Abstract: A wave soldering process and apparatus in which a localized low oxygen-containing atmosphere is provided at the point of contact of the solder wave and the substrate to be soldered by bubbling an inert gas through the solder wave.
Type:
Grant
Filed:
May 31, 1994
Date of Patent:
April 23, 1996
Assignee:
The BOC Group, Inc.
Inventors:
Harbhajan Nayar, Sean M. Adams, Neeraj Saxena, Bohdan A. Wasiczko