Abstract: A vacuum sealed package for a semiconductor chip, such as a micro-electromechanical (MEM) chip, is disclosed, along with a method of making such a package. In an exemplary embodiment, the package includes a ceramic substrate and a lid that together define a cavity wherein the chip is mounted. The substrate includes a conductive (e.g., metal) interconnect pattern that extends, at least in part, vertically through the substrate. I/O terminals are provided on an external surface of the substrate. A vent hole, at least partially lined with a metal coating, extends through the substrate into the cavity. A metal plug seals the vent hole. The vent hole is sealed by placing the package in a vacuum chamber, evacuating the chamber, and heating the chamber so as to cause a metal preform on the substrate to flow into the vent hole and form the plug.

Abstract: Stackable integrated circuit packages with pin and barrel interconnects are disclosed, along with methods of making such packages. In an exemplary embodiment, a package includes a molded plastic body, metal coated barrels on an upper side of the body, and metal coated pins on a lower side of the body. The pins are arranged coaxial with respective barrels. An integrated circuit is mounted on the upper side of the body. Metal traces electrically couple the integrated circuit to the barrels. Vias through the body electrically connect the metal coated barrels to respective metal coated pins. Two or more packages may be stacked and electrically coupled together by inserting the pins of a top package into the barrels of a lower package. The pins of the lower package may be soldered to a conventional printed circuit board, or may be mounted on a mounting substrate including corresponding metal coated barrels.

Abstract: Semiconductor packages and other electronic assemblies having an active heat sink are disclosed, along with methods of making the same. The active heat sink includes a cavity partially filled with a heat activated liquid. Heat generated during operation of a chip boils the heat activated liquid. The vapor condenses on an inner surface of the active heat sink and transfers heat to an outer, possibly finned, surface exposed to ambient to dissipate heat. In some embodiments, the active heat sink may be a closed vessel mounted on the chip. In some embodiments, the vessel of the active heat sink is formed from a die pad of a leadframe substrate. The die pad includes a recess that forms the active heat sink cavity when bonded to the back surface of the chip. The heat activated liquid directly contacts the back surface of the chip in these embodiments.