Patents Represented by Attorney, Agent or Law Firm Armstrong, Westernman & Hattori, LLP
  • Patent number: 6601629
    Abstract: A method for transferring a three-dimensional structure onto a substrate, which includes filling a plurality of concaves arranged on a sheet-form mold with a paste-like structural material, temporarily fixing the mold to a support member, contact-bonding the structural material in a state in which the structural material has the adhesion property or bonding property to the substrate together with the mold, releasing the temporary fixation of the mold by the support member after the contact-bonding, and removing the mold from the substrate, thereby transferring a three-dimensional structure onto the substrate.
    Type: Grant
    Filed: October 7, 2002
    Date of Patent: August 5, 2003
    Assignee: Fujitsu, Limited
    Inventors: Osamu Toyoda, Akira Tokai, Motonari Kifune, Keiichi Betsui