Abstract: A stiffener sheet for flexible printed flexible printed circuit boards, includes alternately laminated polyimide layers and polyamideimide layers, wherein a molecular structure of the polyamideimide is represented by the following formula: wherein Ar and Ar? represents different substituted aromatic groups.

Abstract: A zero insertion force (ZIF) socket assembly comprises a ZIF socket and a pick-up cap. The ZIF socket includes a base, a cover, and a cam assembled to the base and rotated for driving the cover to move relative to the base between an opened position and a closed position. The pick-up cap is mounted to the ZIF socket and has a lock-up abutting against the cam for preventing the cam from rotating.

Abstract: A display device includes a main body, a display screen, an orientation sensing module and a display controlling module. The display screen is arranged on the main body for displaying an image in an original orientation. The orientation sensing module includes a first elongated chamber, a first capacitor, a second capacitor and a flowing medium received in the first elongated chamber. The display controlling module is configured for deviating the displayed image at a given angle clockwise or counterclockwise from the first orientation of the image in response to the change of the capacitance of the first capacitor or the second capacitor.

Abstract: A card edge connector includes an elongated housing with a pair of latches disposed at opposite ends thereof and defining a mating groove in the housing and between said pair of latches. A first wall and a second wall are formed at opposite sides of the mating groove, on which a plurality of conductive terminals are mounted. A key protrudes into the mating groove from the first wall with a distal end sinking into the second such that the second wall can be molded in an uninterrupted manner without the joint of the key.

Abstract: A molding apparatus includes a first mold half, a first mold core, a second mold half, a second mold core and a plurality of spacers. The first mold core is received in the first mold half and has a first molding surface. The second mold half includes a receiving cavity defined therein and a plurality of parallel grooves angularly equidistantly spaced from each other. The second mold core is received in the receiving cavity and has a second molding surface facing the first molding surface. The first and second molding surfaces are configured for cooperatively defining a molding cavity therebetween. The spacers are configured for being selectively disposed in the corresponding grooves. Each spacer is configured for being sandwiched between the second mold half and the second mold core. The spacers are configured for aligning the second molding surface with the first molding surface.

Abstract: A socket adapted for electrically connecting a semiconductor package to a printed circuit board, includes a main body defining a number of contact passageways and a plurality of contacts received in the contact passageways of the main body. Each contact has a base portion, a first contacting portion and a second contacting portion upwardly extending from the base portion, and a spring arm bent from a bottom edge of the base portion. The spring arm extends substantially in a horizontal direction and is bent downwardly at a free end thereof to form a tail. The spring arm can deform to provide an elastic force for the tail to press against the printed circuit board.

Abstract: An electrical receptacle is provided and includes an insulative housing defining a first receiving space and a second space in communication with the first receiving space and a plurality of contacts comprising audio contacts, power contacts and at least one grounding contact. The audio contacts and the at least one grounding contact are received in the first receiving space and establish a path for transmitting audio signals, while the power contacts are received in the second receiving space and corporate with the at least one grounding contact to establish a path for power supply.

Abstract: An electrical connector (100) for electrically connecting a Central Processing Unit (CPU) with a Printed Circuit Board (PCB), includes a base (2), a plurality of insulative layers (34), a plurality of contacts (4) and a plurality of cams (33). The base defines a cavity (21) and the insulative layers are stacked and received in the cavity. The insulative layers define a plurality of passageways therein. The contacts are received in the passageways of the insulative layers. The cams are rotatable around to push different insulative layers to have different degrees of movement in a predetermined direction.

Abstract: A socket, adapted for electrically connecting an IC package to a printed circuit board, comprises an insulative housing accommodating a plurality of contacts and a cover pivotally assembled on an end of the insulative housing. The insulative housing has two lateral sides and a base portion disposed between the lateral sides, and each lateral side is formed with two incepting portions on two opposite ends thereof. The cover has two fixing portions extending downwardly from two sides thereof and corresponding to the incepting portions of the insulative housing. When the cover rotates to a close position, the fixing portion of the cover directly latches the incepting portion of the insulative housing to prevent the cover from tilting.

Abstract: An electrical connector assembly (100) comprises an insulative housing (3), a plurality of contacts (2) received in the insulative housing (3) and a pick-up cap (1) assembled to the insulative housing (3), the contact (2) comprises a base portion (20), a contacting portion (21) extending upwardly from the base portion (20) and a rear portion (23) extending downwardly from the base portion (20), the pick-up cap (1) comprises a flat body portion (10), the body portion (10) comprises an upper surface (101) and a lower surface (102) opposite to each other, the lower surface (102) is supported by the insulative housing (3), a receiving space (1020) recesses from the lower surface (102), and the contacting portions (21) of said contacts (2) project beyond the lower surface (102) into the receiving space (1020).

Abstract: A lens module includes a barrel, a first lens, an annular retaining member and three driving devices. The retaining member is arranged in the barrel. The driving devices are arranged on the retaining member. Each of the driving devices has a base attached on the retaining member, a plurality of first electrodes formed on the base and a comb-shaped carrier. The carrier has a beam attached on the base and a plurality of second electrodes extending from the beam and suspended above the first electrodes at a first position. The first lens is carried by the second electrodes. When a first voltage is applied on the first electrodes and a second voltage is applied on the second electrodes, an electrostatic force is generated between the first electrodes and the second electrodes, and the second electrodes are moved down, such that the first lens is brought to a second position.

Abstract: A contact for a burn-in socket electrically connecting an IC package and a printed circuit board, comprises a first contact, a second contact and a spring disposed between the first contact and the second contact. The first contact and the second contacts have a same configuration, and each contact has a U-shaped actuating portion with two legs and a conductive portion extending from one of the legs. The first contact and the second contact are orthogonally assembled together, and the first actuating portion bestrides the second actuating portion to clasp with second actuating portion, so that the conductive portions have an offset therebetween.

Abstract: A cable connector assembly includes a cable (5) and a connector (100) terminated to the cable (5). The connector (100) further includes a connector body (20), a cover means (9) fastening the connector body (20) and connecting means (7) securing said cable (5) to the cover means (9). The connecting means (7) further includes an outer ferrule (73) having a first part (733) crimped onto the cable and a second part (731) crimped onto a shield (53) of the cable 5, and an inner ferrule (71) fastened substantially under the shield (53) to the outer ferrule (73) in the area of the second part (731) for making an axial locking between the outer ferrule (73) and the inner ferrule (71). The inner ferrule (71) forms a number of resilient tabs (719) flexibly abutting the cover means (9) thereby making firmly electrical connection to the cover means (9).

Abstract: A contact (1) for an electrical connector mountable on a substrate (3) having at least a via (311) therethrough comprises a medial portion (10), a contact engaging portion (121) extending from the medial portion (10), a solder terminal portion extending from the medial portion (10) in a direction away from said contact engaging portion (121) and includes at least a first spring arm (11) having a standing point (111), and at least an auxiliary foot (112) extending sideway from the first spring arm (11) having a distance with respect to the standing point (111), the contact engaging portion (121) is adapted to engage with a mating contact.

Abstract: A mold releasing method for releasing a core member from a mold includes steps of: a) providing a supporting member and arranging the supporting member on the mold, the supporting member comprising a base and a number of sidewalls extending from the base to the mold, a through hole being defined in the substrate and co-axially aligned with the core member; b) providing a bolt, the bolt comprising a threaded rod extending through the through hole of the substrate and threadedly engaged with the core member; and c) rotating the bolt to move the core member to disengage from the mold.

Abstract: A solar cell includes a back metal-contact layer, a P-type semiconductor layer, a P-N junction layer, an N-type semiconductor layer and a transparent electrically conductive layer. The P-type semiconductor layer is formed on the back metal-contact layer. The P-type semiconductor layer is comprised of nano particles of a P-type semi-conductive compound. The P-N junction layer is formed on the P-type semiconductor layer. The N-type semiconductor layer is formed on the P-N junction layer. The N-type semiconductor layer is comprised of nano particles of an N-type semi-conductive compound. The transparent electrically conductive layer is formed on the N-type semiconductor layer and functions as a front contact layer.

Abstract: An exemplary optical encoding disc includes a plurality of concentric annular tracks. Each track includes a plurality of coding units. Each coding unit includes a light converging portion and a light diverging portion. The light converging portions and the light diverging portions are arranged alternately along a circumferential direction of the optical encoding disc.

Abstract: A lens module includes a barrel and at least one lens. The barrel includes a cover with a hole defined therein and a hollow cylinder extending from the cover. The barrel comprises a cover with a hole defined therein and a hollow cylinder extending from the cover, and the cover comprises a roughened inside surface facing towards the hollow cylinder. The at least one optical lens is received in the barrel and comprises an optically active part and a peripheral optically non-active part around the optically active part, the optically non-active part comprises two opposite roughened surfaces.

Abstract: An electrical connector includes an insulative housing, a plurality of terminals secured in the housing, a metallic cover pivotally mounted to a rear end of the insulative housing and covering the insulative housing and at least one magnetic board lock secured at one side of the insulative housing and spaced with a distance from the rear end of the insulative housing. The at least one magnetic board lock assist to hold the cover by magnetic attractive force produced between the at least one magnetic board lock and the metallic cover on the insulative housing.