Abstract: A device and method for improving and refining a shooter's skills has a laser or light beam, when the device is turned on, emitted from a laser diode or a light emitting diode to a collimating lens and through a hollow shaft, and to a prism being rotated by a shaft and motor. The beam is deflected in different directions so that a rapid rotation of the prism permits the beam to form a substantially circular reflecting image. The diameter of the image can be adjusted by adjusting an adjustable lens. When a shooter aims at a clay target, the shooter moves the gun barrel at a sweeping line of sight along a target flight path until the moving target intersects a point on the circumference of the substantially circular image for indicating to the shooter that a proper lead has been achieved for successfully shooting the moving target. Moreover, a receiver can be mounted on the housing for allowing an instructor to evaluate how well the shooter is performing.

Abstract: A floor panel disposed between a side sill and a center tunnel of a motor vehicle is constituted by a honeycomb panel having a honeycomb core which is sandwiched between an upper plate and a lower plate. The lower plate of the floor panel is formed integrally with a sill upper panel which defines the upper surface of the side sill and/or a tunnel panel which defines the upper surface of the center tunnel.

Abstract: Ultraviolet radiation process applies to manufacture semiconductor devices in order to enhance the thermal stability of the photoresist film on semiconductors wafers.A method of treating photoresist materials applied in order to enhance the thermal stability of the photoresist film on semiconductor wafer employing heating and ultraviolet irradiation, which meets the demand for improvement in heat resistance and plasma resistance of the photoresists. The initial heating temperature of the photoresist is set to be a little higher than the initial flow temperature, and the temperature of the photoresist is raised in proportion as the flow temperature of the photoresist is increased by exposing the photoresist to ultraviolet radiation and/or heating.