Abstract: The present invention describes an improved process for forming an aluminum or aluminum alloy plug in the fabrication of a semiconductor device. An opening is formed in a wafer. A titanium wetting layer is then deposited over the wafer and lines the sidewalls and bottom of the opening. A first aluminum deposition step is performed at a first power in a hot deposition chamber. A second aluminum deposition step is performed at a second higher power in a cold deposition chamber. The present invention forms the aluminum plug without the problems of void formation and without reaching temperatures that could cause damage to underlying layers during the fabrication process.

Abstract: A method of updating firmware between an imaging device and a host system is disclosed. The host system detects that the firmware on the imaging device is incompatible with a configuration of the host system. In response to detecting the incompatibility, an updated firmware image is transferred from the host system to the imaging device.