Abstract: A radiation shielding structure including a radiation shielding panel which comprises a lead transparent plate, for example, a transparent lead acrylic resin plate, lead glass plate, etc., and a thin nonlead transparent plate, for example, a transparent acrylate resin plate, glass plate, etc., which is laminated on at least one side of the lead transparent plate. Thus, lead that is contained in the lead transparent plate shields radioactive rays, while the nonlead transparent plate, which is laminated on at least one side of the lead transparent plate, prevents oxidation of the lead in the lead transparent plate by air or chemicals, which oxidation would otherwise form an oxide film on the panel surface and make the panel opaque.

Abstract: A nuclear excitation laser type intra-reactor neutron flux measuring system of this invention is comprised of a laser oscillator filled with a nuclear exciting gas such as .sup.3 He, KrF or XeF, mounted on the tip of a control rod. The nuclear exciting gas is made into a plasma by the neutrons or the fragments of fissioned nuclei when the tip is positioned in the reactor core by raising the control rod. Since the nuclear exciting gas made into a plasma itself generates a laser beam or amplifies a laser beam projected from the outside, the behavior of neutrons can be monitored in detail after guiding this light response to the light processing system located outside, distinguishing the energies of neutrons from the spectrum and calculating the density and the flux of the neutron in each energy. Furthermore, the detecting sensitivity can be enhanced by forming the responsive membrane made of U.sub.3 O.sub.8 and so on, on the laser oscillator.

Abstract: A novel plastic molded chip carrier package for an integrated circuit chip has a carrier member molded of a plastic material to which are integrally embedded a plurality of I/O pins and a conductor member for interconnection between the terminals of the chip and the corresponding I/O pins to provide a unitary construction obtained at a single molding process. This plastic molded chip carrier package is preferred to have integral positioning studs which project in the same direction of the I/O pins for abutment against a printed circuit board for mounting the package in a spaced relation thereto with the I/O pins plugged into metallized through holes provided in the board.