Abstract: The present invention provides a mixer for producing a paste by mixing components, comprising a housing having a longitudinal axis, a rear end, and a front end provided with a discharge opening; and a mixing chamber formed in said housing and having an entry side facing said rear end of said housing. The initial content of the mixing chamber is diverted from the discharge opening, and the subsequent content of the mixing chamber is extrudable from the discharge opening.

Abstract: Provided is a double-sided lapping carrier comprising a base carrier having a first major surface, a second major surface and at least one aperture for holding a workpiece, said aperture extending from the first major surface through the base carrier to the second major surface, wherein the base carrier comprises a first metal, the circumference of said aperture is defined by a third surface of the base carrier consisting of the first metal and, at least a portion of the first major surface or at least a portion of each of the first and the second major surfaces comprises a polymeric region, said polymeric region comprising a polymer having a work to failure of at least 10 Joules. Also provide are methods of lapping.

Abstract: To provide a detaching method capable of detaching a first substrate and a second substrate bonded together through a pressure-sensitive adhesive film, while minimizing the physical external load imposed on these substrates. A method for detaching a first substrate and a second substrate bonded together by a pressure-sensitive adhesive film comprising a pressure-sensitive adhesive polymer having dispersed therein a thermally decomposable metal hydroxide or metal salt hydrate filler, the method comprising a step of heating the pressure-sensitive adhesive film to a temperature capable of causing decomposition and dehydration of the metal hydroxide or metal salt hydrate, thereby accelerating the detachment.

Abstract: Provided is an electronic device comprising a thermally conductive sheet including a methacrylic polymer, a thermally conductive filler containing aluminum hydroxide in an amount of at least 10% by volume of the thermally conductive sheet, a combination of a phenolic antioxidant and a sulfur based antioxidant in an amount sufficient to impart thermal stability to the thermally conductive sheet, and a heat radiator.

Abstract: An electrode composition for a lithium ion battery having the formula SixSnqMyCz where q, x, y, and z represent atomic percent values and (a) (q+x)>2y+z; (b) q?0, (c) z?0; and (d) M is one or more metals selected from manganese, molybdenum, niobium, tungsten, tantalum, iron, copper, titanium, vanadium, chromium, nickel, cobalt, zirconium, yttrium, or a combination thereof. The Si, Sn, M, and C elements are arranged in the form of a multi-phase microstructure comprising: (a) an amorphous phase comprising silicon; (b) a nanocrystalline phase comprising a metal silicide; and (c) a phase comprising silicon carbide phase when z>0; and (d) an amorphous phase comprising Sn when q>0.

Abstract: A probe block assembly includes a block and a cable terminated to a coaxial connector that is configured to electrically communicate with a plurality of probes inserted in the block. The coaxial connector includes a connector signal contact configured to separably connect to a first probe that is insertable into an aperture of the block and insulated from the block, and a resilient ground beam configured to commonly ground one or more second probes inserted in the block.

Abstract: An electrode composition for a lithium ion battery that includes an amorphous alloy having the formula SixMyAlz where x, y, and z represent atomic percent values and (a) x+y+z=100, (b) x?55, (c) y<22, (d) z>0, and (e) M is one or more metals selected from the group consisting of manganese, molybdenum, niobium, tungsten, tantalum, iron, copper, titanium, vanadium, chromium, nickel, cobalt, zirconium, yttrium, and combinations thereof.

Abstract: Provided are adhesive compositions comprising a mixture of a maleimide terminated polyimide resin, a thermoplastic resin compatible with the maleimide terminated polyimide resin, a thermally activated free radical curing agent, and electrically conductive particles and/or scrim. Various embodiments add a silane coupling agent and/or an ethylenically unsaturated compound with acid functionality. Methods of using the compositions also are provided.

Abstract: Provided is a Fresnel lens for use with an array of semiconductor pixels that are separated by inactive areas, comprising a faceted surface with a plurality of facets for receiving an imaging beam, the facets being arranged into a plurality of zones separated by zone edges, and wherein the zone edges are generally aligned with the inactive areas throughout the array. Also provided are an optical detector and an imaging system incorporating such a Fresnel lens system.

Abstract: [Problem] To provide an adhesive sheet which is used for a light-emitting diode device, and which is free from cracks and peeling off of the adhered portions. [Means for Solving the Problem] An adhesive sheet for a light-emitting diode device, which comprises a thermoplastic polymer containing epoxy groups and a compound containing functional groups which are addition reactive with the epoxy groups or a polymerization catalyst which can effect a ring opening polymerization of the epoxy groups, and in which said thermoplastic polymer is cross-linked so that its flowability is restrained.

Abstract: Provided are an abrasive tool comprising abrasive particles having an average shape controlled to within a small range, and methods of providing such tools. Thus, a large number of abrasive tools will have very similar operating characteristics, and abrasive tools made at different times or through different methods also can have very similar operating characteristics.

Abstract: Provided is a laminated body (1) comprising a substrate (2) to be ground and a support (5), where the substrate (2) is ground to a very small thickness and can then be separated from the support (5) without damaging the substrate (2). One embodiment of the present invention is a laminated body (1) comprising a substrate (2) to be ground, a joining layer (3) in contact with the substrate (2) to be ground, a photothermal conversion layer (4) comprising a light absorbing agent and a heat decomposable resin, and a light transmitting support (5). After grinding the substrate surface which is opposite that in contact with the joining layer (3), the laminated body (1) is irradiated through the light transmitting support (5) and the photothermal conversion layer (4) decomposes to separate the substrate (2) and the light transmitting support (5).

Abstract: Provided is a thermally conductive composition which shows a low thermal resistance, and good releasability after service. For example, one composition includes an acrylic-based thermally conductive composition comprising a binder component containing a crystalline acrylic polymer with an alkyl group of 18 carbons or more and a thermally conductive filler.

Abstract: An article can include a protective core having two end portions. The article can include a number of support cores. Each support core can be positioned substantially adjacent each end portion of the protective core. The article can include a cold shrinkable material held in an expanded state over at least a portion of the protective core and at least a portion of each support core. The support cores, the protective core, and the cold shrinkable material can collectively be placed over an apparatus such that the cold shrinkable material tightens over a portion of the apparatus responsive to removing the support core from the cold shrinkable material.

Abstract: Provided are abrasive articles comprising a plurality of abrasive particles and a binder wherein the binder comprises a polymer formed by a reaction between a polyisocyanate and a polyoxirane, wherein the resulting binder is substantially free of urethane and urea linkages. Also provided is a method of making such an abrasive article.

Abstract: Provided are several polishing compositions useful for modifying a surface, such as a semiconductor wafer suitable for fabrication of a semiconductor device, especially when used in fixed abrasive planarization techniques. The polishing compositions include a synergistic mixture of water, an oxidizing agent, a complexing agent, and metal ions. Also provided are various methods of surface planarization.

Abstract: Provided is a flexible heat sink article comprising a base comprising a polymer and a plurality of polymeric protrusions extending away from the base, each protrusion having a major dimension and a minor dimension. The base comprises thermally conductive particles, and the protrusions comprise non-spherical thermally conductive particles substantially aligned in the direction of the major dimension within the protrusions. A thermal interface material may be provided contiguous with the base. Also provided is a flexible heat sink article comprising a base comprising a polymer and having a first surface and a second surface, a plurality of polymeric protrusions extending away from the first surface of the base, each protrusion having a major and a minor dimension, and a metallic layer contiguous with the second surface of the base, wherein the base and the protrusions comprise thermally conductive particles. Also provided is a method of making a flexible heat sink.

Abstract: The present invention provides an apparatus comprising a device and a mechanism for heat transfer comprising a hydrofluoroether heat-transfer fluid wherein the heat transfer fluid is represented by the following structure: Rf—O—Rh—O—Rf? wherein O is oxygen; Rf and Rf? are, independently, a fluoroaliphatic group, wherein each Rf and Rf? contain 1 hydrogen atom; Rh is independently a linear, branched or cyclic alkylene group having from 2 to about 8 carbon atoms and at least 4 hydrogen atoms, and wherein the hydrofluoroether compound is free of —O—CH2—O—. Another embodiment of the present invention is a method therefor.

Abstract: The present invention provides a heat-curable adhesive composition comprising ethylene-glycidyl (meth)acrylate copolymer, low density polyethylene, ethylene-a-olefin copolymer, and a heat curing agent for the ethylene-glycidyl (meth)acrylate copolymer.

Abstract: The present invention relates to a method for connecting an integrated circuit chip to a circuit substrate. The method includes the step of pre-applying adhesive directly to a bumped side of an integrated circuit chip. The method also includes the steps of removing portions of the adhesive from the tips of the solder bumps to expose a contact surface, and pressing the bumped side of the integrated circuit chip, which has previously been coated with adhesive, against the circuit substrate such that the bumps provide an electrical connection between the integrated circuit chip and the circuit substrate. The adhesive is removed from the tips of the solder bumps using a solvent assisted wiping action. The pre-applied adhesive on the chip forms a bond between the integrated circuit chip and the circuit substrate.