Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a post, a base and a ceramic block. The post extends upwardly from the base into an opening in the adhesive, the base extends laterally from the post and the ceramic block is embedded in the post. The semiconductor device overlaps the ceramic block, is electrically connected to the conductive trace and is thermally connected to the ceramic block. The adhesive extends between the post and the conductive trace and between the base and the conductive trace. The conductive trace provides signal routing between a pad and a terminal.

Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The semiconductor device is electrically connected to the conductive trace and thermally connected to the heat spreader. The heat spreader is aluminum and includes a post and a base. The post extends upwardly from the base into an opening in the adhesive, and the base extends laterally from the post. The adhesive extends between the post and the conductive trace and between the base and the conductive trace. The conductive trace includes a silver coating and a copper core and provides signal routing between a pad and a terminal.

Abstract: A baby trailer safety structure includes a safety block affixed to one sidebar of the bottom frame unit of the baby trailer opposite to the other sidebar that is mounted with a trailer bar. The safety block has a sloping peripheral wall with an arc face to prohibit a young child carrying in the baby trail from standing up on the associating sidebar to collapse the baby trailer, enhancing the safety level of the baby trailer.

Abstract: A guide toy vehicle is used for obtaining related knowledge of exhibit in a pleasant and interactive way. Guidance materials are transferred between different guidance systems through a wireless network. Thus, a user can have a wide, easy and effective learning.

Abstract: A method of making a semiconductor chip assembly includes providing a thermal post, a signal post, a base and a terminal, mounting an adhesive on the base including inserting the thermal post into a first opening in the adhesive and the signal post into a second opening in the adhesive, mounting a conductive layer on the adhesive including aligning the thermal post with a first aperture in the conductive layer and the signal post with a second aperture in the conductive layer, then flowing the adhesive upward between the thermal post and the conductive layer and between the signal post and the conductive layer and downward between the base and the terminal, solidifying the adhesive, providing a conductive trace that includes a pad, the terminal and the signal post, wherein the pad includes a selected portion of the conductive layer, mounting a semiconductor device on a heat spreader that includes the thermal post and the base, electrically connecting the semiconductor device to the conductive trace and therma

Abstract: An ultrasonic atomization circuit comprises a driving signal generating unit to generate an ultrasonic driving signal, a power unit to amplify and transmit the ultrasonic driving signal to a piezoelectric ceramic lamination, and a buffering unit connecting to the driving signal generating unit and the power unit to reduce the effect by the load of the power unit to the driving signal generating unit. The present invention is directed to provide an atomization device using the above ultrasonic atomization circuit. For the ultrasonic atomization circuit being disposed between the power unit and the driving signal generating unit, the ultrasonic atomization circuit can reduce the effect by the disperse circuits and reactance to the driving signal generating unit, meanwhile need less units and be easy to test.

Abstract: Disclosed is a method for bonding stainless steel to aluminum oxide. The method includes the steps of providing a first substrate of the stainless steel, filling solder in the first substrate, providing a second substrate of the aluminum oxide, filling solder in the second substrate, providing a net, pressing the net, locating the net between the first and second substrates to form a laminate and clamping the laminate, locating the laminate in a vacuum oven, increasing the temperature in the vacuum oven, retaining the temperature in the vacuum oven, and decreasing the temperature in the vacuum oven.

Abstract: A method for continuous and efficient casting roll of magnesium alloy plates including providing plural induction furnaces, resistance furnace, casting roll and rollers; adding metal elements into the induction furnaces, the metal elements comprising Mg ingots or Mg alloy, the metal elements being smelted in the induction furnaces and then flow into the resistance furnace; controlling temperature of the Mg melt in the resistance furnace, wherein there are at least two temperature controlling areas communicated with each other, and a difference of temperatures is constant; transferring the Mg melt into biting area through a transferring pipe and modeling the mg melt into Mg plate, the temperature of the Mg melt into the biting area being 690±10° C.; Rolling the Mg plate in the rollers and each band of the rollers having a working temperature 250˜350° C., and the difference of temperature is ±10° C.

Abstract: An oval transmission structure utilizes lower ends of swaying moving shafts at two sides thereof to pivot to front ends of push-pull shafts, whose front portions slope to a determined angle. Rear portions of the push-pull shafts offer treadle frames for treadles to dispose with feet. Rear portions of the push-pull shafts further offer a track frame. An assistant device provides a sliding block with a fixing bolt superimposed at a side of the lower portion of the swaying moving shaft. An attached shaft pivoted to a side of the sliding block connects to an axle bolt of a transmission shaft, whose front end axially connects to a crank, whose rear end serially connects to a track wheel and whose middle determined position disposes a sliding wheel thereunder. The reciprocation brought about by the feet, the two cranks axially trigger the front ends of the two transmission shaft for achieving a relative oval action.

Abstract: A light-trapping layer is integrated into a thin-film solar cell. It is integrated as a light-inlet layer, an intermediate layer or a shaded layer with nano-particles embedded in a transparent or non-transparent conductive film. Thus, light stays longer in an absorption layer with photocurrent increased; defects of interface between the absorption layer and the nano-material are decreased; anti-reflective effect to inlet light is enhanced; and a good integrity and a good reliability for long-time light-shining are obtained.

Abstract: An anti dumping switch includes a circular and hollow housing, a bottom surface connected to the housing, a first switch end, a second switch end, a bush, and two balls, the housing and the bottom surface cooperatively defining a accommodating space, the first switch end and the second switch end both extending into the accommodating space through the bottom surface and fixed in the bottom surface, the balls being received in the accommodating space.

Abstract: A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a thermal post and a base. The conductive trace includes a pad, a terminal and a signal post. The semiconductor device extends into a cavity in the thermal post, is electrically connected to the conductive trace and is thermally connected to the heat spreader. The thermal post extends upwardly from the base into a first opening in the adhesive, and the signal post extends upwardly from the terminal into a second opening in the adhesive. The conductive trace is located outside the cavity and provides signal routing between the pad and the terminal.

Abstract: A quick-release structure of a toilet cover hinge includes a fixing bolt, a locking base, and a lid. To assemble, the present invention is coupled to a toilet cover. The fixing bolt is inserted into and engaged with a elongated engaging hole, and a stopping block is to press against the bolt head, which locks the toilet seat to the fixing bolt. To disassemble, the user places their fingers into arched notches of the locking base to pull the lid up and to disassemble the toilet cover for replacement or cleaning; the fixing bolt does not need to be unscrewed from the toilet bowl to remove the toilet seat. To reassemble, the locking base directly engages with the fixing bolt, which provides for a quick and convenient assembly and disassembly of the toilet seat.

Abstract: A simplified method for fabricating a solar cell device is provided. The solar cell device has silicon nanowires (SiNW) grown on an upgraded metallurgical grade (UMG) silicon (Si) substrate. Processes of textured surface process and anti-reflection thin film process can be left out for further saving costs on equipment and manufacture investment. Thus, a low-cost Si-based solar cell device can be easily fabricated for wide application.

Abstract: A method of making a semiconductor chip assembly includes providing first and second posts, first and second adhesives and a base, wherein the first post extends from the base in a first vertical direction into a first opening in the first adhesive and is located within a periphery of the second post, the second post extends from the base in a second vertical direction into a second opening in the second adhesive and the base is sandwiched between and extends laterally from the posts, then flowing and solidifying the adhesives, then providing a conductive trace that includes a pad and a terminal, wherein the pad extends beyond the base in the first vertical direction and the terminal extends beyond the base in the second vertical direction, providing a heat spreader that includes the posts and the base, then mounting a semiconductor device on the first post, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.

Abstract: A technique of fabricating a medium-high temperature CO2 sorbent of layered nano-carbonate is provided. A CO2 sorbent is fabricated. The sorbent captures CO2 at a medium-high temperature above 600° C. Calcium acetate is introduced for making a nano-scale layered double hydroxide (LDH). The layered structure is used for templated synthesis. The sorbent has an initial conversion rate above 90%; and the conversion rate remains the same even after 100 times of carbonation/de-carbonation cycles.

Abstract: A buffer board for a treadmill includes a bamboo strip portion and an endurable slide plate. The bamboo strip portion is composed of at least one longitudinal bamboo strip and at least one transverse bamboo strip. The longitudinal bamboo strip and the transverse bamboo strip are crosswise knitted to constitute a woven bamboo plate. The woven bamboo plate can be stacked one by one to constitute a stack of woven bamboo plates in a desired thickness for enhancing the strength of the buffer board. The longitudinal bamboo strips connected side by side and the transverse bamboo strips connected side by side are stacked up to constitute a laminated bamboo board. The upper woven bamboo plate or the laminated bamboo board is attached with the endurable slide board. After being applied with a press force, the surface of the endurable slide board is formed with concave-convex massage pattern according to the pattern of the woven bamboo plate or the laminated bamboo board.