Abstract: An apparatus and method are disclosed for fabricating thin films for use in an active component of an integrated circuit by the use of an assembly line type process. A plurality of substrate stations are located on a platen which is rotated to move each station sequentially between a misted deposition device, a drying device, and a solidification device. The misted deposition device includes a mist showerhead in a movable housing. The mist showerhead separates a velocity reduction chamber from a deposition chamber.