhanced micro surface roughness to an exterior surface of a golf ball. The enhanced micro surface roughening affects the aerodynamic properties of the ball as compared to golf balls having the same set of construction specifications but without enhanced micro surface roughness. The kit includes an instruction device having a plurality of correlations between at least one performance parameter and micro surface roughness for at least a first golf ball.

Abstract: A polishing slurry includes liquid medium and particulate abrasive. The particulate abrasive includes soft abrasive particles, hard abrasive particles, and colloidal silica particles, wherein the soft abrasive particles have a Mohs hardness of not greater than 8 and the hard abrasive particles have a Mohs hardness of not less than 8, and wherein the soft abrasive particles and the hard abrasive particles are present at a weight ratio of not less than 2:1.

Abstract: A method and apparatus for performing chemical-mechanical planarization (CMP) is disclosed, which in one embodiment includes a CMP tool for polishing a semiconductor wafer. The CMP tool includes a slurry mixture that has slurry beads. The slurry beads are formed of a polymer material. The slurry beads are used to remove summits and non-uniformities on the semiconductor wafer. In some embodiments the CMP tool includes a counter-face that replaces the polishing pad of a conventional CMP tool. In some embodiments the counter-face is made of polycarbonate. In another embodiment a slurry mixture for use with a CMP tool is disclosed. The slurry mixture includes slurry beads, where each of the slurry beads has a diameter of between 0.1 and 1000 microns, or in some embodiments a diameter of between 10 and 50 microns.

Abstract: A method and apparatus for chemical mechanical polishing of substrates, and more particularly a method and apparatus related to a carrier had for use in chemical mechanical polishing is provided. In one embodiment the carrier head assembly comprises a base assembly for providing support to the substrate, a flexible membrane mounted on the base assembly having a generally circular central portion with a lower surface that provides a substrate mounting surface, and a plurality of independently pressurizable chambers formed between the base assembly and the flexible membrane, comprising an annular outer chamber and a non-circular inner chamber, is provided.

Abstract: A sander according to the present invention comprising a housing, a motor and a transmission mounted within the housing, a sanding plate mounted below the housing, a battery pack mounted at the rear end of the housing and a balance means mounted on either the housing or the sanding plate. The balance means includes a balance element disposed in the front part of the sander. The balance element is balanced with the battery pack, which solves the balance problem of the DC sanders known in the prior art while still providing a battery pack that can satisfy the power requirements of the sander.

Abstract: A pad is disclosed comprising a monobloc body (10, 11), traversed by a plurality of peripheral through holes (3) for aspirating dust, wherein channels (4) are formed that extend parallel to the lower surface of the pad connecting a lower central aspiration hole (33) of the pad with peripheral holes (3C). The channels (4) intercept lower internal holes (101) of the pad that do not pass through the monobloc (10, 11) that are suitable for conveying the abraded dust from the central part of the pad to the peripheral holes (3C) through the channels (4).

Abstract: A tool is disclosed having a mounting opening for positive connection to a drive shaft that can be driven oscillatingly, the mounting opening comprising a plurality of outwardly extending projections each having an outer convex section that ends on both sides in concave lateral flanks, with neighboring lateral flanks joining each other on their way toward the center axis of the mounting opening to form a common bulge, concave on the outside, the shape of the outwardly extending projections, of the lateral flanks and of the bulges being such that there can be effected, optionally, either a positive connection to a first raised securing section of a first drive shaft, having a plurality of outwardly extending convex raised portions each having a rounded tip and rounded concave lateral flanks, or, optionally, a positive connection to a second securing section of a second drive shaft, having a plurality of raised positive-connection elements arranged in regular intervals on a circular line.

Abstract: The present invention generally relates to a polishing system. Particularly, the present invention relates a polishing apparatus having one or more modular polishing stations, and a plurality of polishing heads movably connected to a transferring system.

Abstract: A system method and apparatus to monitor a frictional coefficient of a substrate undergoing polishing is described. A polishing pad assembly includes a polishing layer including a polishing surface, and a substrate contacting member flexibly coupled to the polishing layer having a top surface to contact an exposed surface of a substrate. At least a portion of the top surface is substantially coplanar with the polishing surface. A sensor is provided to measure a lateral displacement of the substrate contacting member. Some embodiments may provide accurate endpoint detection during chemical mechanical polishing to indicate the exposure of an underlying layer.

Abstract: A carrier head (100) for a CMP tool, wherein the membrane (108) defining a chamber with a contact surface (102) of the carrier head (100) has a number of integral tubes (110) termining in openings coupled directly to the substrate (106), in addition to a main fluid flow passage (104) coupled to the chamber defined by the membrane (108). In use, during loading and polishing, a vacuum is applied to the main fluid flow passage (104) and the tubes (110) to hold the substrate (106) in flat engagement with the membrane (108) and contact surface (102). In order to unload the substrate (106), fluid pressure is applied to the substrate (106) via the tubes (110), whilst maintaining the application of the vacuum via the main fluid flow passage (104) so as to minimise bending and breakage of the substrate (106).

Abstract: Provided are an abrasive tool comprising abrasive particles having an average shape controlled to within a small range, and methods of providing such tools. Thus, a large number of abrasive tools will have very similar operating characteristics, and abrasive tools made at different times or through different methods also can have very similar operating characteristics.

Abstract: A shaft adapter for removably mounting to the output or drive shaft of a grinding machine is disclosed. The shaft adapter is a three-component device which includes a collar portion, a compressible drive sleeve and an extension member. The extension member has a free-end adapted to matingly engage with a particular grinding cup. When the shaft adapted is mounted on the drive shaft, the compressible drive sleeve is compressed and elastically deformed between the corresponding, engaging ends of the collar portion and extension member so as to create a secure driving force between the rotating drive shaft of the grinding machine and the shaft adapter so that they rotate together as a unit when the grinding machine is in use.

Abstract: A pneumatic grinding tool having a blower feature that can be selectively employed to blow debris away from a work area. The tool has a valve that directs input air that can be used to drive an output of the tool to a blower air passage. The blower air passage terminates at a head of the near the output of the tool.

Abstract: The invention relates to a protective hood securing device for a portable power tool (12), especially an angle grinder. Said protective hood securing device comprises a protective hood unit (14), having a protective hood (16), and a securing unit (18) having at least one securing element (20) which is provided together with the protective hood unit (14) for protection in the event of a tool (22) breakage. For this purpose, the securing element (20) is at least partially configured by a protective cover (24) that is provided in addition to the protective hood (16).

Abstract: A method of determining parameters for a burnishing operation includes: using a rolling burnishing element to burnish at least two segments on a selected surface of a material sample, the segments having a common width and overlapping each other by a preselected overlap value; measuring the resulting hardness of the surface; and selecting a working overlap value for a subsequent burnishing operation on a workpiece, based on the measured hardness.

Abstract: A tool and method for assessing whether a disk carrier, and especially a carrier for holding semiconductor disks, is properly dimensioned. The tool has a body that includes a socket in which a portion of the disk carrier will seat fully if the disk carrier is properly dimensioned. Alignment structures may be provided in the socket to align with features of the carrier to assist in determining whether the disk carrier is properly dimensioned. The socket may include two spaced apart cavities that correspond with end portions of walls of the disk carrier.

Abstract: A polishing solution, comprising copper ions and chloride ions in Cu/Cl molar ratio of 10?1 to 103 and at pH 0.5 to 10, is suited for polishing a surface composed of a nonferrous metal material such as copper or copper alloy. Thicker metal film can be polished at high removal rate, so that distribution in film thickness becomes uniform.

Abstract: A method and apparatus for comparing the flow rate through an orifice within a master part with the orifice within a workpiece by subjecting each orifice to an identical fluid at an identical temperature, under an identical pressure, and comparing the downstream pressures of the fluid exiting these orifices when the upstream pressure is constant or comparing the upstream pressure when the downstream pressure is constant. For purely measurement purposes, the fluid may be a non-abrasive media, however, in the event the workpiece orifice must be machined, it is possible to introduce a flowable abrasive media, and pass this media through the orifices until the desired pressure difference is achieved. With additional flow characteristics of the master part, it is also possible to calculate the flow rate through the workpiece orifice using only the pressure differential at the exits of the workpiece and the master part.

Abstract: A machine having a machine tool operatively connected thereto by manually manipulatable fastening members. A fastening member receiving and retaining device is adapted for placement beneath the machine tool for catching fastening members when inadvertently dropped. A device for temporary attachment to the machine or machine adjacent surface, and a flexible cable device are provided for connecting the fastening member receiving and retaining device to the for temporary attachment. The flexible cable device is adapted to be manually positioned and shaped and to retain its shape and position in a self-sustaining manner while holding the fastening member receiving and retaining device beneath the machine tool.

Abstract: In the polishing particles each having a core-shell structure, the polishing rate can be controlled by adjusting the thickness and/or density of the shell portion. The polishing particles having the core-shell structure with the average diameter (D) in the range from 5 to 300 nm, and the shell portion of the polishing particles comprises silica with the thickness (ST) in the range from 1 to 50 nm, and the density of the shell portion is in the range from 1.6 to 2.2 g/cc, while the Na content of the shell portion is less than 10 ppm.

Abstract: A chemical mechanical polishing slurry comprising an oxidizing agent, a complexing agent, an abrasive, and an optional surfactant, as well as a method for using the chemical mechanical polishing slurry to remove copper alloy, titanium, titanium nitride, tantalum and tantalum nitride containing layers from a substrate. The slurry does not include a separate film-forming agent.

Abstract: A concave recess (14) is provided in a member (10) that includes a portion offset from the recess (14) for use as a handle. The base of the recess (14) is provided with a concave abrasive surface (16). A projecting imperfection (18) on the surface of the golf ball (GB) is moved into the cavity (14) and against the concave abrasive surface (16). Then, the tool (10) is moved relative to the golf ball (GB) so that the abrasive material (16) will wear away the surface projection (18) on the golf ball (GB).

Abstract: A method of producing a substrate for an information recording medium in which there is a step of washing and drying the substrate, which is also subjected to precision polishing. In the method, a correlation is preliminarily obtained between a contact angle of water on a surface of the substrate before the washing/drying step and a size (height) of protrusions attached to the surface of the substrate during the washing/drying step. The contact angle of water on the surface of the substrate before the washing/drying step is controlled so that the protrusions have a size (1) so as not to cause a hit when at least a recording layer is formed on the surface of the substrate and when a slider provided with a recording device and/or a reproducing device is made to run on a surface of the information recording medium, and (2) so as not to cause an error upon recording and/or reproducing the information recording medium.

Abstract: This invention provides a chemical mechanical polishing slurry for polishing a copper-based metal film formed on an insulating film comprising a concave on a substrate, comprising a polishing material, an oxidizing agent and water as well as a benzotriazole compound and a triazole compound. The polishing slurry may be used in CMP to form a reliable damascene electric connection with excellent electric properties at a higher polishing rate, i.e., a higher throughput while preventing dishing.

Abstract: A method of lapping semiconductor wafers includes the step of transmitting sounds generated during the lapping process to a receiver, allowing the operator to use sound to more quickly detect problems associated with starting the lap process.

Abstract: An apparatus to induce very small bubbles of gas into a stream of deionized water without allowing large bubbles to be entrained is disclosed for use in Chemical Mechanical Polishing for semiconductor manufacture. The apparatus includes a cylinder possessing a central axis positioned vertically, a gas inlet, a deionized water inlet positioned essentially above the gas inlet, a deionized water with gas outlet positioned essentially above the deionized water inlet and a vent outlet positioned essentially above the deionized water with gas outlet. The apparatus introduces an essentially gaseous composition into the cylinder through the gas inlet into deionized water in the cylinder. The gas travels through the deionized water inlet to a level in the cylinder above the position of the deionized water with gas outlet, wherein the gaseous composition is further constrained to enter as bubbles with a predetermined size range in the deionized water through the deionized water inlet.

Abstract: A sanding block attachment for a jig saw including a block portion adapted for securement to the reciprocating blade of the jig saw. The block portion has a generally rectangular configuration. The block portion is defined by a long front face, a long rear face, a short top face, a short bottom face, and long opposed side faces. A sheet of sandpaper is removably secured to the long front face of the block portion.

Abstract: A system to smooth and radius a microhole in a workplace to calibrate the mircohole which comprises means for preconditioning a microhole with a liquid abrasive slurry at a first station, means for flowing a calibration fluid through the preconditioned microhole and means for flowing a slurry through the microhole for a predetermined time based on the flow rate of the calibration fluid.

Abstract: This invention relates to an improved apparatus and method for finish machining brake components. The apparatus includes an electrode ring adapted to be secured to a rotatable shaft. The electrode ring includes at least one plurality of circumferentially spaced apart electrodes adapted to be electrically connected to a power supply. Each one of the at least one plurality of electrodes are arranged adjacent each other around the circumference of the electrode ring. The apparatus further includes a positioning mechanism for positioning a rotating, electrically grounded rotor adjacent the electrode ring until sparks are formed between the electrode ring and the rotor. The sparks vaporize a portion of the rotor surface thereby creating a finished surface on the rotor having the desired dimensions.

Abstract: A tool for distributing electrically conductive particles, and optionally abrasive particles, on the surface of a male, electrical jack connector and a tool for distributing electrically conductive particles, and optionally abrasive particles, on the surface of a female, electrical jack connector which tools can be interfitted so that each acts as a removable cover for the other. The tools can simultaneously clean while distributing particles. A method for using each of the tools.

Abstract: The present invention relates to a grinding cup and a wear part for grinding of cutting inserts of a rock drill bit. The grinding cup is provided to be rotatably mounted in a grinding machine. The grinding cup is provided to perform grinding of cutting inserts of a rock drill bit. The grinding cup comprises a shank, a flush channel, and a wear part having a recess. The grinding cup has a center axis and is provided with vibration dampening means. The wear part is resilient in the grinding cup in at least the axial direction relative to the shank and the vibration dampening means forms contact surfaces with cooperating parts. The contact surfaces have substantially the same radial extension.

Abstract: A system and method for cleaning probe pins on a probe card used in testing a semiconductor device during fabrication thereof. A ceramic cleaning wafer is utilized to clean the probe pins without having to remove the probe card from a production line. The same apparatus used to test production wafers also handles the cleaning wafer during a probe cleaning cycle. During operation of the cleaning cycle, the cleaning wafer is placed in a manual load tray, which inserts the cleaning wafer into a prober machine. The cleaning wafer is transported by a robotic trolley to a prealign stage area where the cleaning wafer is aligned and centered. The cleaning wafer is then placed on a support device. The support device and cleaning wafer are positioned under a pneumatic sensor and profiled to determine wafer planarity. The support device and cleaning wafer are then positioned underneath the probe pins on the probe card to be cleaned.

Abstract: A method and kit which allows unskilled persons to prepare polished amber in a supervised or unsupervised environment. The method includes steps employing inexpensive materials and polishing compounds. The preferred polishing compounds comprise ingredients that are generally recognized as safe. The kit according to this invention contains components that will enable an unskilled person or child to polish amber using the method of this invention in supervised or unsupervised environments.

Abstract: A system and method for radiusing and sizing microholes in diesel fuel injectors. A liquid abrasive slurry with rheological properties is used. As the slurry approaches and flows through the microhole it is at a first lower viscosity. Subsequently, the slurry is characterized by a higher viscosity which enables the use of a floor meter in the slurry flow path which directly and accurately monitors slurry flow rate and mass flow in real time. This allows for individual slurry processing of nozzles to their specified flow race in a continuous process.

Abstract: The invention provides a process for recovering abrasive grains from vitreous bonded materials by boiling the material in an aqueous solution of an alkali metal base.