Abstract: A high density I/O flat pack electronic component is provided comprising a multilayer ceramic substrate having internal electrical conductors for electrically connecting I/O pads on the periphery of the component to a chip on the electronic component.

Abstract: The present invention relates generally to a new method of repairing electrical lines, and more praticularly to repairing electrical lines having an open at the module level with devices in place. Various methods and processes are used to repair this open or defective portion in an electrical conductor line. It could be repaired by securing a jumper wire or nugget across the open or the repair could be made by a deposition process, which includes but is not limited to filling the open with a solder type material or inserting a solder coated electrical wire and heating the solder and allowing the solder to melt and repair the open. One of the attributes of this invention is the ability to repair on a substrate or module on which active components such as chips, and passive components such as pins, capacitors, etc. have been attached. The invention also allows repair of fine line patterns which are normally not repairable by conventional techniques.

Abstract: An elastomeric connector for permanently or temporarily (for testing purposes) connecting area array chips without solder balls or wire bonds comprising an elastomer base material having through-hole conductors deposited therein, and surface conductor tabs which are electrically connected to the through-hole conductors deposited thereon. The surface conductor tabs have an overhanging contact region extending past the periphery of the through-hole conductors. Upon contact between the input/output pads of a chip and the overhanging contact regions of the elastomeric connector when aligned and biased towards each other, a requisite pressure causes a reactionary force by the elastomer base which facilites contact and automatic wipe. The elastomeric connectors may replace solder balls in chip connection applications, or may replace buckling beam test probe heads in chip test applications.