Abstract: A cooling apparatus and method of fabrication are provided for cooling one or more heat generating components. The cooling apparatus includes a heat sink structure and an airflow tube assembly. In one embodiment, the heat sink structure has a first surface for coupling to one or more heat generating components, and a second surface having at least one fin extending therefrom. The airflow tube assembly has at least one airflow tube which is sized to at least partially receive the at least one fin of the heat sink structure, wherein an annular airflow can be established between the at least one airflow tube and the at least one fin of the heat sink structure, thereby enhancing heat transfer from the heat sink structure to the airflow and cooling of the heat generating component(s).
Type:
Grant
Filed:
July 17, 2002
Date of Patent:
November 18, 2003
Assignee:
International Business Machines Corporation
Inventors:
Richard C. Chu, Michael J. Ellsworth, Jr., Robert E. Simons