Patents Represented by Attorney David A. Smith
  • Patent number: 6326402
    Abstract: The present invention is directed to a method for inhibiting viral replication and treating viral infections by administering a pharmaceutically effective amount of a compound capable of binding a microtubule such as a diiodo thyronine analogue having no significant hormonal activity. The present invention also features novel pharmaceutical compositions comprising the same.
    Type: Grant
    Filed: August 12, 1998
    Date of Patent: December 4, 2001
    Assignee: Octamer, Inc.
    Inventors: Ernest Kun, Jerome Mendeleyev
  • Patent number: 6171597
    Abstract: The present invention provides an AAV vector having a foreign DNA coding for a protein that boosts immunogenicity of cells. The invention also provides a vaccine containing such a vector and the use of both.
    Type: Grant
    Filed: May 5, 1999
    Date of Patent: January 9, 2001
    Assignee: Medigene AG
    Inventors: Gerhard Maass, Michael Hallek, Christoph Bogedain
  • Patent number: 6171818
    Abstract: The present invention relates to a protein having an anti-tumoral effect, a DNA encoding such a protein, and a process for the preparation of such a protein as well as its use.
    Type: Grant
    Filed: September 22, 1998
    Date of Patent: January 9, 2001
    Assignee: Bioxen Ltd
    Inventor: Christian Petzelt
  • Patent number: 5186633
    Abstract: There is disclosed a surface mount, circular DIN connector (10) with a housing (12) having a mating face (22) and a terminal receiving face (24). Three rows of terminal receiving cavities (1 to 8) open into the mating face (22) and the terminal receiving face (24). A set of electrical terminals (30) each has a mating portion (32) in a respective one of the cavities (1 to 8), a solder tail (36) extending substantially normally of the mating portion (32), and a connecting arm (38) connecting the mating portion (32) to the solder tail (36). The arms (38) are dimensioned relatively to offset the solder tails (36) with respect to the mating portions (32), in interleaved relationship to form a single row of solder tails (36) for soldering to respective contact pads arranged in a single row on a printed circuit board (20).
    Type: Grant
    Filed: September 3, 1991
    Date of Patent: February 16, 1993
    Assignee: AMP Incorporated
    Inventor: Benjamin H. Mosser, III
  • Patent number: D431729
    Type: Grant
    Filed: January 15, 1999
    Date of Patent: October 10, 2000
    Inventor: Robert David Smith