Abstract: An improved web splicing apparatus that permits better handling of rolls of paper and other materials and the automatic splicing of the beginning of one roll of paper onto the approximate end of a second roll of paper without discontinuing the flow of paper to the utilizing device and without the use of core shafts. The apparatus utilizes two opposed pairs of independently controlled and positioned web roll support arms which are pivoted about spaced shafts and rotatably support cores of the paper rolls. This invention also allows sequential splicing of rolls having unequal web widths. This configuration also allows the right and left roll support arms to move the rolls upward in an overlapping path from a single loading position, thus providing a machine having considerably reduced dimensions and floor-space requirements. Another aspect of this invention is the automatic ejection of depleted roll-cores.

Abstract: A packaged electronic circuit using molded plastics, Thick Film, and Polymer Thick Film technology, and achieving shielding of the circuitry and components of the package. In this invention at least one of electronic devices in the package is supported in a molded pocket in the molded substrate, and circuit traces are added to the surface of the substrate and the electronic device, simultaneously creating the circuit traces and making the interconnections with the components at the same time. Shielding, which is optional, can easily be printed over the planar surface of the circuit traces and components.

Abstract: An improved way of preparing packaged electronic circuitry using molded plastics, Thick Film, and Build Up Technology, and achieving shielding of the circuitry and components of the package. In this invention at least one of the electronic devices in the package is supported in a molded pocket in the molded substrate, and using Build Up Technology circuit traces are added to the surface of the substrate and the electronic device, simultaneously creating the circuit traces and making the interconnections with the components at the same time. Shielding, which is optional, can easily be printed or plated over the planar surface of the packaged circuit traces and components.

Abstract: An improved way of preparing packaged electronic circuitry using molded plastics, ceramic Thick Film technology, and Polymer Thick Film technology. In this invention at least one of the electronic devices in the package is supported in a plastic molded substrate, and the circuit traces area added to the surface of the electronic device.

Abstract: An improved, multipass, horizontal rotating continuous feed digester provides an efficient aerobic digestion process for sewage, and which also reduces pollution. The improved digester promotes the ecology in that the gas and air feed and exhaust means are located at opposite ends of the digester. Moreover, the air and gas distribution means can be easily removed from the digester for inspection and cleaning.

Abstract: Disclosed are small particles of cellulose which are useful for liquid chromatography supports, and the like. Disclosed are methods for making small, substantially spherical bodies with a near complete absence of irregularities, holes, cracks, and the like. This is made possible by a new process wherein the coagulation of viscose is carried out before any regeneration is allowed to begin. This method is of general utility applying also to the production of rayon fiber and cellophane film.