Abstract: A fit-up turning roll system suitable for positioning cylindrical workpieces in alignment with other cylindrical workpieces is described. The workpiece rests upon a number of idler wheels which are mounted for free rotation upon eccentric shafts so that by rotation of the individual shafts, the workpiece is re-positioned.

Abstract: Sputtering apparatus is described in which a magnetic field is formed adjacent a planar sputtering surface, the field comprising arching lines of flux over a closed loop erosion region on the sputtering surface.

Abstract: A substrate or part holder is disclosed which allows rotation of at least two parts about their individual axes as well as rotation of all of the parts about a main axis. The part holder has a stub shaft for receiving each part, and a hollow housing attached to the end of a hollow shaft. An interior shaft is rotatable inside the hollow shaft and a central gear engages a gear on each stub shaft inside of the housing. Means are provided for mounting a part on each stub shaft outside of the housing. Rotation of the hollow shaft will cause rotation of all of the parts about the common axis, while any differential in rotation between the hollow shaft and the interior shaft will cause rotation of each part about the axis of the stub shaft to which it is attached.

Abstract: A composite superconductor having both filamentary and film conductors for carrying the pure and impure components of direct current, respectively, or for alternating current, is disclosed, together with a method of making it, and a preferred arrangement for its use in high power transmission lines.

Abstract: Power supply of the saturable reactor type is disclosed. The improvement is the inclusion of a variable impedance network, such as a pair of opposed semiconductor controlled rectifiers, in series with the current winding of the saturable reactor. Also included is an electronic circuit for changing the impedance of the variable impedance circuit, such as a control circuit for monitoring an operating parameter and for enabling or disabling the firing of the semiconductor controlled rectifiers in response to a change in the operating parameter. A preferred embodiment of the power supply also includes a transformer and a rectifier for supplying high-voltage, direct current to a sputtering apparatus.

Abstract: A composite multifilament superconducting structure is provided, which includes an elongated substrate-carrying, longitudinally-directed, sputtered discrete filament of an A-15 type intermetallic superconductor. In a preferable procedure, a plurality of spaced, generally longitudinal grooves are formed on the surface of an elongated filamentary substrate, preferably a metal wire. The walls of the grooves on the substrate surface are shaped to undercut the curvilinear surface of the substrate located between two adjacent grooves so that at least some of the wall portions of the grooves are geometrically shadowed during the subsequent sputtering step in which a superconductor is sputtered onto the substrate. In particular, a film of a suitable superconducting intermetallic compound having A-15 crystalline structure, such as Nb.sub.3 Ge, is thereupon sputtered onto the grooved substrate and deposits at the bottom of the grooves and at the surface portions of the substrate between grooves.

Abstract: A method of treatment of equipment used in critical gas handling applications includes flowing designated gases through the equipment and packaging the equipment in an inert atmosphere for shipment.

Abstract: A method is described for joining first and second surfaces by depositing a layer of metal on the first surface, preparing the second surface to expose fresh metal, placing the deposited metal and the exposed metal in contact, and applying sufficient pressure to join the surfaces, all done in a protective environment, such as vacuum. Also described is a related apparatus comprising an evacuable chamber, an electron-beam heated vapor source, and a pair of rollers for contacting and applying pressure to join the surfaces.

Abstract: An improved method is disclosed for coating substrates, such as turbine engine parts, at high rates by a physical vapor deposition process. The substrate to be coated and a vapor source, such as a metal alloy, heated by an electron beam, are placed in a chamber in which a gas pressure of greater than about 5 mT is maintained. When the source material is evaporated at a very high rate, such as greater than about 0.1 g/s or 13 g/s.m.sup. 2, the vapor is collimated and the collimation increases as the gas pressure or the evaporation rate increases. Collimation of the vapor allows a much higher deposition rate for a given evaporation power. Further, a much higher fraction of the evaporated material is deposited on the substrate. Despite the collimation, evaporated material deposits on areas of the substrate which are not in line-of-sight of the vapor source. If desired a substrate bias can be applied to bombard the substrate with ions before and during coating.