Abstract: A disk drive suspension interconnect, and method therefor. The interconnect has a metal grounding layer, a metal conductive layer and an insulative layer between the metal grounding layer and the conductive metal layer. A circuit component such as a slider is electrically connected to the conductive layer along a grounding path from the circuit component and the conductive layer to the metal grounding layer through an aperture in the insulative layer. For improved electrical connection a tie layer is provided through the insulative layer onto the grounding layer in bonding relation with the ground layer. A conductor is deposited onto both the conductive metal layer and the tie layer in conductive metal layer and tie layer bonding relation, and the circuit component is thus bonded to the grounding layer by the conductor.

Abstract: A head suspension assembly couples a baseplate to a rotatable load through a planar triangular piezo microactuator for effecting hingeless rotation of the load. The microactuator expands, responsive to an excitation voltage, with greater magnitude in one direction than in another direction normal to the first direction, resulting in an angular movement of the hypotenuse thereby rotating the load. The upper surface of the microactuator is grounded to a bottom surface of the baseplate or load beam to position the microactuator lead connection surface closest to the load to facilitate trace routing. A load beam grounding surface may be raised to accommodate the microactuator and fix the lead connection surface on a common plane with the unraised surface to further minimize trace routing and provide access for bonding the trace to the load beam.