Abstract: A data protection device for an interconnect network on chip (NoC) includes a header encoder that receives input requests for generating network packets. The encoder routes the input requests to a destination address. An access control unit controls and allows access to the destination address. The access control unit uses a memory to store access rules for controlling access to the network as a function of the destination address and of a source of the input request.

Abstract: A digital radio frequency (RF) modulator provides modulation for base-band TV signals. The RF modulator provides direct conversion of digital base-band audio and video signals to a desired RF channel frequency, without any analog up conversion. The RF modulator includes an audio module, a video module, and a RF converter. The audio module includes a pre-emphasis filter, a multi-stage audio interpolator and a complex frequency modulator to generate frequency modulated (FM) audio signals. The video module includes a complex VSB filter, a group-delay compensation filter and some processing logic to generate a filtered output video signal. The RF converter includes a complex adder, a complex multiplier and a RF interpolator to construct the base band TV signals and to shift the base band TV signals in a frequency domain to the desired RF channel frequency. The exponential video carrier is generated at baseband and has a frequency whose value is in the range of +/?13.5 MHz.

Abstract: A low pin interface module is provided for testing an integrated circuit. The interface module includes an input-output module, a controlling module, a processing module and a storage module specific to the integrated circuit to be tested. The interface module reduces the required number of hardware pins in the integrated circuit for a standalone testing without limiting the integrated circuit testing features. A methodology and a control mechanism achieved with the interface module can be used for the standalone testing of any integrated circuit without using a Joint European Test Action Group test logic interface JTAG implemented following the IEEE Standard 1149.1-1990. The interface module is not limited by a particular debugging platform and allows access to all test features in the integrated circuit with a reduced number of hardware pins and thereby leading to enhanced testing speeds on a tester in parallel and a shorter time-to-a market cycle and a lower development cost.

Abstract: A back EMF signal from PWM driven motor is passed through an attenuation circuit. The attenuation circuit has a first mode of operation and a second mode of operation. The first mode of operation, used to sample a higher voltage back EMF signal during PWM on-time, applies the back EMF signal to a resistive divider formed of a first resistor and second resistor connected in series. The second mode of operation, used to sample a lower voltage back EMF signal during PWM off-time, applies the back EMF signal to a circuit comprised of a transistor conduction path in series with the second resistor. A control signal, responsive PWM on-time and off-time state, controls switching between the first and second modes.

Abstract: A swivel coupling is provided for connecting a multi-piece restraint having two trapezoidally shaped segments capable of rotating with respect to each other. Each segment includes rectangular and multiple cylindrical portions with one being orthogonal to the segment and having an orifice for receiving a connecting means to join the segments. In another embodiment, one segment is joined to an attachment having a hook that includes a base portion and a hook portion where the base portion includes an orthogonal cylindrical portion having an orifice for receiving a connecting means that extends through the orifice and through the second orifice of the segment.

Abstract: A method, system, and computer program product for automatically recognizing employee achievements via enterprise e-mails is provided. In one embodiment, an enterprise e-mail server receives an e-mail from a sender within the enterprise. The enterprise e-mail server generates a recognition link to a dynamically generated web page, wherein the web page lists recognitions/awards information for the sender. The enterprise e-mail server also generates an icon link for an icon representing recognitions/awards received by the sender and appends the recognition link and the icon link into the e-mail. The e-mail with embedded web page and icon link is then relayed to the e-mail recipient.

Abstract: Metal contacts are self-positioned on a wafer of semiconductor product. Respective placement areas for a metal contact are determined by a selective deposition of a growth material over a region of the substrate surface (for example, through epitaxial growth). The growth material is surrounded by an insulating material. The grown material is then removed to form a void in the insulating material which coincides with the desired location of the metal contact. This removal of the grown material exposes the region on the substrate surface. Conductive material is then deposited to fill the void and thus form the metal contact directly with the region of the substrate surface.

Abstract: The present invention provides an audio streaming system and method for transmitting audio signals with high quality. The advantages of the present invention include easy implementation, computational efficiency, and provision of better audio quality. More particularly, the present invention provides a Multi-band Time Expansion algorithm for lost packet concealment. The Multi-band Time Expansion algorithm detects the number of continuously lost packets in an audio input signal and the correctly received packets on either side of the lost packets. Then the Multi-band Time Expansion algorithm time-expands the correctly received packets that may be from either one side or both sides of the lost packets, wherein the correctly received packets are stretched to cover the length of the lost packets. Finally the Multi-band Time Expansion algorithm overlap-adds the stretched packets so that the lost packets are concealed.

Abstract: A chip scale package (CSP) device includes a CSP having a semiconductor die electrically coupled to a plurality of solder balls. A can having an inside top surface and one or more side walls defines a chamber. The CSP is housed in the chamber and is attached to the inside top surface of the can. A printed circuit board is attached to the solder balls and to the one or more side walls to provide support to the CSP and to the can. The CSP may be a Wafer-Level CSP. The can may be built from a metallic substance or from a non-metallic substance. The can provides stress relief to the CSP during a drop test and during a thermal cycle test.

Abstract: A frequency shift of a carrier frequency of an input signal is estimated with a frequency estimator in order to obtain an estimate value. Then, the estimate of the frequency shift is refined, and the carrier frequency is corrected in consequence, with a phase-locked loop that is initialized with the estimate value. The phase-locked loop has a locking frequency range that is narrower than a locking frequency range of the frequency estimator.

Abstract: A method for recovering an authorization code which is assigned to a licensee by a licensor and is stored in an access-protected data processing device that is connected to a computer of said licensee via an interface. A backup file which is part of the authorization code and contains the license parameters is stored on the licensee's computer. The license parameters associated with the licensor are read out of the backup file, the license parameters are sent to the respective licensor, authorization codes corresponding to the received license parameters are recovered at the level of the licensor, the recovered authorization code is then returned to the licensee's computer, and the recovered authorization codes are stored in the data processing device connected to the licensee's computer.

Abstract: A high mast lighting system, comprising a mast, a pole plate disposed within the mast and a winch assembly coupled to the pole plate, wherein at least a portion of the winch assembly extends through an opening in the pole plate.

Abstract: A broadband weak-motion seismometer includes: a frame, a mass, a suspension means for movably connecting the mass to the frame, a sensing transducer for measuring displacement of the mass with respect to the frame and for generating a sensing transducer output signal, which is a function of the measured displacement, a forcing transducer for applying a feedback force in a predetermined direction to the mass, and a control circuit. The control circuit receives the sensing transducer output signal and generates a forcing transducer input signal that includes a self-noise component. The forcing transducer input signal is processed by the forcing transducer to apply the feedback force to maintain the mass at rest with respect to the frame. The feedback force is sufficient to counterbalance a constant acceleration of the frame of at least 0.2 m/s2 in the predetermined direction of the feedback force.

Abstract: Silicon-based single-crystal portions are produced on a surface of a substrate, selectively in zones where a single-crystal material is initially exposed. To do this, a layer is firstly formed over the entire surface of the substrate, using a silicon precursor of the non-chlorinated hydride type, and under suitable conditions so that the layer is a single-crystal layer in the zones of the substrate where a single-crystal material is initially exposed and amorphous outside these zones. The amorphous portions of the layer are then selectively etched so that only the single-crystal portions of the layer remain on the substrate.

Abstract: A system on chip (SoC) has a digital domain. An adaptive voltage/frequency scaling circuit includes a critical path replica circuit with respect to that digital domain. The critical path replica circuit generates a margin signal, and the adaptive voltage scaling circuit responds to the margin signal by decreasing bias voltage (and/or increasing clock frequency) applied to the digital domain of the system on chip so as to recover available margin. A fail-safe timing sensor is included within the digital domain of the system on chip. The timing sensor generates a flag signal when timing criteria within the digital domain are violated. The adaptive voltage scaling circuit responds to the flag signal by increasing the bias voltage (and/or decreasing the clock frequency) applied to the digital domain of the system on chip so as to implement a recovery operation.

Abstract: An integrated electronic circuit has a thin layer portion based on hafnium oxide. This portion additionally contains magnesium atoms, so that the portion is in the form of a hafnium-and-magnesium mixed oxide. Such a portion has a high dielectric constant and a very low leakage current. It is particularly suitable for forming a part of a gate insulation layer of a MOS transistor or a part of a MIM capacitor dielectric.

Abstract: An electronic circuit includes several (at least two) oscillating and/or resonant devices. The circuit uses a measuring device to measure the phase noise of one of the two oscillating/resonant devices. This measuring device is integrated on a chip on which the oscillating/resonant device to be measured is also integrated. The circuits and methods described find application in the area of radiofrequency/high frequency electronics RF/HF, in particular adapted to general public applications in mobile communication systems and/or to metrology.

Abstract: A WLAN communication system and algorithm that adaptively changes the data transmission rate of a communication channel based on changing channel conditions. The WLAN communication system or algorithm has two modes being a searching mode and a transmission mode. Furthermore, the WLAN communication system or algorithm incorporates an additive increase, multiplicative decrease (AIMD) function into the rate adaptation algorithm.

Abstract: A method for fabricating electrical bonding pads on the electrical contact areas of a wafer includes producing first blocks made of a solder material, producing second blocks made of a solder material on these first blocks, and passing the blocks through an oven so as to shape the blocks into approximately domed electrical bonding pads.

Abstract: Instruments and methods for reducing and stabilizing bone fractures are presented. One method provides for cutting a portion of a bone having a fracture to create a cavity, wherein the cavity is substantially axisymmetric, and expanding the volume of the cavity thereby reducing the fracture. The fracture may be further reduced and/or stabilized by adding a material, such as an implant, in-situ curable material and/or in-situ hardenable material.