Abstract: An optical package is provide including a housing having first and second ends. A ferrule receiving bore is formed in the first end, and an optics cavity is formed in the second end. The optics cavity and the ferrule receiving bore are axially aligned with one another along an optical axis defined by the package. A mounting cap is inserted over the optics cavity and frictionally engages an outer surface of the housing. The end cap includes an endplate and a substrate having an optical device mounted thereon. The sleeve, focusing element and a mounting ring may be insert molded within the housing.

Abstract: A conductive via filler for printed wiring boards capable of reducing copper oxides and thereby eliminating a cleaning step in printed wiring board construction, the conductive via filler consisting essentially of silver flake, a resin, a hardener, and a titanate coupling compound. The filler or paste may further include one or more of a flexibilizer, a solvent, and/or an accelerator. It is a feature of the invention that extensive pre-cleaning of copper substrates is obviated.

Abstract: A small format optoelectronic package or device includes a non-electrically conductive substrate partially covered by an electrically conductive can. The electrically conductive can has a transparent element affixed to an aperture of the electrically conductive can. The electrically conductive can encloses and hermetically seals an optical diode, a monitor diode, and conductors between the electrically conductive can and the non-electrically conductive substrate. The non-electrically conductive substrate has three through-holes formed through a thickness of the non-electrically conductive substrate. The three through-holes are filled with an electrically conductive material so as to form three electrically conductive vias. Additionally, a surface of the non-electrically conductive substrate is organized into three regions. The first and third regions have the electrically conductive plating material applied thereto. The first through-hole protrudes through the first region.

Abstract: MT ferrule. A polymer fiber optic MT ferrule includes hermaphroditic L-shaped halves having multiple fibers mounted in V-grooves formed within surfaces of ferrule halves. Ferrule halves include holed walls perpendicular to the major surface of the V-grooves for providing alignment of the ferrule to guide pins of an MT receptacle having an alignment assembly and an alignment member mounted within the alignment assembly to provide for precision alignment.

Abstract: A module is provided for attaching to a flexible shielded cable including individual conductors. The module includes a die cast housing, a printed circuit board mounted within the die cast metal housing, a metal D-shell ribbon style host connector associated with the die cast metal housing, first and second apertures formed in the die cast metal housing, first and second guide tabs formed on the printed circuit board and arranged to protrude through the first and second apertures, and insulation displacement contact (IDC) connector header mounted within the die cast metal housing, and an insulation displacement contact (IDC) cover insert affixed to the die cast metal housing so as to engage individual conductors and forces the conductors onto the knife contacts of the IDC connector header when the two are brought together. The die cast metal housing having a base member and a cover. The module is hot pluggable.

Abstract: An optical package is provided including a housing having first and second ends. A ferrule receiving bore is formed in the first end, and an optics cavity is formed in the second end. The optics cavity and the ferrule receiving bore are axially aligned with one another along an optical axis defined by the package. A mounting cap is inserted over the optics cavity and frictionally engages an outer surface of the housing. The end cap includes an endplate and a substrate having an optical device mounted thereon. The ferrule receiving bore includes a longitudinal slot extending generally parallel to the axis of the bore providing radial flexibility to the outer wall. Additionally, a split sleeve is provided for accepting a fiber optic connector ferrule. The split sleeve being insertable and expandable in a ferrule receiving bore of an optical package housing. The split sleeve being retained in the ferrule receiving bore with an adhesive.

Abstract: A method and apparatus for injection molding of a fiber optic ferrule including the use of adjustable core and receiver members adjustable from the exterior of the mold to precisely locate a projecting wire member in a mold where a score pin defines an interior passage in the molded ferrule and the projecting wire forms a small diameter longitudinal hole in the ferrule communicating with an outer end of the interior passage so that the interior passage and small diameter hole are precisely located relative to the body of the molded ferrule.

Abstract: A massive parallel (MP) connector is provided which includes a fiber optic connector having a polymer female having multiple fibers mounted in V-grooves of the ferrule and beveled edges of the ferrule providing for alignment of the ferrule when the MP fiber optic connector is mated to a receptacle having an alignment assembly and an alignment member mounted within the alignment assembly to provide for precision alignment. A receptacle assembly is provided having a first receptacle half for receiving a fiber optic connector having a first form factor and a second receptacle half for receiving a fiber optic connector having a second form factor.

Abstract: A PCB package for shielding electromagnetic radiation from exiting or entering the package. In one embodiment the package includes first and second electrically conductive covers and first and second electrically conductive frames. The first frame electrically connected to the first cover and the second frame electrically connected to the second cover. The first frame is then electrically connected to the second frame. The first and second frames can be made of electrically conductive plastics or metals or any other electrically conductive materials. Methods of assembling the packages of the various embodiments are also set forth.

Abstract: A robust optoelectronic transceiver module which is quick, easy, and inexpensive to manufacture. The transceiver module has a main housing which consists of a circuit board having an optical subassembly mounted thereon. The module housing may be pluggable via a retention member received within the receptacle. The module and receptacle assembly may include grounding means such as a ground clip mounted within a gap provided between the module and a connector port of the receptacle to limit electromagnetic emissions.

Abstract: A transceiver socket for receiving a transceiver. The transceiver socket includes a pinboard and a retention ground clip. The pinboard has a first surface and a second surface. The pinboard further includes a first attaching post receptacle, a second attaching post receptacle, and a plurality of pin receptacles. Each of the receptacles has an opening on the first surface of the pinboard. Each of the opening being positioned relative to each other so as to receive the attaching posts and pins of the small form factor transceiver. The first attaching post receptacle, the second attaching post receptacle, and the pin receptacles each have a portion protruding from the second surface of the pinboard. The retention ground clip having first and second arms extending from a retention ground clip body.

Abstract: A hermaphroditic fiber optic termination device including a plug insert removably insertable into a front of a housing. The housing having locking holes. The plug insert formed so as to receive ferrules surrounding terminal ends of the optical fibers. The plug insert having spring latches, where each spring latches has a nub. The nub feature being designed so as to spring into the locking holes of the housing.

Abstract: The invention relates to an interface module, such as a Giga-Bit Interface Converter module, provided to mate within a host device chassis where, at the rear of the mounting slot, a first connector engages a host socket of the host device. According to the invention, the first connector include sequential mating contact traces on a contact beam of a substrate such that when the module is inserted into the corresponding host socket, certain contacts are connected in a pre-defined sequence such that a first set of contacts electrically engages prior to a second set of contacts which electrically engages prior to a third set of contacts. In further accord with the present invention, the first set of contacts includes grounding contacts, the second set includes contacts for powering the substrate and the third set includes signal contacts.

Abstract: A flat electrical cable is provided wherein the flat cable includes an upper layer having ribs protruding along its length and substantially parallel to one another, continuous substantially parallel and adjacent seams formed between and upper an lower insulator layer conductors between the upper and lower layer adjacent the seams and a pattern formed in the surface of the lower insulator layer. The present invention may have upper and lower polyester layers having copper conductors therebetween and the seams ultrasonically welded in order to provide flat electrical cable for various applications such as incorporation in an automobile clockspring.

Abstract: A robust optoelectronic transceiver module which provides for static discharge and is quick, easy, and inexpensive to manufacture. The transceiver module has a main housing which consists of a potting box with potting material inserted therein. In addition, a circuit board is encased by the potting material. The circuit board has an optical subassembly mounted thereon. The optical subassembly extends outside of the potting box through a recess. Correspondingly, a recess cover is provided for forming a liquid tight seal between the recess cover, the potting box, and the optical subassembly. Furthermore, the module provides electrically conductive latches which are conductively connected, via tabs for forming an electrical connection, to a grounded structure, such as a computer chassis.

Abstract: A flux gate inductor responsive to an external magnetic field produced by a rotating magnetoelastic sleeve and oscillating voltage applied to the flux gate inductor induces a field in the flux gate inductor, for inducing current flow through the flux gate inductor, which flows through a shunting resistor, creating a voltage which is triangular as a result of the inductance of the flux gate. The sum of the induced and external fields exceeds the saturation flux density of the flux gate, causing the flux gate inductance to zero. This results in a rise in the current through the flux gate inductor and a voltage spike across the shunt resistor. The spike is detected for causing a change in an inverter for producing the oscillation voltage. Meanwhile, the external magnetic field causes an asymmetry between positive, negative currents required to saturate the flux gate inductor. This asymmetry results in a departure of the oscillation voltage from a 50% duty cycle.

Abstract: A compressed air clockspring includes a housing and a hub rotatably mounted with the housing. The housing has a first electrical connector and a first pneumatic port. The hub has a second electrical connector and a second pneumatic port. A ribbon cable has one end connected to the first electrical connector of the housing and the other end of the ribbon cable is connected to the second electrical connector of the hub. An air ring is rotatably mounted in the housing. The air ring rotates with the hub. The air ring fluidically connects the first pneumatic port to the second pneumatic port. The ribbon cable transmits electrical signals from the crash sensor to the airbag as is common in present day clocksprings. Unlike present day clocksprings, the compressed air clockspring transmits compressed air through the rotary joint formed by the structure of the compressed air clockspring.

Abstract: An interface is provided, the interface having at least two form factors—one for interfacing to a connector on a fiber channel drive and one or more other form factors for interfacing to one or more other styles of connectors. The first form factor is on a first part of the printed circuit board and the others are on a second part of the printed circuit board. Further, the first part of the printed circuit board is on one side of the printed circuit board and the other part of the printed circuit board is on an opposite side. Further, one or more non-SCA connectors are mounted on a front side of a substrate for receiving one or more non-SCA style connectors and an SCA2 receptacle is mounted on the back side of the substrate for interfacing the non-SCA connector an SCA connector on a fiber channel cable. Further, the non-SCA2 connector can include a DB9 receptacle, a high speed serial data connector (HSSDC), or RJ-45. Further, the fiber channel drive can receive a media interface adapter (MIA).

Abstract: A holder for holding a leadless circuit element includes opposing flanges which can be bent downwardly for bending the flanges into hands and fingers for holding the leadless circuit element within a plastic mold. In still further accord with the device, the device includes an insert displacement connection integral to a frame for allowing the leadless circuit element to be included in a circuit. Further, the assembly is insert molded in plastic.

Abstract: A clockspring including a housing, a hub, and flexible printed wiring. The flexible printed wiring electrically connecting the hub to the housing. The hub mounted in the housing. The hub being able to rotate relative to the housing. The flexible printed wiring able to be affixed with components such as resistors, capacitors, inductors, and integrated circuits.