Abstract: A process for wave soldering or reflow soldering comprises contacting substrates with a supply of molten solder containing from about 0.0001 to about 0.1% by weight of phosphorous in an atmosphere of diluent gas containing up to about 0.1% by volume oxygen. A reduced incidence of bridging and other soldering defects occurs.
Abstract: An impervious corrosion resistance nickel-chromium coating on a metallic substrate, such as an iron-containing alloy substrate that protects the substrate from a corrosive media and the process for producing the coating on the substrate.
Abstract: A sealed electrochemical cell having a secondary seal comprising a cylindrical sleeve disposed and secured around the upstanding wall of the cell's container, a second cover disposed on top of the cell's primary cover and a gasket compressed between the cylindrical ring and the cover forming said secondary seal.