Abstract: A memory circuit incorporates a differential sense amplifier to be utilized in conjunction with a memory array comprised of a plurality of memory cells each containing a single transistor. A high slew rate differential input signal is applied to the sense amplifier based upon the binary data stored in an addressed memory cell. This is accomplished by pre-charging the selected bit line and a reference bit line, and then selecting the word line of the memory cell to be read, while causing the reference memory cell to conduct. The differential voltage between the selected bit line and the reference bit line is then sensed to determine the state of the data stored in the selected memory cell. The ratio of currents through the selected bit line and the reference bit line is selected to be other than one, in order to achieve a rapid differential voltage swing, and rapid reading of the data stored within the selected memory cell.

Abstract: A method and structure for forming in an EEPROM memory transistor a tunnel dielectric region having an extremely small surface area. A floating gate region is formed in the conventional manner above a gate dielectric layer. The drain region is exposed utilizing photolithographic techniques and the gate dielectric removed therefrom. A thin layer of tunnel dielectric is then formed on the exposed drain region. A thin layer of polycrystalline silicon is then formed and etched in order to create very narrow floating gate extensions of polycrystalline silicon along the edge of the previously formed floating gate. The floating gate extension formed in this manner which overlies the drain region is separated from the drain region by thin tunnel dielectric. A dielectric is then formed on the device in order to provide a dielectric over the drain region which has a greater thickness than the tunnel dielectric underlying the floating gate extension.