Abstract: An apparatus for dissipating heat generated by an electronic device and a method for mounting the apparatus to an electronic device are disclosed. The apparatus includes a heat transfer body which is mounted in proximity to an electronic device. In addition, the apparatus includes an adhesive distributed on the heat transfer body, which affixes the heat transfer body in proximity to the electronic device. The adhesive is distributed on the heat transfer body such that heat transfer from the electronic device to the heat transfer body occurs substantially independently from the adhesive. The apparatus further includes a thermally conductive material disposed between the electronic device and the heat transfer body. The thermally conductive material is selected to maximize heat transfer from the electronic device to the heat transfer body.

Abstract: A method and system for managing logical links between document components within a presentation data stream which includes a continuous ordered stream of uniquely identified data objects and associated elements. The processing of presentation form documents has been extended from hard copy devices into interactive presentation forms which accommodate sophisticated navigation techniques such as hypertext. In order to accommodate this process a link logical element (LLE) is defined within the document presentation data stream which identifies a source component and a target component for a logical link. Multiple purpose links which provide navigational linkage, annotational linkage and append linkage are provided and the link logical element further includes a field which specifies the purpose of a particular link. Optional fields are also provided which may be utilized to pass parameters to the target component upon processing the link.