Abstract: The invention is an improved electrooptic assembly which comprises an electrooptic device mounted on a header and enclosed by a cover with a light-transmissive window mounted therein. The header includes a base plate with two major surfaces and a minor surface connecting the major surfaces with a segment of the cover attached to the minor surface. The minor surface is non-perpendicular to the major surfaces, thus allowing adjustment of the position of the window to achieve optimum emission or detection.

Abstract: A die bonder for bonding a semiconductor die to a substrate is disclosed. The die bonder comprises a support assembly within a frame, which assembly supports an arm. Attached to said arm is a means for holding a die, e.g. a vacuum collet. A variable electrical scrubbing means comprises a plunger which oscillates reciprocally within an electromagnetic coil and contacts the arm, or a tab integral with said arm. This provides a corresponding uniform scrubbing action, perpendicular to said arm in the plane of the interface between the die and the substrate, between a die held by the holding means and a solder material interposed between the die and substrate.

Abstract: An improved method of selectively depositing coatings onto bodies of semiconductor material employs as a protective mask an alkyl ester of a sulfosuccinate salt. The mask material is applied to areas which are to be kept free of the coatings. The overspray of a desired coating, onto the protective mask is deposited in a cracked, non-continuous manner, as opposed to the smooth crystalline layer being deposited over the semiconductor body. This overspray coating can be readily removed.

Abstract: A multi-emitter semiconductor electroluminescent device includes a stud having a mounting block on a surface thereof and a cover extending over the mounting block and secured to the stud. The mounting block has a plurality of surfaces which are angled toward a common point. A separate electroluminescent semiconductor element is mounted on each of the surfaces of the stud and have light emitting surfaces which face toward the common point. The electroluminescent elements are electrically connected to lead wires so that they can be operated either individually or simultaneously. An optical fiber extends through the cover and has one end directly over the common point so that the light emitted from all of the electroluminescent elements will enter the end of the optical fiber and propagate along the fiber.