Abstract: In the high-frequency module of the present invention, an insulating resin is formed so as to seal a high-frequency semiconductor element mounted on a surface of a substrate and further to seal electronic components. Furthermore, a metal thin film is formed on the surface of the insulating resin. This metal thin film provides an electromagnetic wave shielding effect.
Type:
Grant
Filed:
October 6, 2004
Date of Patent:
October 24, 2006
Assignee:
Matsushita Electric Industrial Co., Ltd.
Abstract: A binding cord for a motor for an electric vehicle includes a braided round cord of eight or more strands using a multifilament strand made of synthetic fibers having a melting point or a decomposition temperature at 280° C. or more. The binding cord has oil resistance at high temperatures of 50% or more, the oil resistance at high temperatures being represented by the following formula: oil resistance at high temperatures (%)=(T?/T)×100. Here, T denotes a tensile strength of the binding cord before treatment and T? denotes a tensile strength of the binding cord after the treatment. The tensile strength is measured in accordance with JIS L1013-8.5.1, and the treatment is carried out in such a manner that the entire binding cord is put into a closed container containing a mixture of 5 weight % of water and 95 weight % of automatic transmission fluid, followed by heating the container so that a temperature of the mixture is maintained at 150° C. for 1,000 hours.