Patents Represented by Attorney Christopher M. Spietzer, Sr.

Find this attorney in the Justia Lawyer Directory

  • Wire loop and method of forming the wire loop
    Patent number: 8048720
    Abstract: A method of forming a wire loop is provided. The method includes: (1) forming a first fold of wire; (2) bonding the first fold of wire to a first bonding location to form a first bond; (3) extending a length of wire, continuous with the first bond, between (a) the first bond and (b) a second bonding location; and (4) bonding a portion of the wire to the second bonding location to form a second bond.
    Type: Grant
    Filed: January 30, 2008
    Date of Patent: November 1, 2011
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Dodgie Reigh M. Calpito, O Dal Kwon
  • Method of teaching eyepoints for wire bonding and related semiconductor processing operations
    Patent number: 7931186
    Abstract: A method of teaching an eyepoint for a wire bonding operation is provided. The method includes (1) selecting a group of shapes from a region of a semiconductor device for use as an eyepoint, and (2) teaching the eyepoint to a wire bonding machine using at least one of (a) a sample semiconductor device, or (b) predetermined data related to the semiconductor device. The teaching step includes defining locations of each of the shapes with respect to one another.
    Type: Grant
    Filed: March 13, 2007
    Date of Patent: April 26, 2011
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Michael T. Deley, Peter M. Lister, Deepak Sood, Zhijie Wang
  • Method and apparatus for forming bumps for semiconductor interconnections using a wire bonding machine
    Patent number: 7651022
    Abstract: The present invention is a method and apparatus for forming a bump for semiconductor interconnect applications, such as reverse wire bonding or stud bumping for flip chip interconnections. The bump is formed by (1) ball bonding at the bump site, (2) raising the capillary a predetermined height after forming the ball bond with the wire paying out of the capillary tip, (3) moving the capillary laterally a predetermined distance, preferably in a direction toward the site of other end of the wire loop, if the bump is to be used as the platform for a stitch bond of a wire loop, (4) raising the capillary further, and (5) moving the capillary diagonally downwardly and in the opposite direction of the first lateral motion. The wire is then severed by raising the capillary, closing the clamps and raising the capillary again to snap the wire pigtail off at the bump.
    Type: Grant
    Filed: April 11, 2007
    Date of Patent: January 26, 2010
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Stephen Babinetz, Takashi Tsujimura, Hiroyuki Ohtsubo, Yasuhiro Morimoto
  • Bonding tool with polymer coating
    Patent number: 7077304
    Abstract: A bonding tool for bonding a wire to a substrate. The bonding tool has a body portion, a working tip coupled to one end of the body portion, an orifice extending along a longitudinal axis of the body and the working tip, and a polymer coating disposed over at least a portion of a surface of the orifice.
    Type: Grant
    Filed: December 3, 2004
    Date of Patent: July 18, 2006
    Assignee: Kulicke & Soffa Investments, Inc.
    Inventors: Benjamin Sonnenreich, Sigalit Robinzon