Patents Represented by Attorney Finnegan, Henderson, Farabow, Garrettt and Dunner, L.L.P.
  • Patent number: 8002531
    Abstract: Forming equipment having carriages carrying lower molds that can improve the quality of a molded product by fixing a carriage carrying the lower mold at the forming station when forming is carried out. The equipment includes a forming press that molds thermoplastic sheet material H with a upper mold MU and lower molds MR, ML, wherein the equipment has two carriages TR, TL, each carrying a lower mold, which carriages can move to and from a position opposite to the upper mold at a forming station S, a carriage transport mechanism A that transports the two carriages independently by driving motors attached to each carriage, a carriage guide mechanism B having a pair of rails extending perpendicular to a pressing direction of the forming press, and a positioning device C to determine the position of a carriage at the forming station that engages with the carriages.
    Type: Grant
    Filed: November 26, 2008
    Date of Patent: August 23, 2011
    Assignee: Sintokogio, Ltd.
    Inventors: Hiroshi Abeta, Atsushi Suzuki
  • Patent number: 6079466
    Abstract: A method for preventing air permeation from a pneumatic tire wherein there is arranged inside the tire an air permeation preventive layer formed of a thermoplastic resin film produced by mixing and extruding at least two thermoplastic resins which are incompatible with each other, the film having a matrix phase of a first of the resins in which there is dispersed a dispersed phase having an oriented lamellar structure and formed of a second of the resins, wherein the ratio of melt viscosity of the second resin to that of the first resin at the molding temperature of the incompatible thermoplastic resins is preferably 1.5 to 20.
    Type: Grant
    Filed: March 13, 1996
    Date of Patent: June 27, 2000
    Assignee: The Yokohama Rubber Co., Ltd.
    Inventors: Jiro Watanabe, Tetsu Kitami
  • Patent number: 5770300
    Abstract: A metallic printed board is formed by laminating an insulation layer on the surface of a metallic sheet as a base, and then electronic parts are mounted on the conductor pattern formed on the surface of the insulation layer. A double-sided printed board mounted thereon electronic parts is placed in parallel. Both the printed boards are supported and fixed monolithically by filling the space between the printed boards with an insulation resin and curing the resin. Furthermore, an insulation resin is laminated on the surface of the printed board in such a manner that the resin may cover the mounted electronic parts, and cured. The heat generated from the electronic parts can be efficiently transmitted to the insulation resins by using a resin having a high thermal conductivity for both of the insulation resins, and the heat is then emitted from the surfaces of the metallic sheet or the insulation resin.
    Type: Grant
    Filed: December 3, 1996
    Date of Patent: June 23, 1998
    Assignee: Fuji Electric Co., Ltd.
    Inventors: Kenji Okamoto, Yukio Nakajima, Kazuhiko Imamura, Takao Ichihara