Abstract: In one embodiment, the present invention relates to a bonded assembly made of a magnesium containing metal comprising at least about 25% by weight magnesium, a thermoplastic elastomer, and an adhesive between the magnesium containing metal and the thermoplastic elastomer, the adhesive comprising from about 20% to about 99% by weight of a polymeric material.

Abstract: In one embodiment, the present invention relates to a substrate for an electrical device including a coating, wherein the coating comprises an oxygen plasma resistant polymer prepared from a mixture containing a polymerization material and a polycondensation product of a partially hydrolyzed chelated metal oxide precursor. In another embodiment, the present invention relates to a component for an electrical device comprising an oxygen plasma resistant polymer prepared from a mixture containing a polymerization material and a polycondensation product of a partially hydrolyzed chelated metal oxide precursor. In yet another embodiment, the present invention relates to a microelectronic device comprising an oxygen plasma resistant polymer prepared from a mixture containing a polymerization material and a polycondensation product of a partially hydrolyzed chelated metal oxide precursor.

Abstract: In one embodiment, the present invention relates to a substrate for an electrical device including a coating, wherein the coating comprises an oxygen plasma resistant polymer prepared from a mixture containing a polymerization material and a polycondensation product of a partially hydrolyzed chelated metal oxide precursor. In another embodiment, the present invention relates to a component for an electrical device comprising an oxygen plasma resistant polymer prepared from a mixture containing a polymerization material and a polycondensation product of a partially hydrolyzed chelated metal oxide precursor. In yet another embodiment, the present invention relates to a microelectronic device comprising an oxygen plasma resistant polymer prepared from a mixture containing a polymerization material and a polycondensation product of a partially hydrolyzed chelated metal oxide precursor.

Abstract: In one embodiment, the present invention relates to metal oxide sols comprising a liquid and a polycondensation product of about 2 to about 5,000 monomers of a partially hydrolyzed chelated metal oxide precursor. In another embodiment, the present invention relates to a process for making a metal oxide sol comprising contacting a metal oxide precursor with a multifunctional compound in a liquid to provide a chelated metal oxide precursor; contacting the chelated metal oxide precursor with a hydrolyzing agent to provide partially hydrolyzed chelated metal oxide precursor monomers; and permitting the partially hydrolyzed chelated metal oxide precursor monomers to polycondense thereby forming a metal oxide sol.

Abstract: In one embodiment, the present invention relates to a substrate for an electrical device including a coating, wherein the coating comprises an oxygen plasma resistant polymer prepared from a mixture containing a polymerization material and a polycondensation product of a partially hydrolyzed chelated metal oxide precursor. In another embodiment, the present invention relates to a component for an electrical device comprising an oxygen plasma resistant polymer prepared from a mixture containing a polymerization material and a polycondensation product of a partially hydrolyzed chelated metal oxide precursor. In yet another embodiment, the present invention relates to a microelectronic device comprising an oxygen plasma resistant polymer prepared from a mixture containing a polymerization material and a polycondensation product of a partially hydrolyzed chelated metal oxide precursor.