Abstract: An in-floor multiple-service wiring device and, more particularly, a poke-through wiring fitting incorporating a novel flap cover assembly, and which fitting is adapted to be positioned in a floor aperture of a concrete building floor for the conductance of electrical power and telecommunication signals between the work spaces of multi-storied buildings. The flap cover assembly incorporates an upper cover plate consisting of metallic material, preferably such as brass or the like, and a lower cover plate, preferably constituted from a rigid molded plastic material and which is fastened to the upper plate member in surface contact with the rear face thereof.