Abstract: An insert for use in a ball nose end mill is provided that includes an insert body having a top wall, a bottom wall, and at least one arcuate side wall. An arcuate cutting edge is defined at an intersection between the top and side walls that includes a plurality of sinusoidal undulations for reducing cutting forces, and vibration, and enhancing the breaking and removal of chips removed from a workpiece during a cutting operation. An end portion of the insert crosses the axis of rotation when the insert is mounted in the seat of an end mill body, and the undulations reduce the considerable shear forces applied to the cutting edge at this location. The cutting edge has a profile which follows the contour of a sphere to permit machining a rounded cut. The side wall of the insert body includes an upper relief portion disposed directly under the cutting edge, with a relief angle for preventing the undulations from making unwanted striations or tool marks in the sidewalls of the rounded cut.

Abstract: The invention is an automated solder joint inspection system for determining the quality of a specular soldered joint through examination of the shape of the joint surface using a series of point light sources and the associated highlight reflections from the joint surface. The light from point light sources, which is directed toward the solder joint, is reflected in a pattern from the solder joint to an array of light responsive transducers from at least one location. Utilizing the intensity values from the light responsive transducer array, the surface orientation of the solder joint at a number of points is determined. The solder joint is evaluated in one of two ways. In one way, using known surface features of solder joints along with curve fitting techniques, a series of grid maps is mathematically interpreted to reconstruct the solder joint surface.

Abstract: The invention is an improved integrated circuit chip assembly which provides enhanced heat transfer from active electronic devices of the integrated circuit by significantly reducing the thickness of the substrate and providing the necessary structural support through a thermally conducting spacing segment between the substrate and a ground plane in the region of the active electronic devices. This improvement further permits added flexibility in the design of transmission lines by permitting adjustment of the distance between the transmission line and the ground plane and furthermore by permitting the introduction of a second dielectric material such that the impedance of the transmission line may be controlled.

Abstract: A solderless printed wiring board module for receiving and securing surface mounted solderless electronic component carrier and electronic components without carrier upon a printed wiring board, the module also providing a heat transfer path to a surface away from the printed wiring board and the module further adaptable to electrical and mechanical attachment to similar modules placed adjacent to said module to form a multi-module assembly.