Abstract: The present invention describes an extraction device for removing components, such as leaded integrated circuit packages, from a printed circuit board to which their leads are soldered. The device, under operator control, is designed to captivate the component and to apply to it an extraction force which has a predetermined magnitude independent of the operator's judgment. Accordingly, when all of the component solder joints at the printed circuit board have been sufficiently reflowed, the device automatically withdraws the component from the board into itself. Damage to the board or the component as a result of the extraction process is virtually eliminated through the use of the device.

Abstract: An encoder/decoder is described which allows data transmission on an A.C. coupled transmission system. The encoder converts a serial data stream comprised of combinations of logical "1"'s and "0"'s in an NRZ format to an output pulse train. The latter is characterized not only by phase reversal for each bit of data, as required for A.C. coupled systems, but by bit durations which are dissimilar for a logic "1" and "0". The encoded data is transmitted and subsequently applied to the decoder which restores the data to an NRZ format, and provides a corresponding series of clock pulses for interpreting the data. The encoder/decoder may be implemented in a simple logic configuration.

Abstract: The present disclosure describes a universal leadless chip carrier mounting pad layout for an interconnection medium such as a printed circuit board, which accommodates a wide range of chip carrier sizes. Thus, there is eliminated the traditional method of providing custom pad layouts homologously configured as to numbers of pads and their arrangement, in specific chip carriers. The universality of the present pad layout makes it especially desirable for prototype designs, and integrated circuit chip "burn in" and test procedures.

Abstract: The present disclosure describes a low insertion force connector for use with integrated circuit (IC) packages of the LSI/VLSI type. The connector is characterized by simplicity of design and economy of manufacture. The well known friction-type contact comprised of members which enclose and bear against the pin surface is replaced by a pin-receiving cup loosely fitted in a cavity in the connector body and supported by one extremity of a light spring member. The opposite extremity of the latter may include an integral tail section or a separate solder or wire wrap tail may be affixed thereto. The force required to seat the IC package in the connector is a function of the spring compressive forces and may be made quite low. Removal force for the package is virtually zero. Additionally, a ramp section in the connector is adapted to receive a wedge-like member which bears against the outer surface of the IC package and causes the gradual collapse of the contact springs as the package is seated.

Abstract: The present disclosure describes an hermetically sealed integrated circuit package capable of accommodating high density circuit configurations with their attendant high power levels. In performing this function, the package permits the back-bonded integrated circuit chip or die to be mounted to a thermally conductive member of the package which is disposed in an open air stream. Moreover, the opposite side of the package positioned in proximity to the interconnection medium remains available to be fully populated by a large number of closely spaced input/output pins.

Abstract: The present disclosure describes a dressing finger assembly of advanced design for use on automatic wiring machines. Such machines make solderless wrapped electrical connections on pluralities of planar disposed terminals. A dressing finger is employed to form predetermined wire patterns in conjunction with a wrap tool which makes the actual connection. It has been observed that the design of dressing fingers used in present day machines is such that the insulation of the wire being wrapped may be pinched and cut, thereby necessitating its replacement to avoid electrical shorting. In accordance with the present invention, the assembly comprised of a newly designed finger and supporting guide, provide the required retention and support of the wire during wrapping while eliminating the aforementioned damage to the wire.

Abstract: In accordance with the present disclosure, the conventional metal backplane utilized for mounting and interconnecting electronic components is reinforced to increase its rigidity and permit its acceptance of a large number of closely spaced electrical contacts without excessive deformation when accepting the mating contacts. Such reinforcement is achieved in a manner which does not sacrifice the obstruction free area on the backplane required for terminal interconnection as might be performed by wire wrap techniques or a printed circuit backplane.