Abstract: The apparatus (4) manually operable with a tightening lever (16) has a cutting station (8), a tightening station (10) and a clamping station (12). The latter has a clamping arm (18) mounted on an eccentric shaft (20) and having a clamping shoe (40) through which the strip end (3) inserted in the strip channel (5) is clamped. The clamping shoe (40) is laterallly displaced with respect to the axis of the eccentric shaft (20) in the direction of the strip end (3) in the vicinity of a clamping nose (35) supported on the supporting face (36) of the apparatus casing (15). On lowering the clamping shoe (18) into the clamping positioning an additional clamping force on the clamping shoe (40) is exerted by the clamping nose (35) guided on the supporting surface (36).

Abstract: The present invention relates to a device for forming electric circuits on a lead frame, which has a plurality of process points in a row, each of which is provided with a semiconductor chip. During bonding, for achieving an optimum ultrasonic power transfer necessary for the electric connection of the semiconductor chip (8) to the connection fingers (5) of the lead frame, the individual lead frame (1) is located between a heated bearing element (19) and a correspondingly constructed holding plate (40). In the case of the device (50) according to the invention, the holding plate (40) provided for a contacting member (transducer) with a correspondingly constructed window-like recess (45) is movably mounted relative to the bearing element (19) about at least one axis (S) oriented in the longitudinal direction of the holding plate (40) on two spaced studs (35, 35'), each of which is arranged on a spring element (34, 34').