Patents Represented by Attorney, Agent or Law Firm Ivan J. Mlachak
  • Patterned die attach and packaging method using the same
    Patent number: 7939376
    Abstract: A semiconductor die is attached to a packaging substrate by a patterned layer of conductive metal that includes voids. The voids provide a space into which the metal may expand when heated in order to avoid placing mechanical stress on the bonds caused by mismatches in the thermal coefficients of thermal expansion of the die, the conductive metal bond layer and the substrate. An additional coating of conductive metal may be flowed over the bond lines to reinforce the bonds.
    Type: Grant
    Filed: August 6, 2010
    Date of Patent: May 10, 2011
    Assignees: The Boeing Company, Auburn University
    Inventors: Leora Peltz, Wayne Johnson
  • Digital cancellation mark
    Patent number: 6694874
    Abstract: A method is disclosed for providing a pictorial cancellation mark that may be applied to the postage indicia on a mailpiece. The pictorial cancellation originates as a digital image that is then printed through a printer on the mailpiece. This invention takes advantage of the technology now available in digital printing techniques to vary the pictorial cancellation through a variety of color, sizes, shapes, and images. Pictorial cancellations may thus be individualized for markets, applications, and unique purposes.
    Type: Grant
    Filed: September 4, 2002
    Date of Patent: February 24, 2004
    Assignee: The United States Postal Service
    Inventor: Khalid Hussain