Abstract: The frequency at which a multisystem log stream is compressed by a system of a multisystem environment is adjusted in real-time. The rate at which the multisystem log stream is compressed by the system is ascertained. That rate is relative to how frequently the multisystem log stream is compressed by other systems of the multisystem environment. The frequency with which the system compresses the multisystem log stream is then adjusted in real-time. Thus, the frequency at which one system of the multisystem environment compresses the log stream is relative to the frequency at which other systems of the multisystem environment are compressing the log stream.

Abstract: Impingement plate and jet nozzle assemblies are presented for use in cooling an electronic module. The assemblies include a thermally conductive plate having a first main surface and a second main surface with a plurality of concave surface portions formed in the second main surface extending towards the first main surface. Each concave surface portion has a conic section profile. A plurality of jet nozzles are disposed above the thermally conductive plate with each jet nozzle being aligned over a respective concave surface portion, wherein fluid introduced into a concave surface portion through the respective jet it nozzle impinges upon a lower portion thereof and flows outward along the concave surface portion. Each conic section profile is one of an elliptical section, a circular section, or a parabolic section.

Abstract: The complexity of networks (e.g., I/O configurations) is determined. An entropy index is calculated for a plurality of possible networks and from that set of possible networks, a network is selected. This network typically has less entropy or complexity than the other possible networks.

Abstract: Resolution of a compound name of an object may indicate that a disjunction exists within the object name. This disjunction represents a foreign binding indicating that the resolve cannot be completed on one system or an alias name of the object. When a disjunction in the object name is identified, the object associated with the disjunction is obtained. Thereafter, a resolve operation on that object is performed using at least a portion of the object name.

Abstract: A composed business object of a server instance is provided. The server instance is coupled to a plurality of resource managers using a container of the server instance. A data object corresponding to the business object is populated with data retrieved using the plurality of resource managers. Thus, a business object is composed of data from multiple and/or diverse resource managers using a single container.

Abstract: A method and apparatus for removing moisture from within an electronics enclosure is provided. In particular, dehumidification is accomplished by removing air from the enclosure, cooling the air thereby causing condensation of water vapor from the air, then heating the dehumidified air and returning the heated and dehumidified air to the enclosure. A single heat pump provides cooling and heating functions, effectively recouping heat extracted from the air to be cooled, and transferring the extracted heat to the air prior to its return to the enclosure. In this manner, electronics within the enclosure may be operated at temperatures below the dew point of ambient air surrounding the enclosure, without requiring a thermally insulated enclosure. Devices are provided to collect and purge condensate from the system, either in a continuous or periodic manner. Embodiments employing conventional vapor compression cycle heat pumps and thermoelectric heat pumps are described.

Abstract: An electronic module is provided having an integrated thermoelectric cooling assembly disposed therein coupled to the module's electronic device. The thermoelectric assembly includes one or more thermoelectric stages and a thermal space transformer, for example, disposed between a first thermoelectric stage and a second thermoelectric stage. The electronic device is mounted to a substrate with the thermoelectric assembly disposed in thermal contact with the electronic device and a thermally conductive cap is positioned over the thermoelectric assembly, and is also in thermal contact with the thermoelectric assembly. Power to the thermoelectric assembly can be provided using electrically conductive springs disposed between one or more stages of the assembly and pads on an upper surface of the substrate, which electrically connect to power planes disposed within the substrate.

Abstract: Syncpoint processing is performed for a distributed transaction. The distributed transaction includes a plurality of units of recovery, and syncpoint processing is performed for at least a portion of the units of recovery, without passing messages between the units of recovery of the at least a portion of the plurality of units of recovery. Instead, syncpoint processing (including transactional logging) is controlled by one syncpoint manager associated with one of the units of recovery, and that unit of recovery collects information representative of the other units of recovery.

Abstract: A capping structure and capping method are presented for an electronics package having a substrate and one or more electronics devices disposed on the substrate. The capping structure includes a capping plate sized to cover the electronics device(s) disposed on the substrate, and two or more force transfer pins. The force transfer pins are disposed between the capping plate and the substrate so that when a force is applied to the capping plate or the substrate, the force is transferred therebetween via the force transfer pins. Various capping plate and pin configurations are presented.

Abstract: Disclosed is a multilayer electronics packaging structure, especially for use in a multi chip module. By forming an overlap of signal conductors by the respective mesh conductors, an improved shielding effect is achieved and coupling between signal conductors is reduced. By increasing the via punch pitch such that multiple wiring channels are formed between adjacent vias, wirability is improved and the number of signal distribution layers may be reduced. The new structure thus shows improved electrical properties over the state-of-the-art structures, combined with a cost reduction of about 35%.

Abstract: Workload management of a computing environment is facilitated. A location service agent located within a server instance of the computing environment is used to facilitate workload management of the computing environment. The location service agent receives a request for an object of the computing environment. The location service agent then requests a workload manager of the server instance to determine which server instance of a plurality of server instances is to handle the request. The request is forwarded to the selected server instance using a direct reference.

Abstract: The frequency at which a multisystem log stream is compressed by a system of a multisystem environment is adjusted in real-time. The rate at which the multisystem log stream is compressed by the system is ascertained. That rate is relative to how frequently the multisystem log stream is compressed by other systems of the multisystem environment. The frequency with which the system compresses the multisystem log stream is then adjusted in real-time. Thus, the frequency at which one system of the multisystem environment compresses the log stream is relative to the frequency at which other systems of the multisystem environment are compressing the log stream.

Abstract: Cavity plate and jet nozzle assemblies are presented for use in cooling an electronic module. The assemblies include a cavity plate having one or more blind holes formed therein and one or more jet nozzles each configured to reside within a respective blind hole of the cavity plate. A lower surface of the blind hole and/or jet nozzle is curved to facilitate the flow of fluid from the blind hole after impinging upon the lower surface of the blind hole. Various jet nozzle configurations are also provided which employ pedestals or radially extending fins. Further, the radially extending fins may interdigitate with inwardly extending fins on the inner sidewall of a respective blind hole in the cavity plate. Methods of fabricating the cavity plate and jet nozzle assemblies are also presented.

Abstract: A thermal dissipation subassembly is provided for an electronic device. The subassembly includes a thermal spreader configured to thermally couple to a surface of a heat generating component of the electronic device. The heat generating component, e.g., an integrated circuit chip, has a non-uniform thermal distribution across the surface thereof between at least one first region of the surface and at least one second region of the surface, with the at least one first region having a higher heat flux than the at least one second region. The subassembly further includes at least one thermoelectric device aligned to at least a portion of each first region having the higher heat flux, wherein the at least one thermoelectric device facilitates dissipation of the higher heat flux. In one embodiment, one or more thermoelectric devices are embedded within the thermal spreader and thermally isolated therefrom.

Abstract: An object factory is registered under multiple interface names. The interface names have an inheritance relationship with an object implementation associated with the object factory. The names are registered in a repository of a name space, such as a Life Cycle Repository. Thus, an object factory can be located using any one of the interface names.

Abstract: A cooling system and method of fabrication are provided for cooling an electronics device. The cooling system includes a cooling unit and an evaporator plate having at least one isolated refrigerant loop therein for receiving coolant from the cooling unit. A thermal buffer unit having a phase change material therein is thermally coupled to the evaporator plate to maintain temperature of the evaporator plate within a predefined range for a period of time upon failure or shut down of the cooling unit. A thermal conductor structure, such as a metal foam structure and/or thermal transfer rods, is disposed within the thermal buffer unit to facilitate heat transfer between the phase change material and the evaporator plate.

Abstract: A thermal dissipation assembly is provided for an electronic device. The assembly includes a thermal spreader configured to thermally couple to a surface of a heat generating component of the electronic device. The heat generating component, e.g., an integrated circuit chip, has a non-uniform thermal distribution across a surface thereof between at least one first region of the surface and at least one second region of the surface, with the at least one first region having a higher heat flux than the at least one second region. The assembly further includes a thermal interface for attaching to the surface of the thermal spreader and aligning to contact a portion of the surface of the heat generating component when the thermal dissipation assembly is placed in contact therewith. The thermal interface is patterned to cover only a portion of the surface of the heat generating component to selectively thermally couple the thermal spreader to the surface of the heat generating component.

Abstract: Repositioning within an input/output device is accomplished without any knowledge of where the input/output device is currently positioned. The input/output device is repositioned to a predetermined position, in order for a program to be retried. The predetermined position is determined from a previously executed program. The previously executed program is scanned looking for commands. For each command found, a position identifier is adjusted based upon the type of command. When the scan and adjustments are complete, the position identifier represents the predetermined position used for repositioning the input/output device.

Abstract: Repositioning within an input/output device is accomplished without any knowledge of where the input/output device is currently positioned. The input/output device is repositioned to a predetermined position, in order for a program to be retried. The predetermined position is determined from a previously executed program. The previously executed program is scanned looking for commands. For each command found, a position identifier is adjusted based upon the type of command. When the scan and adjustments are complete, the position identifier represents the predetermined position used for repositioning the input/output device.

Abstract: Apparatus for cooling an electronic device, and a resultant fluid-cooled electronic apparatus are provided. In one embodiment, the apparatus includes a heat sink member with a surface for making thermal contact with the electronic device. The heat sink member has a first plurality of channels for carrying coolant fluid. The first plurality of channels are positioned in a first group and a second group such that coolant flow alternates across the member. The heat sink member further includes a second plurality of channels disposed above the first plurality of channels such that the first and second pluralities of channels comprise tiered channels. The second plurality of channels further includes a third group of channels and a fourth group of channels, wherein the third group of channels and fourth group of channels are positioned generally alternately across the member so that coolant flow also alternates direction therebetween.