Patents Represented by Attorney, Agent or Law Firm Ire D. Blecker
  • Reworking of a ball grid array module
    Patent number: 6227434
    Abstract: A method for reworking a Ball Grid Array electronic module by removing the solder balls from the substrate surface after one or more of the connections have been detected to be damaged. The module is immersed in a water soluble oil bath and heated to the melting point. Then a rotating brush, with the rotating axis perpendicular to the substrate plane, removes the solder balls and the solder material particles while the module is still immersed in the fluid.
    Type: Grant
    Filed: March 22, 1999
    Date of Patent: May 8, 2001
    Assignee: International Business Machines Corporation
    Inventors: Luigi Bassi, Michele Monopoli, Paolo Spinzi, Danilo Villa