Abstract: A hand tool for extracting integrated circuit packs from printed circuit boards to which the pins of the pack have been soldered. The tool includes a pair of pivotable arms each of which carries an electrically heated tip. Each tip includes an inside face extending at a very slight angle to a plane bisecting the space between the faces and terminates in a bottom edge. The tool is arranged such that when the arms are moved toward each other the bottom edge of each tip clampingly engages and abuts the pins of a respective side of the pack at portions immediately adjacent to the printed circuit board solder joints but with the remaining inside surface of each tip remote from the remaining portions of the pins above the solder joints so that heat is applied to the pins at the joints but not appreciably to the circuit pack to effect the melting of the solder at the joints. Once the solder has melted the pack can be readily removed from the board.