Patents Represented by Attorney Daid A. Draegert
  • Patent number: 5509598
    Abstract: A wave soldering process and apparatus in which a localized low oxygen-containing atmosphere is provided at the point of contact of the solder wave and the substrate to be soldered by bubbling an inert gas through the solder wave.
    Type: Grant
    Filed: May 31, 1994
    Date of Patent: April 23, 1996
    Assignee: The BOC Group, Inc.
    Inventors: Harbhajan Nayar, Sean M. Adams, Neeraj Saxena, Bohdan A. Wasiczko