Abstract: A polyvinyl chloride surface, such as plasticized polyvinyl chloride telephone cord jacket, is coated with a coating formulation comprising a medium molecular weight methyl methacrylate copolymer, cellulose acetate butyrate and a carbalkoxy benzyl phthalate plasticizer. The coating affords good adhesion, fast drying and stain resistance.
Type:
Grant
Filed:
March 3, 1980
Date of Patent:
July 21, 1981
Assignees:
Western Electric Company, Inc., Bell Telephone Laboratories, Inc.
Inventors:
Donald E. Lueddecke, John J. Mottine, Jr., William C. Vesperman
Abstract: An electronic device such as an integrated circuit is encapsulated with a silicone resin formulation comprising a polysiloxane having a cryptate ether as part of the backbone of the polymer chain for preventing migration of cations, e.g., sodium and potassium.
Abstract: An electronic device having a silicone encapsulant includes a 12-crown or 15-crown ether in the encapsulant for preventing migration of sodium or potassium ions.
Abstract: The method of depositing a metal on a surface especially suitable for the manufacture of printed circuit boards includes coating the surface with a sensitizing solution comprising an inaqueous solvent solution, a reducible salt of a non-noble metal, a salt of 2,7 anthraquinone disulfonic acid and a polyol type secondary reducing agent such as sorbitol. The coated surface is then dried and the dried surface may be stored for extended periods of time before further processing which consists of imaging the sensitized surface with ultraviolet light and electrolessly plating a metal over the imaged surface.
Type:
Grant
Filed:
January 2, 1980
Date of Patent:
May 19, 1981
Assignee:
Western Electric Company, Inc.
Inventors:
William M. Beckenbaugh, Patricia J. Goldman, Ted D. Polakowski, Jr.
Abstract: A method of selectively depositing a metal on a surface of a substrate is disclosed. A suitable substrate is selected and a surface is treated with a reducing agent selected from the group consisting of (a) hydrazine, (b) a substituted hydrazine having the structural formula ##STR1## where R.sub.1 is an organic radical selected from the group consisting of alkyl, cycloalkyl, aryl, alkaryl, aralkyl, alkoxy, aryloxy and heterocyclic radicals and R.sub.2, R.sub.3 and R.sub.4 are the hydrogen radical or are the same as R.sub.1, and (c) a mixture of the foregoing. The reducing agent treated surface is selectively exposed to a source of ultraviolet radiation to render a selected area thereof incapable of reducing an activating metal species and to delineate an unexposed area so capable. The selectively radiation-exposed surface is treated with an activating metal species to activate the delineated, unexposed area.
Type:
Grant
Filed:
August 15, 1977
Date of Patent:
April 14, 1981
Assignee:
Western Electric Co., Inc.
Inventors:
William M. Beckenbaugh, Michael A. De Angelo
Abstract: A filter assembly for an extrusion apparatus comprises a stationary filter having a flat, hard surface and slidable means having a plurality of apertures for both accumulating filtered debris and cleaning the filter surface when the debris is removed by sliding a clogged slide aperture out of position while replacing it with a clean aperture.
Abstract: A mask for selectively transmitting therethrough a desired light radiant energy is disclosed. The mask comprises a stress-relieved, essentially dimensionally stable base, comprising a copolymer of tetrafluoroethylene and hexafluoropropylene, which is capable of transmitting therethrough the light radiant energy. A blocking film is deposited on at least a portion of the base for blocking the transmission of the light radiant energy through the portion of the base.
Abstract: A printed circuit board is formed from a metal-clad substrate by applying a solvent-free, non-dryable ink in a predetermined pattern on the substrate, dusting powdered resin over the surface, removing any resin powder not retained by the ink from the surface, heating the substrate having the ink powder thereon to a temperature so as to fuse the powdered resin to form a strippable resist, etching the uncoated portion of the metal laminate and stripping the resist subsequent to etching.
Abstract: A method of rendering an ink, selected from the group consisting of an oil-modified alkyd ink and a drying oil ink, strippable from a surface, upon which it is applied and dried, is disclosed. The method comprises applying to the printed ink, prior to the drying thereof, a modifying powder comprising a petroleum resin.
Abstract: A method of repairing pin holes in a defective photomask such as one comprising a patterned chromium film on a glass substrate comprises depositing an adhesion promoting film such as siloxane on the surface of the photomask, then depositing a solvent soluble layer such as a photoresist layer over the adhesion promoting layer, a window is then formed through the layers and underlying photomask in the area of the pin hole by burning through these layers by means of a laser. The exposed areas of the window are etched and a metallic film is deposited over the exposed surfaces. Finally, the photomask is treated with solvent for removing the solvent soluble photoresist which also causes the metal film deposited thereon to be removed in all areas except the area of the window.
Abstract: A thermal gradient zone melting technique is provided for eliminating distortion of the migrated metal pattern by including a peripheral ring of the metal adjacent the edge of the semiconductor wafer.
Abstract: A method of rendering an ink, selected from the group consisting of an oil-modified alkyd ink and a drying oil ink, strippable from a surface, upon which it is applied and dried, is disclosed. The method comprises applying to the printed ink, prior to the drying thereof, a modifying powder comprising a petroleum resin.
Abstract: A method of fabricating a printed circuit board is disclosed. The method comprises forming a patterned etch resist layer on a metal substrate and selectively etching the substrate to form a through hole with non-linear undercut walls. The etched metal substrate having the resist layer thereon is then coated with a dielectric powder to form a dielectric coat on the substrate having a sufficient through hole edge coverage.
Abstract: A method for depositing a metal on a surface is disclosed. The method comprises treating the surface with a sensitizing solution comprising at least a reducible salt of a non-noble metal and a radiation-sensitive reducing agent for the salt to form a sensitized surface. The sensitized surface is exposed to a source of light radiation to reduce the metal salt to a reduced metal salt species. Either or both of the preceding sensitizing or radiation exposing steps is restricted to a selected pattern on the surface to form a catalytic real image capable of directly catalyzing the deposition of a metal thereon from an electroless metal deposition solution. The catalytic real image is treated with a stabilizer comprising (a) a reducing agent for the non-noble metal ions of said reducible salt, (b) a complexing agent and (c) an accelerator to at least stabilize the catalytic real image.
Abstract: A cured epoxy polymer having improved adhesive properties is disclosed. The epoxy polymer is the reaction product of a mixture comprising a resin component comprising (a) a diglycidyl ether based upon linoleic dimer acid, (b) an elastomerically modified epoxy resin blend and (c) a diglycidyl ether of bisphenol A and/or bisphenol F and a suitable curing agent. The reaction mixture is heated at a suitable temperature for a period of time sufficient to attain a full cure of the epoxy.