Abstract: A method and apparatus of electrical, mechanical and thermal isolation of superconductive magnet coils includes a superconductive magnet for environments wherein large differences of electrical potential between the interior superconductive winding and the exterior of the device, on the order of 103to 106 Volts may exist. The methods and apparatus also includes insulation, cooling, and structural elements such that the interior of the device is capable of maintaining cryogenic temperatures needed for superconductivity, even in the presence of high heat flux incident on the overall winding housing. Finally, a device includes structural elements for support against gravity and other forces exerted on the assembly that include expansion jointing and stabilization to minimize warping or bending of the assembly due to temperature gradients.

Abstract: An electrostatic chuck including a pedestal having a conductive upper surface; and a layer of plasma-sprayed material formed on the upper surface of the pedestal and defining a surface onto which a substrate is placed during use, wherein the plasma-sprayed material exhibits the Johnson-Rahbeck effect when a bias is applied between the substrate and the pedestal.

Abstract: A method of processing a disk-shaped substrate, or wafer, during a chemical vapor process includes a backside purge of the substrate with a purge gas. The backside purge is obtained by spinning the substrate about a central axis, directing a flow of the purge gas over the backside of the spinning substrate, and causing the purge gas to flow in an outward radial direction with the spinning substrate. An apparatus in a vapor processing system structured for conducting the backside purge includes a support mechanism structured and arranged to support the substrate and spin the substrate about a central axis, and a conduit coupled to a source of purge gas, structured and arranged to direct a flow of the purge gas over a backside of the substrate while the substrate is spinning such that the spinning substrate causes the purge gas to flow radially outward.